25/07/2012

The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels.

6/6/2012

Some ideas of the irradition plan for the single chip assemblies

28/5/2012

4 more single chip and the first quad have been flip-chip bonded.

4/5/2012

Some worries about wire bonding. This is resolved.

20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

Sensor - Die attachment detail

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details Comments
Ass1 2873-18 CERN Pixel II SE4 (slim edge) 250x50 DC 300 V6ABC1H 15 200 VTT bumps, VTT UBM Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
Ass2 2873-18 CERN Pixel II SE3 (slim edge) 250x50 DC 300 V6ABC1H 8 200 VTT bumps, VTT UBM  
Ass3 2873-18 CERN Pixel II SC3 250x50 DC 300 V6ABC1H 10 200 VTT bumps, VTT UBM  
Ass4 2873-18 CERN Pixel II SC4 250x50 DC 300 V6ABC1H 11 200 VTT bumps, VTT UBM  
Ass5 2873-18 CERN Pixel II SC5 250x50 DC 300 V6ABC1H 16 200 VTT bumps, VTT UBM  
Ass6 2873-18 CERN Pixel II SC6 250x50 DC 300 V6ABC1H 17 200 VTT bumps, VTT UBM ROIC has a dirty backside (ahem!)
Ass7 2873-18 CERN Pixel II SC9 250x50 DC 300 V6ABC1H 33 200 VTT bumps, VTT UBM  
Ass8 2873-18 CERN Pixel II SC10 250x50 DC 300 V6ABC1H 34 200 VTT bumps, VTT UBM  
Ass9 2615-19 CERN Pixel IV SC3 500x25 DC 300 V6ABC1H 25 200 VTT bumps, VTT UBM  
Ass10 2615-19 CERN Pixel IV SC4 500x25 DC 300 V6ABC1H 27 200 VTT bumps, VTT UBM  
Ass11 2935-21 CERN Pixel IV SC3 500x25 DC 300 V6ABC1H 2 200 VTT bumps, VTT UBM  
Ass12 2935-21 CERN Pixel IV SC4 500x25 DC 300 V6ABC1H 41 200 VTT bumps, VTT UBM  
Ass13 2873-19 CERN Pixel II SE2 (slim edge) 250x50 DC 300 V6ABC1H 31 200 VTT bumps, VTT UBM  
Ass14 2873-19 CERN Pixel II SE1 (slim edge) 250x50 DC 300 V6ABC1H 37 200 VTT bumps, VTT UBM  
Ass15 2873-19 CERN Pixel II SC9 (production) 250x50 DC 300 V6ABC1H 38 200 VTT bumps, VTT UBM  
Ass16 2873-19 CERN Pixel II SC1 250x50 DC 300 VBABAXH 1 750 VTT bumps, VTT UBM  
Ass17 2873-19 CERN Pixel II SC2 250x50 DC 300 VBABAXH 2 750 VTT bumps, VTT UBM  
Ass18 2873-19 CERN Pixel II SC4 250x50 DC 300 VBABAXH 3 750 VTT bumps, VTT UBM  
Ass19 2873-19 CERN Pixel II SC5 250x50 DC 300 VBABAXH 6 750 VTT bumps, VTT UBM  
Ass20 2873-19 CERN Pixel II SC6 250x50 DC 300 VBABAXH 7 750 VTT bumps, VTT UBM  
Ass21 2615-19 CERN Pixel IV SC1 250x50 DC 300 VBABAXH 49 750 VTT bumps, VTT UBM  
Q1 2615-19 CERN Pixel IV Q4 #N/A DC 300 V6ABC1H 19, 20, 22, 24 200 VTT bumps, VTT UBM  
Q2 2935-21 CERN Pixel IV Q2 (slim edge) #N/A DC 300 VZABC8H 8, 9, 11, 14 750 VTT bumps, VTT UBM  
Q3 2935-21 CERN Pixel IV Q4 #N/A DC 300 VZABC8H 16, 18, 19, 20 750 VTT bumps, VTT UBM  
Q4 2935-21 CERN Pixel IV Q3 #N/A DC 300 VZABC8H 51, 53, 58, 33 750 VTT bumps, VTT UBM  
Q5 2433-14 CERN Pixel IV Q5 #N/A DC 300 VBABAXH 48, 38, 55, 47 750 VTT bumps, VTT UBM  
Q6 2433-14 CERN Pixel IV Q2 #N/A DC 300 VBABAXH 33, 18, 19, 22 750 VTT bumps, VTT UBM  
Q7 2433-14 CERN Pixel IV Q4 #N/A DC 300 VBABAXH 34, 43, 44, 42 750 VTT bumps, VTT UBM  
