Recent Changes in ATLAS/PUUKA Web retrieved at 09:26 (GMT)

RD53 A collection of links to useful resources for the RD53 chip Manual RD53A Manual.pdf: RD53 Manual v3.14 specification document testing meetings testing Twiki...
The single chip card usually has a cut out below the FE I4A chip to facilitate Sr 90 source tests. The FE I4A is mounted on a 0.5mm Al plate that is glued to the SSC...
Module Flex Details of the UK quad flex to work with the FEI4 quad assemblies. These will have the correct tab orientation to be useable for the endcap ring structure...
Welcome to the 1 web Available Information This Twiki page is intended for gathering all information on the ATLAS upgrade pixel work. Sharepoints: WP1 (Pixel...
Module Assembly Details of module assembly are given here Single chip card Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are...
AUW/ITK week 2017 November AUW https://indico.cern.ch/event/558935/ September ITK week 18th 22nd June ITK week 26th 30th March...
RichardBates 2010 12 16 Sensors Connectivity Modules Connectivity
Robotic pick and place module assembly November 2016 presentation re: pixel module assembly using a gantry positioning system, see https://indico.cern.ch/event/...
Manual Glue Stamping The flex to assembly attachmenet can be performed with a glue stamp to transfer the glue and to vertical stamp to pick up the items to attach...
Silicon sensors with various pixel geometries adapted for a common readout ASIC Link to Publication: http://iopscience.iop.org/1748 0221/9/11/C...
Glue Stencil A set of jigs have been made to hold the pixel assembly, apply glue via a stencil to the back of the assembly and then lower the flex to the assembly...
Rice Paper method The jig set is very similar to that used for the stencil method. The major differences is that a layer of rice paper is loaded with adhesive and...
Useful workpackage links: site meetings Vidyo portal Modules Our FEI4 wafers Wafer Probing Module Assembly Assemblies...
Services Electrical services The elecrical services have been re desgned to take the data off the ring tape and to include DCS. This includes a re design of the...
Older Module flex versions This is the list of the older quad module flexes Flex design files : version Dec 2014 (v1.11) These are the flex hybrids that will be manufactured...
Older Module flex versions This is the list of the older quad module flexes Flex design files : version Dec 2014 (v1.11) These are the flex hybrids that will be manufactured...
SCCB.docx: Document with set up for direct powering FE I4B SingleChipCard AE.pdf: PDF of design PCBBonds PCBDesign.pptx: Bonding diagram with direct powering...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
Irradiations Here are collected details of the irradaitions for sesnors and modules. Facilities B`ham Paul Dervan and Phil Allport are in charge of this activity...
Pixel Weekly vidyo/phone meetings Thursdays at 10:00 am (UK time) portal or Vidyo portal In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay...

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Topic revision: r1 - 2006-11-15 - TWikiContributor
 
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