Thin chip assemblies

To be able to flip-chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re-flow process.

At present the option of preference is to use a glass handle wafer temperatorary bonded to the back side of the ROIC after the ROIC is thinned.

We are investigating the possibility to deposite additional layers on the backside of the thinned wafer to compensate the bow due to the front side stack on the ROIC.

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-- Richard Bates - 2014-10-20

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