Indium Bumped Modules
This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL.
Indium bumps require pressure only to make connections so no high temperatures are required to melt alloy, which reduces bowing effects.
Modules under test:
IV Scans
Tuning
USBPix
RCE System
Bump yield results
--
Kate Doonan - 2014-08-28
Comments