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Characterisation of Single Devices in Glasgow University and the UKAssembly Details |
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Characterisation of Single Devices in Glasgow University and the UKAssembly Details |
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Characterisation of Single Devices in Glasgow University and the UKAssembly Details | ||||||||
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< < | Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card | |||||||
> > | SCCvFEI4B Some notes on assembly, including wirebond program, are given here for the single chip card Version for FE-14B AssemblyDetails Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card Version for FE-14A | |||||||
Deleted: | ||||||||
< < | AssemblyDetails | |||||||
Characterisation NotesUSING USBPIXChristian Gallrapp's Guide to USBPix |
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Characterisation of Single Devices in Glasgow University and the UKAssembly Details | ||||||||
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MPI Sensor | ||||||||
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> > | QUAD MODULEChip 2 CharacterisationQuadModuleCHIP2_18012013.pptx Threshold Tuning, Noise Occupancy, Crosstalk, Bump Yield QuadModuleCHIP2_25012013.pptx Threshold Fine-Tuning | |||||||
3DFBK7 | ||||||||
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> > |
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Characterisation of Single Devices in Glasgow University and the UKAssembly Details | ||||||||
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AssemblyDetails
Characterisation Notes | ||||||||
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< < | Christian Gallrapp Guide to USBPix | |||||||
> > | USING USBPIXChristian Gallrapp's Guide to USBPix | |||||||
2012-02-17_ChristianGallrapp_Introduction_to_USBPix.pdf | ||||||||
Added: | ||||||||
> > | VCal Scan InstructionsVCal_Scans.docxMaking a Primlist | |||||||
Changed: | ||||||||
< < | Kate's Noise Occupancy Scan and Source Scan Instructions | |||||||
> > | Making_a_Primlist.docx
Noise Occupancy Scan Instructions | |||||||
Noise_Occupancy_Scan_Instructions.docx | ||||||||
Added: | ||||||||
> > | Source Scan Instructions | |||||||
Source_Scans_Instructions.docx | ||||||||
Added: | ||||||||
> > | ||||||||
Basic Files Required For Characterising an Assembly | ||||||||
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< < | CONFIGURATION FILES | |||||||
> > | CONFIGURATION FILES | |||||||
Basic configuration file for starting tuning of an assembly: | ||||||||
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000_BASELINE_VCAL_CONFIG_all_assemblies.cfg.root | ||||||||
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< < | PRIMLISTS | |||||||
> > | PRIMLISTS | |||||||
Primlists are lists of scans which can be saved and executed automatically without further manual input. | ||||||||
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Assembly test data | ||||||||
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< < | Assembly5 | |||||||
> > | Assembly5 | |||||||
Changed: | ||||||||
< < | Assembly10 | |||||||
> > | Assembly10 | |||||||
Changed: | ||||||||
< < | Assembly14 | |||||||
> > | Assembly14 | |||||||
Changed: | ||||||||
< < | Assembly15 | |||||||
> > | Assembly15 | |||||||
Planar | ||||||||
Changed: | ||||||||
< < | Micron Liverpool MICRONCurves_2012.xlsx | |||||||
> > | Micron Liverpool | |||||||
Changed: | ||||||||
< < | MPI Sensor | |||||||
> > | MPI Sensor | |||||||
Deleted: | ||||||||
< < | MPI_IV.xlsx | |||||||
3D | ||||||||
Changed: | ||||||||
< < | FBK 7 IV Characteristics of the FBK 7 assembly: IV_Curve_FBK_200212.xlsx Details of noise characterisation of the FBK 7 assembly: FBK_Noise.pptx Further information on FBK 7: GE_FBK4_3D_07 | |||||||
> > | FBK7 | |||||||
-- RichardBates - 2012-02-22 | ||||||||
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> > |
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< < | These pages contain details of the characterization of single devices in the UK.
First off is some details on device characterization.
