Recent Changes in ATLAS/PUUKA Web retrieved at 21:46 (GMT)

Wafer Probing Info Notes The following modifications should be made to the Probe Card (FE I4A only) Add solder jumper to right side of T1 Add solder jumper...
wafer VPB8WBH Map.pdf: Wafer map VPB8WBH.waprj: waprj file RichardBates 2013 11 27
This wafer is going to LETI for u bump deposition wafermap VMB8WDH.pdf: Wafer Map VMB8WDH.waprj: WAPRJ file RichardBates 2013 02 14
Open Rings Engineering Design page Please add drawings and information as needed to share Comments
Connectivity The UK are developing: Flip chip bump deposition at CEA Leti and flip chip at Advacam Thin chip assemblies with Advacam and CEA Leti...
Flip chip bump deposition at CEA Leti and Flip chip at Advacam The first phase of the development with CEA Leti was the deposition of copper pillars with SAC solder...
Thin chip assemblies To be able to flip chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re flow process. At present...
Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium flip chip process. The samples first have an under bump metal (UBM) layer deposited upon...
The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
25/07/2012 The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels. Stock Location StatusOfAssemblies...
Indium Bumped Modules This page will serve as a database for characterisation of Indium Bumped Modules developed at RAL. Indium bumps require pressure only to make...
wafer VUB6NCH Map.pdf: Wafer Map RichardBates 2013 11 27 VUB6NCH.waprj: Waprj file
wafer VIB62GH Map.pdf: Wafer Map VIB62GH.waprj: Waprj file RichardBates 2013 11 27
Wafer map wafer V7B8WTH Map.pdf: Wafer Map RichardBates 2013 07 03 V7B8WTH.waprj: Waprj file
This wafer is going to LETI for u bump deposition wafermap V6B8WUH.pdf: Wafer Map V6B8WUH.waprj: Waprj file RichardBates 2013 02 14
SLAC Testbeam May 2014 This page catalogues each experimental setup, GeoIDs and run numbers. For details on reconstruction see here. Enjoy! Quad5, 250x50 DUTs...
`Open Rings` Endcap Layout (Previously known by a number of different names e.g. `concentric diskettes`.) Motivation and Description A couple of talks showing the...
Pixel Endcaps in the LoI (Cartigny) Layout The drawings below show 3 possible types of pixel endcap disks in the LoI, or `Cartigny` layout of the upgraded inner tracker...
JoleenPater 2013 08 13 Stepped Geometry Prototype NB this prototype was shelved in 2013 when the Open Rings layout was adopted. Peter Sutcliffe`s drawings for a...
Title Article text. Comments
Title Article text. Comments
Title Article text. Comments
Reconstruction This page serves as a central hub for information on the reconstruction and analysis effort of UK Test Beam data. Versions of software in use:...
There are a number of FE I4 wafers A and B that belong to the UK for the ATLAS module upgarde project. Wafers wafer metal.gds.zip: FE I4A Top metal layer GDS...
wafer VJB8WGH Map.pdf: Wafer map RichardBates 2013 11 27
wafer VEB6NSH Map.pdf: Wafer map RichardBates 2013 11 27
wafer VTB8W7H Map.pdf: Wafer map RichardBates 2013 11 27
wafer VYB8XJH Map.pdf: Wafer map RichardBates 2013 11 27
wafer ABPJXGH Map.pdf: ABPJXGH Wafer Map RichardBates 2013 07 12
This wafer was broken during the wafer thinning process wafer VUAYCRH Map.pdf: Wafer map RichardBates 2013 11 26
Meetings Pixel Weekly Face to face meetings FEI 4 testing meeting (Mon @4.30pm CERN) Testbeam Analysis meeting (Tue @4pm CERN)
Under Construction
FEI 4 Documentation Documentation for FEI can be found at https://espace.cern.ch/atlas pixel upgrade elec/Final%20Design/Reference/ (NB: Requires cern id and...
Wafer map wafer VKB8WFH Map.pdf: Wafer Map RichardBates 2013 07 03
ThomasMcMullen 2013 03 08
wafer VWB6IVH Map.pdf: Wafer Map RichardBates 2013 06 13
VTT Assembly10 3200e 100V Tuned.cfg.root: Assembly 10 Configuration File: Threshold 3200e@ ToT8, 100V Det Bias VTT Assembly10 1600e 100V Tuned.cfg.root: Assembly...
VTT Assembly14 3200e 10V Tuned.cfg.root: Assembly 14 Configuation File: Threshold 3200e @ ToT8, 10V Det Bias Assembly14 3200e 10V ToT8 FastTuning.root: Assembly...
Assembly 5 Device IV after flip chip and mouting on the SCC. Assembly5 02082012.pptx: Presentation of scans performed on Assembly 5 VTT Assembly5 3200e 100V...
IV Curves of MPI Sensor MPI IV.xlsx KateDoonan 2012 12 18
IV Curves of Micron sensor MICRONCurves 2012.xlsx KateDoonan 2012 12 18
IV Characteristics of the FBK 7 assembly: IV Curve FBK 200212.xlsx Details of noise characterisation of the FBK 7 assembly: FBK Noise.pptx Further information on FBK...
This device was mounted on a single chip card, checked to be fine, and sent to CERN for testbeam in September 2012. RichardBates 2012 10 09
Unfortunately this assembly was broken due to an accident with the probe station. The detector of the assembly was being IVed on arrival in Glasgow, before wirebonding...
VTT Assembly15 3200e 100V Tuned.cfg.root: Assembly15 Config file 3200electrons ToT8 100V Det Bias VTT Assembly15 1600e 100V Tuned.cfg.root: Assembly15 Config...
This is a green chi. Sent to RAL. Prim List used to tune the chip $ Assembly14 Fast Tuning 3200e.prl.root: Data file from Prim List $ 2012 10 08 Wafer...
Wafer Statistics Wafer Code Wafer No Good Chips Comment V2AQMLH 33 X Wafer Probed, generating statistics AndrewStewart...
RichardBates 2011 04 16 See attachments for cool box drawing for EUDET telescope as of Sept2012, note this is not compatible with the QUAD module due as it is not...
JoleenPater 2012 02 16 SimonBrown 2012 02 23 This page contains information about the Data Multiplexer for the Pixel Modules. The Data Multiplexer is intended...
Wafer V2AQMLH FE I4A wafer delivered 27th of July 2012. Primary purpose: Development of wafer probe test. AndrewStewart 2012 07 31

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