Backlinks to Modules in ATLAS/PUUKA Web (Search all webs)

Results from ATLAS/PUUKA web retrieved at 01:11 (GMT)

25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
JoleenPater 2012 02 16 SimonBrown 2012 02 23 This page contains information about the Data Multiplexer for the Pixel Modules. The Data Multiplexer is intended...
`Open Rings` Endcap Layout (Previously known by a number of different names e.g. `concentric diskettes`.) Motivation and Description A couple of talks showing the...
24th 25th June 2015 Manchester INDICO: https://indico.cern.ch/event/402689/ 10 11th December 2013 Manchester INDICO agenda, slides etc : https://indico.cern.ch/event...
Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium flip chip process. The samples first have an under bump metal (UBM) layer deposited upon...
Indium Bumped Modules This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL. Indium bumps require pressure only to make...
Irradiations Here are collected details of the irradaitions for sesnors and modules. Facilities B`ham Paul Dervan and Phil Allport are in charge of this activity...
ThomasMcMullen 2013 03 08
Module Assembly Details of module assembly are given here Single chip card Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are...
Module Cooling Pages detailing Glasgow`s multi module cooling tests. Tests of CO2 cooling prototypes. Basic set up Sensors Temperature Pressure Comments
Module Flex Details of the UK quad flex to work with the FEI4 quad assemblies. These will have the correct tab orientation to be useable for the endcap ring structure...
Multi Module Set up Pages detailing Glasgow`s multi module set up. The basic goal is to run multiple quad sensor modules simultaneously to test the electronic properties...
There are a number of FE I4 wafers A and B that belong to the UK for the ATLAS module upgarde project. Wafers wafer metal.gds.zip: FE I4A Top metal layer GDS...
Pixel Endcaps in the LoI (Cartigny) Layout The drawings below show 3 possible types of pixel endcap disks in the LoI, or `Cartigny` layout of the upgraded inner tracker...
Pixel Weekly vidyo/phone meetings Thursdays at 10:00 am (UK time) portal or Vidyo portal In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay...
JoleenPater 2013 08 13 Thermal simulation See this page ThermalFEA Rectangular 3 quad Prototypes To put here: concept sketches assembly photos thermal...
Glasgow RCE Info Set up See here for hardware set up: RCESetUp Running the RCE software Make sure to have set up symbolic link to RCE area, i.e. ln s /afs/phas...
28/5/2012 Sensors chosen to flip chip in the second run are: From Pixel II (2873 18) SC9 RD50 guard IBL ganged pixels (baseline) SC10 RD50 guard IBL...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
JoleenPater 2013 08 13 Stepped Geometry Prototype NB this prototype was shelved in 2013 when the Open Rings layout was adopted. Peter Sutcliffe`s drawings for a...
RichardBates 2010 12 16 Sensors Connectivity Modules Connectivity
Wafer Probing Info Notes The following modifications should be made to the Probe Card (FE I4A only) Add solder jumper to right side of T1 Add solder jumper...
Welcome to the 1 web Available Information This Twiki page is intended for gathering all information on the ATLAS upgrade pixel work. Sharepoints: WP1 (Pixel...
PCB and wirebonding details for the various Assemblies are given here. Quad Flex v1.11 FLEX1 2.BPX: Quad Flex v1.11 Wire bonding program for BJ820 Zip file...
Number of topics: 25

 
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