Difference: Face_to_face_meetings (1 vs. 7)

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24th-25th June 2015

Manchester

INDICO: https://indico.cern.ch/event/402689/

10-11th December 2013

Manchester

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10-11th December 2013

Manchester

INDICO agenda, slides etc : https://indico.cern.ch/event/286522/

19th September 2013

Liverpool

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INDICO agenda, slides etc | Vidyo Portal

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INDICO agenda, slides etc | Vidyo Portal

Wednesday 24th and Thursday 25th April 2013 - Project close-out and kick-off meeting

Glasgow

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Richard Plackett: Report on LHCb VELO Upgrade and Timepix development
Richard Bates: Plans for single-chip module

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Revision 52013-10-28 - JohnLipp

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Project close-out and kick-off meeting

Wednesday 24th and Thursday 25th April 2013

Glasgow

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19th September 2013

Liverpool

INDICO agenda, slides etc | Vidyo Portal

Wednesday 24th and Thursday 25th April 2013 - Project close-out and kick-off meeting

Glasgow

Link to the agenda page:

https://indico.cern.ch/conferenceDisplay.py?confId=247097

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Monday 22nd Feb 2012

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Monday 22nd Feb 2012

Glasgow

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Quad readout development: Jo Pater and Simon Brown
Discussion of future project: Craig Buttar

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Wednesday 16th March 2011

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Wednesday 16th March 2011

Manchester

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Talks given by:

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Craig Buttar: Introduction

Gianluigi Casse: Planar sensors IBL ansd beyond

Richard Bates: Modules

Tim Greenshaw: Layout and Mechanics

John Matheson: MCM_d at RAL

John Lipp: Bump bodning progress at RAL

Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

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Craig Buttar: Introduction
Gianluigi Casse: Planar sensors IBL ansd beyond
Richard Bates: Modules
Tim Greenshaw: Layout and Mechanics
John Matheson: MCM_d at RAL
John Lipp: Bump bonding progress at RAL
Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

Manchester

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Talks given by:

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Craig Buttar: Introduction

Cinzia Da Via: 3D sensors

Gianluigi Casse: Planar Sensors

Richard Bates: Modules

Timothy Greenshaw: Layout and Mechanics

John Lipp: Bump-bonding

Richard Plackett: Bump-bonding

Philip Allport: ATLAS upgrade organisation: IT-SC

Cinzia Da Via: IBL sensor prototyping programme

Philip Clark: Simulation

Wednesday 22 September 2010

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Craig Buttar: Introduction
Cinzia Da Via: 3D sensors
Gianluigi Casse: Planar Sensors
Richard Bates: Modules
Timothy Greenshaw: Layout and Mechanics
John Lipp: Bump-bonding
Richard Plackett: Bump-bonding
Philip Allport: ATLAS upgrade organisation: IT-SC
Cinzia Da Via: IBL sensor prototyping programme
Philip Clark: Simulation

Wednesday 22 September 2010

Glasgow

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Talks given by:

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Craig Buttar: Introduction

Cinzia Da Via: Status of 3D sensors and plans

Gianluigi Casse: Status of planar sensor development and plans

Anthony Affolder: Report on planar pixels meeting

Timothy Greenshaw: Layout studies and plans

Tim Jones: Report from LBL workshop and plans for mechanics

Mike Tyndel: Report on interconnects

Richard Plackett: Report on LHCb VELO Upgrade and Timepix development

Richard Bates: Plans for single-chip module

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Craig Buttar: Introduction
Cinzia Da Via: Status of 3D sensors and plans
Gianluigi Casse: Status of planar sensor development and plans
Anthony Affolder: Report on planar pixels meeting
Timothy Greenshaw: Layout studies and plans
Tim Jones: Report from LBL workshop and plans for mechanics
Mike Tyndel: Report on interconnects
Richard Plackett: Report on LHCb VELO Upgrade and Timepix development
Richard Bates: Plans for single-chip module

Revision 42013-05-01 - CraigButtar

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Project close-out and kick-off meeting

Wednesday 24th and Thursday 25th April 2013

Glasgow

Link to the agenda page:

https://indico.cern.ch/conferenceDisplay.py?confId=247097

Monday 22nd Feb 2012

Glasgow

Link to the agenda web page is:

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https://indico.cern.ch/conferenceDisplay.py?confId=179970

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https://indico.cern.ch/conferenceDisplay.py?confId=179970

Talks given by:

Introduction: Craig Buttar

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Monday 22nd Feb 2012

Glasgow

Link to the agenda web page is:

https://indico.cern.ch/conferenceDisplay.py?confId=179970

Talks given by:

Introduction: Craig Buttar
3D sensor status: Steve Watts
Quad module status: Richard Bates
Mechanics: Jo Pater
Status of bump bonding: John Lipp
Quad readout development: Jo Pater and Simon Brown
Discussion of future project: Craig Buttar

Wednesday 16th March 2011

Manchester

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Wednesday 16th March 2011

Manchester

Link to the agenda web page is:

http://agenda.hep.manchester.ac.uk/conferenceDisplay.py?confId=2678

Talks given by:

Craig Buttar: Introduction

Gianluigi Casse: Planar sensors IBL ansd beyond

Richard Bates: Modules

Tim Greenshaw: Layout and Mechanics

John Matheson: MCM_d at RAL

John Lipp: Bump bodning progress at RAL

Jo Pater: Towards a 4-chip module

Tuesday 23rd November 2010

Manchester

Link to the agenda web page is:

https://indico.cern.ch/conferenceDisplay.py?confId=114412

Talks given by:

Craig Buttar: Introduction

Cinzia Da Via: 3D sensors

Gianluigi Casse: Planar Sensors

Richard Bates: Modules

Timothy Greenshaw: Layout and Mechanics

John Lipp: Bump-bonding

Richard Plackett: Bump-bonding

Philip Allport: ATLAS upgrade organisation: IT-SC

Cinzia Da Via: IBL sensor prototyping programme

Philip Clark: Simulation

Wednesday 22 September 2010

Glasgow

Link to the agenda web page is:

https://indico.cern.ch/conferenceDisplay.py?confId=107974

Note that the password is upgrade

This is the kick-off meeting for the UK ATLAS upgrade Pixel project

Talks given by:

Craig Buttar: Introduction

Cinzia Da Via: Status of 3D sensors and plans

Gianluigi Casse: Status of planar sensor development and plans

Anthony Affolder: Report on planar pixels meeting

Timothy Greenshaw: Layout studies and plans

Tim Jones: Report from LBL workshop and plans for mechanics

Mike Tyndel: Report on interconnects

Richard Plackett: Report on LHCb VELO Upgrade and Timepix development

Richard Bates: Plans for single-chip module

-- RichardBates - 2011-01-21 \ No newline at end of file

Revision 12011-01-21 - RichardBates

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