Connectivity
The UK are developing:- Flip-chip bump deposition at CEA Leti and flip-chip at Advacam
- Thin chip assemblies with Advacam and CEA Leti
- LETIPROJECT
- Indium flip chip with RAL
Richard Bates - 2014-10-20
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Edit | Attach | Topic revision: r1 - 2014-10-20 - RichardBates
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