Wafers

• wafer-metal.gds.zip: FE-I4A Top metal layer GDS (zipped)

• FEI4_B_DV_CHIPEDGE.gds.zip: FE-I4B top metal layer GDS as Zip file

• FE-I4A wafers

V6ABC1H - Processed at VTT at 200um thickness

V5ABC2H - returned

VZABC8H - Processed at VTT full thickness

VBABAXH - Processed at VTT full thickness

V2AQMLH

• FE-I4B wafers

VMB8WDH - For LETI u-bump deposition, technology run 1

V6B8WUH - For LETI u-bump deposition, technology run 1

VUAYCRH - For LETI technology run 2 (Broke during processing)

ABPJXGH - For LETI technology run 2

V7B8WTH - For LETI technology run 3

VKB8WFH - For LETI technology run 3

VYB8XJH - For LETI technology run 4

VTB8W7H - For LETI technology run 4

VEB6NSH - For LETI technology run 5

VJB8WGH - For LETI technology run 5

VPB8WBH - For LETI technology extra full thickness No. 1

VIB62GH - For LETI technology extra full thickness No. 2

VUB6NCH - For LETI technology extra full thickness No. 3

VWB6IVH - Processing at Advacam at full thickness

• • FE-I4B wafers in Edinburgh to probe and use for module build

VZBSDRH
VZBSBSH
V1BSDPH
VGBSF8H

• • FE-I4B wafers in Glasgow to probe and use for module build

VEBSAVH - probe commissioning

VQBSEHH

VUBSAFH

V0BSDQH

-- AndrewStewart - 2012-07-31