3072-3#8 3072-3 CERN Pixel V 8 250x50 DC 310 V6B8WUH 1 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#14 3072-3 CERN Pixel V 14 2000x25 DC 310 V6B8WUH 2 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#16 3072-3 CERN Pixel V 16 2000x25 DC 310 V6B8WUH 4 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#17 3072-3 CERN Pixel V 17 500x25 DC 310 V6B8WUH 13 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#19 3072-3 CERN Pixel V 19 500x25 DC 310 V6B8WUH 17 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#21 3072-3 CERN Pixel V 21 167x125 DC 310 V6B8WUH 27 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#23 3072-3 CERN Pixel V 23 167x125 DC 310 V6B8WUH 30 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#26 3072-3 CERN Pixel V 26 125x100 DC 310 V6B8WUH 18 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#28 3072-3 CERN Pixel V 28 125x100 DC 310 V6B8WUH 22 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#6 3072-4 CERN Pixel V 6 250x50 DC 310 V6B8WUH 32 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#8 3072-4 CERN Pixel V 8 250x50 DC 310 V6B8WUH 35 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#17 3072-4 CERN Pixel V 17 500x25 DC 310 V6B8WUH 38 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#19 3072-4 CERN Pixel V 19 500x25 DC 310 V6B8WUH 40 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#21 3072-4 CERN Pixel V 21 167x125 DC 310 V6B8WUH 45 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#23 3072-4 CERN Pixel V 23 167x125 DC 310 V6B8WUH 51 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#26 3072-4 CERN Pixel V 26 125x100 DC 310 V6B8WUH 53 750 Leti bumps, Advacam Ti/W/Pt UBM  
2433-15♯Q2 2433-15 CERN Pixel IV Q2 #N/A DC 300 VWB6IVH 25, 29, 32, 33 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15♯Q3 2433-15 CERN Pixel IV Q3 #N/A DC 300 VWB6IVH 36, 38, 42, 43 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15♯Q4 2433-15 CERN Pixel IV Q4 #N/A DC 300 VWB6IVH 44, 46, 50, 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2935-18♯Q2 2433-18 CERN Pixel IV Q2 #N/A DC 300 VWB6IVH 15, 16, 17, 24 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2935-18#Q4 2935-18 CERN Pixel IV Q4 #N/A DC 300 VMB8WDH 2, 7, 9, 10 750 Leti bumps, Advacam Ti/W/Pt UBM  
2615-18#Q2 2615-18 CERN Pixel IV Q2 #N/A DC 300 VMB8WDH 14, 15, 17, 18 750 Leti bumps, Advacam Ti/W/Pt UBM  
2615-18#Q3 2615-18 CERN Pixel IV Q3 #N/A DC 300 VMB8WDH 19, 24, 29, 30 750 Leti bumps, Advacam Ti/W/Pt UBM  
2615-18#Q1 2615-18 CERN Pixel IV Q1 #N/A DC 300 VMB8WDH 1, 31, 39, 43 750 Leti bumps, Advacam Ti/W/Pt UBM  
2935-18#Q1 2935-18 CERN Pixel IV Q1 #N/A DC 300 VMB8WDH (1&2)/V6B8WUH (3&4) 44, 45, 56, 57 750 Leti bumps, Advacam Ti/W/Pt UBM  
2935-18#Q5 2935-18 CERN Pixel IV Q5 #N/A DC 300 V6B8WUH 58, 41, 26, 57 750 Leti bumps, Advacam Ti/W/Pt UBM  
2433-15#SC1 2433-15 CERN Pixel IV SC1 250x50 DC 300 VWB6IVH 1 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15#SC3 2433-15 CERN Pixel IV SC3 500x25 DC 300 VWB6IVH 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15#SC5 2433-15 CERN Pixel IV SC5 250x50 DC 300 VWB6IVH 5 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2615-18#SC6 2615-18 CERN Pixel IV SC6 250x50 DC 300 VWB6IVH 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
