Module Assembly

Details of module assembly are given here

Single chip card Assembly Details

SCCvFEI4B Some notes on assembly, including wirebond program, are given here for the single chip card Version for FE-14B

AssemblyDetails Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card Version for FE-14A

Quad Flex

A quad Module Flex has been designed.

Wirebonding details for Quad Flex v1.11 FLEX1-2.BPX.tga for BJ820

Radiation length

Note on the radiation length and calculations.

• Radiation_length_calculation_of_an_ITK_pixel_module.docx: Description of radiation length
• QuadX0.xlsx: Quad X0

Quad Flex to assembly attach

Several methods to attach the flex to the pixel assembly are under investigation.

These include

Glue stencil

Rice paper

Manual Glue stamping

Robotic glue stamping

Part Distribution for module Building

Excel Sheet with part distribution for module building.

• PixFlex_Items_-Distribution_Sheet.xlsx:

QA/QC

We have devloped a QA/QC procedure of the flex

• Flex_HybridQA-QC_Document_30112016.docx

• 20161208_IrradiationPlan.pdf: 20161208_IrradiationPlan.pdf
• https://docs.google.com/spreadsheets/d/1Xd1SWfz0UO2caJr1HirvmpbHe4plTNXs9grWGGTxaAM/edit#gid=0

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