Indium Bumped Modules

This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL. Indium bumps require pressure only to make connections so no high temperatures are required to melt alloy, which reduces bowing effects.

Modules under test:

ID bond force comment
14-07-24-S2 20kg  
14-07-25-S2 10kg  
14-07-25-S4 5kg  

IV Scans

Tuning

USBPix

RCE System

Bump yield results

-- Kate Doonan - 2014-08-28

Comments


Topic revision: r2 - 2014-09-24 - KennyWraight
 
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