Device characterzation notes
| ||||||||||||||||||||||
> > | Characterisation of Single Devices in Glasgow University and the UKAssembly Details | ||||||||||||||||||||||
Some notes on assembly, including wirebond program and design of Al plate, are given here for the single chip card AssemblyDetails | |||||||||||||||||||||||
Added: | |||||||||||||||||||||||
> > | Characterisation NotesChristian Gallrapp Guide to USBPix 2012-02-17_ChristianGallrapp_Introduction_to_USBPix.pdf Kate's Noise Occupancy Scan and Source Scan Instructions Noise_Occupancy_Scan_Instructions.docx Source_Scans_Instructions.docxBasic Files Required For Characterising an AssemblyCONFIGURATION FILES Basic configuration file for starting tuning of an assembly: 000_BASELINE_CONFIG_all_assemblies.cfg.root Basic configuration file for VCal measurement of an assembly: (the primary address of your own Keithley must be correct for this to work) 000_BASELINE_VCAL_CONFIG_all_assemblies.cfg.root PRIMLISTS Primlists are lists of scans which can be saved and executed automatically without further manual input. | ||||||||||||||||||||||
Added: | |||||||||||||||||||||||
> > | Primlist containing all initial tests required when testing an assembly:
| ||||||||||||||||||||||
ROIC onlyWaferV6ABC1HChip50Planar from VTT | |||||||||||||||||||||||
Changed: | |||||||||||||||||||||||
< < | 15 single assemblies have been produced at VTT. These area detailed at Assemblies. | ||||||||||||||||||||||
> > | 15 single assemblies have been produced at VTT. These are detailed at Assemblies. | ||||||||||||||||||||||
Summaries and root data files for the assemblies tested are given under the assembly heading. | |||||||||||||||||||||||
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Assembly15 | |||||||||||||||||||||||
Added: | |||||||||||||||||||||||
> > | PlanarMicron Liverpool MICRONCurves_2012.xlsx MPI Sensor MPI_IV.xlsx | ||||||||||||||||||||||
3D | |||||||||||||||||||||||
Added: | |||||||||||||||||||||||
> > | FBK 7 IV Characteristics of the FBK 7 assembly: IV_Curve_FBK_200212.xlsx Details of noise characterisation of the FBK 7 assembly: FBK_Noise.pptx Further information on FBK 7: | ||||||||||||||||||||||
GE_FBK4_3D_07 -- RichardBates - 2012-02-22 | |||||||||||||||||||||||
Added: | |||||||||||||||||||||||
> > |
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AssemblyDetails | ||||||||
Added: | ||||||||
> > | ROIC onlyWaferV6ABC1HChip50 | |||||||
Planar from VTT15 single assemblies have been produced at VTT. These area detailed at Assemblies. | ||||||||
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Assembly5 | ||||||||
Added: | ||||||||
> > | Assembly10 Assembly14 Assembly15 | |||||||
3DGE_FBK4_3D_07 |
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| ||||||||
Deleted: | ||||||||
< < | They include 3D and planar devices. | |||||||
First off is some details on device characterization. Device characterzation notes | ||||||||
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AssemblyDetails | ||||||||
Changed: | ||||||||
< < | 3D | |||||||
> > | Planar from VTT | |||||||
Changed: | ||||||||
< < | GE_FBK4_3D_07
Planar | |||||||
> > | 15 single assemblies have been produced at VTT. These area detailed at Assemblies. Summaries and root data files for the assemblies tested are given under the assembly heading. | |||||||
Changed: | ||||||||
< < | MPI - ?? | |||||||
> > | Assembly test data | |||||||
Changed: | ||||||||
< < | Micron - ?? | |||||||
> > | Assembly5
3DGE_FBK4_3D_07 | |||||||
-- RichardBates - 2012-02-22 |
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Added: | ||||||||
> > |
3DGE_FBK4_3D_07PlanarMPI - ?? Micron - ?? -- RichardBates - 2012-02-22 |