Difference: Our_FEI4_wafers (1 vs. 17)

Revision 172014-03-31 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
Line: 37 to 37
  VTB8W7H - For LETI technology run 4
Changed:
<
<		VPB8WBH - For LETI technology run 5
>
>		VEB6NSH - For LETI technology run 5
 
Changed:
<
<		VIB62GH - For LETI technology run 5
>
>		VJB8WGH - For LETI technology run 5
 
Changed:
<
<		VEB6NSH - For LETI technology extra full thickness No. 1
>
>		VPB8WBH - For LETI technology extra full thickness No. 1
 
Changed:
<
<		VJB8WGH - For LETI technology extra full thickness No. 2
>
>		VIB62GH - For LETI technology extra full thickness No. 2
  VUB6NCH - For LETI technology extra full thickness No. 3

Revision 162013-11-27 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
Line: 21 to 21
 
  • FE-I4B wafers
Changed:
<
<		VMB8WDH - for LETI u-bump deposition, technology run 1
>
>		VMB8WDH - For LETI u-bump deposition, technology run 1
 
Changed:
<
<		V6B8WUH - for LETI u-bump deposition, technology run 1
>
>		V6B8WUH - For LETI u-bump deposition, technology run 1
 
Changed:
<
<		VUAYCRH - for LETI technology run 2 (Broke during processing)
>
>		VUAYCRH - For LETI technology run 2 (Broke during processing)
  ABPJXGH - For LETI technology run 2
Changed:
<
<		V7B8WTH - for LETI technology run 3
>
>		V7B8WTH - For LETI technology run 3
  VKB8WFH - For LETI technology run 3
Added:
>
>		VYB8XJH - For LETI technology run 4

VTB8W7H - For LETI technology run 4

VPB8WBH - For LETI technology run 5

VIB62GH - For LETI technology run 5

VEB6NSH - For LETI technology extra full thickness No. 1

VJB8WGH - For LETI technology extra full thickness No. 2

VUB6NCH - For LETI technology extra full thickness No. 3

 VWB6IVH - Processing at Advacam at full thickness
Added:
>
>
    • FE-I4B wafers in Edinburgh to probe and use for module build

VZBSDRH
VZBSBSH
V1BSDPH
VGBSF8H

    • FE-I4B wafers in Glasgow to probe and use for module build

VEBSAVH - probe commissioning

VQBSEHH

VUBSAFH

V0BSDQH

 -- AndrewStewart - 2012-07-31

META FILEATTACHMENT attachment="wafer-metal.gds.zip" attr="" comment="FE-I4A Top metal layer GDS (zipped)" date="1373607502" name="wafer-metal.gds.zip" path="wafer-metal.gds.zip" size="2281227" stream="wafer-metal.gds.zip" tmpFilename="/usr/tmp/CGItemp51787" user="RichardBates" version="1"

Revision 152013-11-27 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
Line: 25 to 25
  V6B8WUH - for LETI u-bump deposition, technology run 1
Changed:
<
<		VUAYCRH - for LETI technology run 2
>
>		VUAYCRH - for LETI technology run 2 (Broke during processing)
 
Changed:
<
<		ABPJXGH - For LETI technology run 2 (wafer map available and to be uploaded)
>
>		ABPJXGH - For LETI technology run 2
  V7B8WTH - for LETI technology run 3

Revision 142013-11-26 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
Line: 25 to 25
  V6B8WUH - for LETI u-bump deposition, technology run 1
Changed:
<
<		VUAYCRH - for LETI technology run 2 (no wafer map available)
>
>		VUAYCRH - for LETI technology run 2
  ABPJXGH - For LETI technology run 2 (wafer map available and to be uploaded)

Revision 132013-09-19 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.

Wafers

Added:
>
>
 
  • FE-I4A wafers

V6ABC1H - Processed at VTT at 200um thickness

Line: 35 to 38
 -- AndrewStewart - 2012-07-31

META FILEATTACHMENT attachment="wafer-metal.gds.zip" attr="" comment="FE-I4A Top metal layer GDS (zipped)" date="1373607502" name="wafer-metal.gds.zip" path="wafer-metal.gds.zip" size="2281227" stream="wafer-metal.gds.zip" tmpFilename="/usr/tmp/CGItemp51787" user="RichardBates" version="1"
Added:
>
>
META FILEATTACHMENT attachment="FEI4_B_DV_CHIPEDGE.gds.zip" attr="" comment="FE-I4B top metal layer GDS as Zip file" date="1379601536" name="FEI4_B_DV_CHIPEDGE.gds.zip" path="FEI4_B_DV_CHIPEDGE.gds.zip" size="2325479" stream="FEI4_B_DV_CHIPEDGE.gds.zip" tmpFilename="/usr/tmp/CGItemp27893" user="RichardBates" version="1"

Revision 122013-07-30 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
Line: 18 to 18
 
  • FE-I4B wafers
Changed:
<
<		VMB8WDH - for LETI u-bump depositio, technology run 1
>
>		VMB8WDH - for LETI u-bump deposition, technology run 1
  V6B8WUH - for LETI u-bump deposition, technology run 1

Revision 112013-07-12 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.

