Difference:
Connectivity_
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Revision 1
2014-10-20 -
RichardBates
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META TOPICPARENT
name="Tasks"
Connectivity
The UK are developing:
Flip-chip bump deposition at CEA Leti and flip-chip at Advacam
Thin chip assemblies with Advacam and CEA Leti
LETIPROJECT
Indium flip chip with RAL
--
Richard Bates - 2014-10-20
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