Recent Changes in ATLAS/PUUKA Web retrieved at 21:04 (GMT)
Indium Bumped Modules This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL. Indium bumps require pressure only to make...
wafer VUB6NCH Map.pdf: Wafer Map RichardBates 2013 11 27 VUB6NCH.waprj: Waprj file
wafer VIB62GH Map.pdf: Wafer Map VIB62GH.waprj: Waprj file RichardBates 2013 11 27
Wafer map wafer V7B8WTH Map.pdf: Wafer Map RichardBates 2013 07 03 V7B8WTH.waprj: Waprj file
This wafer is going to LETI for u bump deposition wafermap V6B8WUH.pdf: Wafer Map V6B8WUH.waprj: Waprj file RichardBates 2013 02 14
SLAC Testbeam May 2014 This page catalogues each experimental setup, GeoIDs and run numbers. For details on reconstruction see here. Enjoy! Quad5, 250x50 DUTs...
`Open Rings` Endcap Layout (Previously known by a number of different names e.g. `concentric diskettes`.) Motivation and Description A couple of talks showing the...
Pixel Endcaps in the LoI (Cartigny) Layout The drawings below show 3 possible types of pixel endcap disks in the LoI, or `Cartigny` layout of the upgraded inner tracker...
JoleenPater 2013 08 13 Stepped Geometry Prototype NB this prototype was shelved in 2013 when the Open Rings layout was adopted. Peter Sutcliffe`s drawings for a...
Title Article text. Comments
Title Article text. Comments
Title Article text. Comments
Reconstruction This page serves as a central hub for information on the reconstruction and analysis effort of UK Test Beam data. Versions of software in use:...
There are a number of FE I4 wafers A and B that belong to the UK for the ATLAS module upgarde project. Wafers wafer metal.gds.zip: FE I4A Top metal layer GDS...
wafer VJB8WGH Map.pdf: Wafer map RichardBates 2013 11 27
wafer VEB6NSH Map.pdf: Wafer map RichardBates 2013 11 27
wafer VTB8W7H Map.pdf: Wafer map RichardBates 2013 11 27
wafer VYB8XJH Map.pdf: Wafer map RichardBates 2013 11 27
wafer ABPJXGH Map.pdf: ABPJXGH Wafer Map RichardBates 2013 07 12
This wafer was broken during the wafer thinning process wafer VUAYCRH Map.pdf: Wafer map RichardBates 2013 11 26
Meetings Pixel Weekly Face to face meetings FEI 4 testing meeting (Mon @4.30pm CERN) Testbeam Analysis meeting (Tue @4pm CERN)
Under Construction
FEI 4 Documentation Documentation for FEI can be found at https://espace.cern.ch/atlas pixel upgrade elec/Final%20Design/Reference/ (NB: Requires cern id and...
Wafer map wafer VKB8WFH Map.pdf: Wafer Map RichardBates 2013 07 03
ThomasMcMullen 2013 03 08
wafer VWB6IVH Map.pdf: Wafer Map RichardBates 2013 06 13
VTT Assembly10 3200e 100V Tuned.cfg.root: Assembly 10 Configuration File: Threshold 3200e@ ToT8, 100V Det Bias VTT Assembly10 1600e 100V Tuned.cfg.root: Assembly...
VTT Assembly14 3200e 10V Tuned.cfg.root: Assembly 14 Configuation File: Threshold 3200e @ ToT8, 10V Det Bias Assembly14 3200e 10V ToT8 FastTuning.root: Assembly...
Assembly 5 Device IV after flip chip and mouting on the SCC. Assembly5 02082012.pptx: Presentation of scans performed on Assembly 5 VTT Assembly5 3200e 100V...
IV Curves of MPI Sensor MPI IV.xlsx KateDoonan 2012 12 18
IV Curves of Micron sensor MICRONCurves 2012.xlsx KateDoonan 2012 12 18
IV Characteristics of the FBK 7 assembly: IV Curve FBK 200212.xlsx Details of noise characterisation of the FBK 7 assembly: FBK Noise.pptx Further information on FBK...
This device was mounted on a single chip card, checked to be fine, and sent to CERN for testbeam in September 2012. RichardBates 2012 10 09
Unfortunately this assembly was broken due to an accident with the probe station. The detector of the assembly was being IVed on arrival in Glasgow, before wirebonding...
VTT Assembly15 3200e 100V Tuned.cfg.root: Assembly15 Config file 3200electrons ToT8 100V Det Bias VTT Assembly15 1600e 100V Tuned.cfg.root: Assembly15 Config...
This is a green chi. Sent to RAL. Prim List used to tune the chip $ Assembly14 Fast Tuning 3200e.prl.root: Data file from Prim List $ 2012 10 08 Wafer...
Wafer Statistics Wafer Code Wafer No Good Chips Comment V2AQMLH 33 X Wafer Probed, generating statistics AndrewStewart...
RichardBates 2011 04 16 See attachments for cool box drawing for EUDET telescope as of Sept2012, note this is not compatible with the QUAD module due as it is not...
JoleenPater 2012 02 16 SimonBrown 2012 02 23 This page contains information about the Data Multiplexer for the Pixel Modules. The Data Multiplexer is intended...
Wafer V2AQMLH FE I4A wafer delivered 27th of July 2012. Primary purpose: Development of wafer probe test. AndrewStewart 2012 07 31
27/7/2012 Some Red chips sent to RAL and MPI Die Status 3 2.xlsx: Die status as of 27/7/2012 14/7/2012 2 Green chips sent to glasgow for wafer probing Die...
ThomasMcMullen 2012 07 13
28/5/2012 Sensors chosen to flip chip in the second run are: From Pixel II (2873 18) SC9 RD50 guard IBL ganged pixels (baseline) SC10 RD50 guard IBL...
The wafer map Wafer V5ABC2H Map.bmp: picture of wafer map The Wafer test results Wafer V5ABC2H Results Summary.xls: Probe results Pictures of the wafer...
Wafer VBABAXH replace `dirty` wafer V5ABC2H Sent to VTT on 11th April 2012. Wafer VBABAXH Results Summary.xlsx: Wafer Map Data AndrewStewart 2012 04 11
The wafer map, not white spaces are untested. Wafer VZABC8H Wafermap.bmp: picture of wafer map RichardBates 2012 03 01
The details of this device can be found at https://twiki.cern.ch/twiki/bin/viewauth/Atlas/PixelUpgrade3DSystematicStudies#FBK Devices This device was then shipped...
This wafer has been on the probe station for longe than usual due to the testing of a new probe card. The dirt is a worry. The wafer will eiterh be replaced by a wafer...
IBL Testbeam e group for IBL testbeam: atlas ibl testbeam #64;cern.ch Testbeam runs 2 Testbeam runs have been performed at DESY using the EUDET telescope. Information...
AndrewBlue 2011 04 18
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