14-07-24-S2 2873-8 CERN Pixel II SE3 250x50 DC 300       RAL In bumps (bond force: 20kg)  
14-07-25-S2 2873-8 CERN Pixel II SC2 250x50 DC 300       RAL In bumps (bond force: 10kg)  
14-07-25-S4 2873-8 CERN Pixel II SC12 250x50 DC 300       RAL In bumps (bond force 5kg)  
2873-25-S5 2873-25 CERN Pixel V 5 250x50 AC 310 VWB6IVH 7, 7, 7, 7 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S6 2873-25 CERN Pixel V 6 250x50 DC 310 VWB6IVH 6, 6, 6, 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S9 2873-25 CERN Pixel V 9 2000x50 DC 310 VWB6IVH 3, 3, 3, 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S10 2873-25 CERN Pixel V 10 2000x50 AC 310 VWB6IVH 13, 13, 13, 13 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S13 2873-25 CERN Pixel V 13 2000x25 AC 310 VWB6IVH 30, 30, 30, 30 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S14 2873-25 CERN Pixel V 14 2000x25 DC 310 VWB6IVH 31, 31, 31, 31 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S17 2873-25 CERN Pixel V 17 500x25 DC 310 VWB6IVH 54, 54, 54, 54 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S18 2873-25 CERN Pixel V 18 500x25 AC 310 VWB6IVH 46, 46, 46, 46 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S23 2873-25 CERN Pixel V 23 167x125 DC 310 VWB6IVH 53, 53, 53, 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S24 2873-25 CERN Pixel V 24 167x125 AC 310 VWB6IVH 47, 47, 47, 47 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S25 2873-25 CERN Pixel V 25 125x100 AC 310 VWB6IVH 42, 42, 42, 42 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S26 2873-25 CERN Pixel V 26 125x100 DC 310 VWB6IVH 39, 39, 39, 39 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15-SC2 2433-15 CERN Pixel IV SC2 50x250 DC 300 ABPJXGH 49 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL  
2433-15-SC3 2433-15 CERN Pixel IV SC3 25x500 DC 300 ABPJXGH 16 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL  

ROIC only on SCC

Wafer V6ABC1H Die 50

-- RichardBates - 2012-04-20

Topic attachments
I Attachment History Action Size Date Who Comment
Unknown file formatxlsx FlipChippedFE-I4-10.xlsx r1 manage 46.6 K 2012-05-03 - 12:34 RichardBates IVs for the 6 assemblies pre and post flip-chip
Unknown file formatxlsx FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx r1 manage 19.5 K 2012-04-27 - 11:31 RichardBates FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4
Unknown file formatpptx Pre_and_post_assembly_IVs_summary.pptx r2 r1 manage 903.9 K 2013-06-13 - 07:55 ThomasMcMullen  
Unknown file formatdocx Stock_Location_StatusOfAssemblies-3.docx r1 manage 99.8 K 2012-07-25 - 16:44 RichardBates Location of assemblies as of 25/7/2012
Unknown file formatdocx Stock_Location_StatusOfAssemblies.docx r1 manage 121.6 K 2012-06-06 - 15:43 RichardBates Status of Single chip Assemblies
Topic revision: r14 - 2014-09-30 - KennyWraight
 
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