Difference: IndiumModules (1 vs. 2)

Revision 22014-09-24 - KennyWraight

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Indium Bumped Modules

This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL.

Added:
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>		Indium bumps require pressure only to make connections so no high temperatures are required to melt alloy, which reduces bowing effects.
 
Changed:
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<

MODULES Tested:

>
>

Modules under test:

ID bond force comment
14-07-24-S2 20kg  
14-07-25-S2 10kg  
14-07-25-S4 5kg  
 
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<		Indium 14-07-25-S4
 

IV Scans

Tuning

USBPix

Revision 12014-08-28 - KateDoonan

Line: 1 to 1
Added:
>
>
META TOPICPARENT name="WebHome"

Indium Bumped Modules

This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL.

MODULES Tested:

Indium 14-07-25-S4

IV Scans

Tuning

USBPix

RCE System

Bump yield results

-- Kate Doonan - 2014-08-28

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