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META TOPICPARENT |
name="Modules" |
Module Assembly |
| AssemblyDetails Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card Version for FE-14A
Quad Flex |
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> > | A quad Module Flex has been designed. |
| Wirebonding details for Quad Flex v1.11 FLEX1-2.BPX.tga for BJ820 |
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< < | Module Flex |
> > | Quad Flex to assembly attach
Several methods to attach the flex to the pixel assembly are under investigation.
These include
Glue stencil
Rice paper
Manual Glue stamping
Robotic glue stamping
Part Distribution for module Building
Excel Sheet with part distribution for module building.
QA/QC |
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> > | We have devloped a QA/QC procedure of the flex |
| Comments
META FILEATTACHMENT |
attachment="FLEX1-2.BPX.tga" attr="" comment="FLEX1-2.BPX." date="1480505635" name="FLEX1-2.BPX.tga" path="FLEX1-2.BPX.tga" size="1133542" user="RichardBates" version="1" |
META FILEATTACHMENT |
attachment="FE-I4B_SCC_PCB_v1.3_no_bot_HV_pads.zip" attr="" comment="FE-I4B_SCC_PCB_v1.3_no_bot_HV_pads.zip" date="1480505687" name="FE-I4B_SCC_PCB_v1.3_no_bot_HV_pads.zip" path="FE-I4B_SCC_PCB_v1.3_no_bot_HV_pads.zip" size="1340078" user="RichardBates" version="1" |
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> > |
META FILEATTACHMENT |
attachment="PixFlex_Items_-Distribution_Sheet.xlsx" attr="" comment="Sheet with part distribution for module building." date="1478263299" moveby="RichardBates" movedto="ATLAS/PUUKA.ModuleAssembly.PixFlex_Items_-Distribution_Sheet.xlsx" movedwhen="1480513698" movefrom="ATLAS/PUUKA.ModuleFlex.PixFlex_Items_-Distribution_Sheet.xlsx" name="PixFlex_Items_-Distribution_Sheet.xlsx" path="PixFlex_Items_-Distribution_Sheet.xlsx" size="11542" user="RichardBates" version="1" |
META FILEATTACHMENT |
attachment="Flex_HybridQA-QC_Document_30112016.docx" attr="" comment="" date="1480514696" name="Flex_HybridQA-QC_Document_30112016.docx" path="Flex_HybridQA-QC_Document_30112016.docx" size="94895" user="RichardBates" version="1" |
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