Flip-chip bump deposition at CEA Leti and Flip-chip at Advacam

The first phase of the development with CEA Leti was the deposition of copper pillars with SAC solder caps for the bumps.

The wafers are sent to Advacam for inspection, dicing and flip-chip connection.

-- Richard Bates - 2014-10-20

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Topic revision: r1 - 2014-10-20 - RichardBates
 
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