Recent Changes in ATLAS/PUUKA Web retrieved at 02:17 (GMT)
RD53 A collection of links to useful resources for the RD53 chip Manual RD53A Manual.pdf: RD53 Manual v3.14 specification document testing meetings testing Twiki...
The single chip card usually has a cut out below the FE I4A chip to facilitate Sr 90 source tests. The FE I4A is mounted on a 0.5mm Al plate that is glued to the SSC...
Module Flex Details of the UK quad flex to work with the FEI4 quad assemblies. These will have the correct tab orientation to be useable for the endcap ring structure...
Welcome to the 1 web Available Information This Twiki page is intended for gathering all information on the ATLAS upgrade pixel work. Sharepoints: WP1 (Pixel...
Module Assembly Details of module assembly are given here Single chip card Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are...
AUW/ITK week 2017 November AUW https://indico.cern.ch/event/558935/ September ITK week 18th 22nd June ITK week 26th 30th March...
RichardBates 2010 12 16 Sensors Connectivity Modules Connectivity
Robotic pick and place module assembly November 2016 presentation re: pixel module assembly using a gantry positioning system, see https://indico.cern.ch/event/...
Manual Glue Stamping The flex to assembly attachmenet can be performed with a glue stamp to transfer the glue and to vertical stamp to pick up the items to attach...
Silicon sensors with various pixel geometries adapted for a common readout ASIC Link to Publication: http://iopscience.iop.org/1748 0221/9/11/C...
Glue Stencil A set of jigs have been made to hold the pixel assembly, apply glue via a stencil to the back of the assembly and then lower the flex to the assembly...
Rice Paper method The jig set is very similar to that used for the stencil method. The major differences is that a layer of rice paper is loaded with adhesive and...
Useful workpackage links: site meetings Vidyo portal Modules Our FEI4 wafers Wafer Probing Module Assembly Assemblies...
Services Electrical services The elecrical services have been re desgned to take the data off the ring tape and to include DCS. This includes a re design of the...
Older Module flex versions This is the list of the older quad module flexes Flex design files : version Dec 2014 (v1.11) These are the flex hybrids that will be manufactured...
Older Module flex versions This is the list of the older quad module flexes Flex design files : version Dec 2014 (v1.11) These are the flex hybrids that will be manufactured...
SCCB.docx: Document with set up for direct powering FE I4B SingleChipCard AE.pdf: PDF of design PCBBonds PCBDesign.pptx: Bonding diagram with direct powering...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
Irradiations Here are collected details of the irradaitions for sesnors and modules. Facilities B`ham Paul Dervan and Phil Allport are in charge of this activity...
Pixel Weekly vidyo/phone meetings Thursdays at 10:00 am (UK time) portal or Vidyo portal In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay...
RichardBates 2011 01 21 Useful Twikis IBL https://twiki.cern.ch/twiki/bin/viewauth/Atlas/IBL USBPIX http://icwiki.physik.uni bonn.de/twiki/bin/view/Systems/UsbPix...
CERN Pixel VI Mini Production summary of IVs CP6 summary.pdf: CPVI IV summary mini production Tracking wafer through the process CP6 3164 6 wafer level...
CO2 blow off systems in WP2 Please use the space below to describe your system and how you use it. It would be helpful if you could include any modifications you have...
Multi Module Set up Pages detailing Glasgow`s multi module set up. The basic goal is to run multiple quad sensor modules simultaneously to test the electronic properties...
Module Cooling Pages detailing Glasgow`s multi module cooling tests. Tests of CO2 cooling prototypes. Basic set up Sensors Temperature Pressure Comments
2016 EoSC Article text. Comments
2016 data transmission Article text. Comments
2016 ring tape Article text. Comments
2016 Module hybird Article text. Comments
2016 Electrical services Details of the module, ring tape, data transmission and EoSC are found here for the 2016 design. 2016ModuleHybrid 2016RingTape 2016DataTransmission...
Glasgow RCE Info Set up See here for hardware set up: RCESetUp Running the RCE software Make sure to have set up symbolic link to RCE area, i.e. ln s /afs/phas...
RCE Set up: equipment connections Current RCE Set up (lab 345) ATCA 2 slot crate (Asis) 3COM Switch RCEs 8 chips possible to connect per RCE...
Thermal FEA Heat load from RD53A chip For the cooling capacity calculations and the FEA simulations the heat load of the RD53A chip is required. Power from the RD53A...
JoleenPater 2013 08 13 Thermal simulation See this page ThermalFEA Rectangular 3 quad Prototypes To put here: concept sketches assembly photos thermal...
Title Article text. Comments
PCB and wirebonding details for the various Assemblies are given here. Quad Flex v1.11 FLEX1 2.BPX: Quad Flex v1.11 Wire bonding program for BJ820 Zip file...
CO2 cooling The CO2 cooling of the pixel endcap system is being developed by Manchester in collabraotion with Glasgow, Sheffield and Lancaster. Some useful info on...
24th 25th June 2015 Manchester INDICO: https://indico.cern.ch/event/402689/ 10 11th December 2013 Manchester INDICO agenda, slides etc : https://indico.cern.ch/event...
Title Article text. Comments
WP2 meetings WP2 currently holds bi weekly phone/vidyo meetings on Tuesdays at 11:00, face to face meetings every six weeks or so, and occasional `overlap` meetings...
Wafer Probing Info Notes The following modifications should be made to the Probe Card (FE I4A only) Add solder jumper to right side of T1 Add solder jumper...
wafer VPB8WBH Map.pdf: Wafer map VPB8WBH.waprj: waprj file RichardBates 2013 11 27
This wafer is going to LETI for u bump deposition wafermap VMB8WDH.pdf: Wafer Map VMB8WDH.waprj: WAPRJ file RichardBates 2013 02 14
Open Rings Engineering Design page Please add drawings and information as needed to share Comments
Connectivity The UK are developing: Flip chip bump deposition at CEA Leti and flip chip at Advacam Thin chip assemblies with Advacam and CEA Leti...
Flip chip bump deposition at CEA Leti and Flip chip at Advacam The first phase of the development with CEA Leti was the deposition of copper pillars with SAC solder...
Thin chip assemblies To be able to flip chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re flow process. At present...
Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium flip chip process. The samples first have an under bump metal (UBM) layer deposited upon...
The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
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