Wafers

Added:
>
>
 
  • FE-I4A wafers

V6ABC1H - Processed at VTTat 200um thickness

Line: 32 to 33
 VWB6IVH - Processing at Advacam at full thickness

-- AndrewStewart - 2012-07-31

Added:
>
>
META FILEATTACHMENT attachment="wafer-metal.gds.zip" attr="" comment="FE-I4A Top metal layer GDS (zipped)" date="1373607502" name="wafer-metal.gds.zip" path="wafer-metal.gds.zip" size="2281227" stream="wafer-metal.gds.zip" tmpFilename="/usr/tmp/CGItemp51787" user="RichardBates" version="1"

Revision 102013-07-03 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
Line: 9 to 9
  V5ABC2H - returned
Changed:
<
<		VZABC8H
>
>		VZABC8H - Processed at VTT full thickness
  VBABAXH - Processed at VTT full thickness
Line: 25 to 25
  ABPJXGH - For LETI technology run 2 (wafer map available and to be uploaded)
Added:
>
>		V7B8WTH - for LETI technology run 3

VKB8WFH - For LETI technology run 3

 VWB6IVH - Processing at Advacamat full thickness

-- AndrewStewart - 2012-07-31

Revision 92013-06-13 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
Changed:
<
<		At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
>
>		There are a number of FE-I4 wafers A and B that belong to the UK for the ATLAS module upgarde project.
 

Wafers

Added:
>
>
  • FE-I4A wafers
 
Changed:
<
<		V6ABC1H
>
>		V6ABC1H - Processed at VTTat 200um thickness
  V5ABC2H - returned

VZABC8H

Changed:
<
<		VBABAXH
>
>		VBABAXH - Processed at VTT full thickness
  V2AQMLH
Added:
>
>
  • FE-I4B wafers
 VMB8WDH - for LETI u-bump depositio, technology run 1

V6B8WUH - for LETI u-bump deposition, technology run 1

Line: 22 to 25
  ABPJXGH - For LETI technology run 2 (wafer map available and to be uploaded)
Added:
>
>		VWB6IVH - Processing at Advacamat full thickness
 -- AndrewStewart - 2012-07-31 \ No newline at end of file

Revision 82013-03-08 - ThomasMcMullen

Line: 1 to 1
 
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
Line: 14 to 14
  V2AQMLH
Changed:
<
<		VMB8WDH - for LETI u-bump deposition
>
>		VMB8WDH - for LETI u-bump depositio, technology run 1
 
Changed:
<
<		V6B8WUH - for LETI u-bump deposition
>
>		V6B8WUH - for LETI u-bump deposition, technology run 1
 
Changed:
<
<		VUAYCRH - for LETI technology run one (low yield)
>
>		VUAYCRH - for LETI technology run 2 (no wafer map available)

ABPJXGH - For LETI technology run 2 (wafer map available and to be uploaded)

  -- AndrewStewart - 2012-07-31 \ No newline at end of file

Revision 72013-03-01 - ThomasMcMullen

Line: 1 to 1
 
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
Line: 18 to 18
  V6B8WUH - for LETI u-bump deposition
Added:
>
>		VUAYCRH - for LETI technology run one (low yield)
 -- AndrewStewart - 2012-07-31

Revision 62013-02-14 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
Line: 14 to 14
  V2AQMLH
Added:
>
>		VMB8WDH - for LETI u-bump deposition

V6B8WUH - for LETI u-bump deposition

 -- AndrewStewart - 2012-07-31

Revision 52012-07-31 - AndrewStewart

Line: 1 to 1
 
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
Line: 12 to 12
  VBABAXH
Deleted:
<
<		-- RichardBates - 2012-02-22
 \ No newline at end of file
Added:
>
>		V2AQMLH

-- AndrewStewart - 2012-07-31

Revision 42012-06-19 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
Line: 6 to 6
  V6ABC1H
Changed:
<
<		V5ABC2H
>
>		V5ABC2H - returned
  VZABC8H

Revision 32012-04-11 - AndrewStewart

Line: 1 to 1
 
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
Line: 10 to 10
  VZABC8H
Added:
>
>		VBABAXH
 -- RichardBates - 2012-02-22 \ No newline at end of file

Revision 22012-03-01 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.
Line: 8 to 8
  V5ABC2H
Added:
>
>		VZABC8H
 -- RichardBates - 2012-02-22 \ No newline at end of file

Revision 12012-02-22 - RichardBates

Line: 1 to 1
Added:
>
>
META TOPICPARENT name="Modules"
At present we have two FE-I4 wafers at VTT. A third is on its way. Two wafers belong to the UK and the third to MPI. The plan is that MPI and the UK share the cost of the FE-I4A UBM and bump masks.

Wafers

V6ABC1H

V5ABC2H

-- RichardBates - 2012-02-22

View topic | History: r17 < r16 < r15 < r14 | More topic actions...
 
This site is powered by the TWiki collaboration platform Powered by PerlCopyright © 2008-2025 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.
Ideas, requests, problems regarding TWiki? Send feedback