Difference: MCMD (1 vs. 33)

Revision 332013-12-17 - AndrewPickford

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META TOPICPARENT name="ResearchResults"

Thin film hybrid in MCM-D technology

Processing on blank silicon wafers to determine the feasibility of building a fully functional circuit in this technology. The cricuit has five metal layers and hosts 20 front-end ASICS. Electrically it is an exact copy of the silicon tracker upgrade hybrid designed in Liverpool.

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Specification of first version
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Specification of first version
 
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Photos at reception of first thin film hybrid batch
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Photos at reception of first thin film hybrid batch
 
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Study of the PWR-GND short
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Study of the PWR-GND short
 

Post processing of sensor wafer: Run 1

Processing on electrical and mechanical grade sensor wafers to investigate the influence on the sensor performance. The processing involved a single metal layer, with the cross-section shown in the figure below.

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CrossSection.gif
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CrossSection.gif
 

Wafer and sensor numbering scheme Run 1

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

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 Sensor number scheme

Electrical measurements of Run 1

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Post proton irradiation characterisation (word, pdf)
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Post proton irradiation characterisation (word, pdf)
 
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I/V and C/V measurements of all sensors before dicing
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I/V and C/V measurements of all sensors before dicing
 
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I/V measurements of all sensors after dicing
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I/V measurements of all sensors after dicing
 
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Inter-strip capacitance measurements of all sensors before dicing
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Inter-strip capacitance measurements of all sensors before dicing
 
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Capacitance between strip and GND plane
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Capacitance between strip and GND plane
 
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Summary of capacitive load measurements
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Summary of capacitive load measurements
 
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Inter-strip resistiance
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Inter-strip resistiance
 
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Punch-through measurement
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Punch-through measurement
 

Documentation and photos

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Photos at reception of the wafers
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Photos at reception of the wafers
  Bias bonds on measured wafers
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Yield measurements
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Yield measurements
 
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Reference documents and presentations
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Reference documents and presentations
 

Mechanical measurements

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Sensor flatness
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Sensor flatness
 

Mechanical measurements for Wafers 4 and 17

Revision 322012-07-01 - LarsEklund

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META TOPICPARENT name="ResearchResults"

Thin film hybrid in MCM-D technology

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 Sensor number scheme

Electrical measurements of Run 1

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Post proton irradiation characterisation (word, pdf)
 I/V and C/V measurements of all sensors before dicing

I/V measurements of all sensors after dicing

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Revision 312010-07-21 - LarsEklund

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Thin film hybrid in MCM-D technology

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 Specification of first version

Photos at reception of first thin film hybrid batch

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Study of the PWR-GND short
 

Post processing of sensor wafer: Run 1

Processing on electrical and mechanical grade sensor wafers to investigate the influence on the sensor performance. The processing involved a single metal layer, with the cross-section shown in the figure below.

Revision 302010-06-28 - LarsEklund

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META TOPICPARENT name="ResearchResults"
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Thin film hybrid in MCM-D technology

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Thin film hybrid in MCM-D technology

Processing on blank silicon wafers to determine the feasibility of building a fully functional circuit in this technology. The cricuit has five metal layers and hosts 20 front-end ASICS. Electrically it is an exact copy of the silicon tracker upgrade hybrid designed in Liverpool.

Specification of first version

  Photos at reception of first thin film hybrid batch
Added:
>
>

Post processing of sensor wafer: Run 1

Processing on electrical and mechanical grade sensor wafers to investigate the influence on the sensor performance. The processing involved a single metal layer, with the cross-section shown in the figure below.

CrossSection.gif

 

Wafer and sensor numbering scheme Run 1

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

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 Sensors w04

Sensors w17

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Thin film hybrid

Specification of first version

  -- LarsEklund - 21 Nov 2008
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Revision 292010-06-18 - LarsEklund

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META TOPICPARENT name="ResearchResults"
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Wafer and sensor numbering scheme

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Thin film hybrid in MCM-D technology

Photos at reception of first thin film hybrid batch

Wafer and sensor numbering scheme Run 1

  The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Revision 282009-10-23 - LarsEklund

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META TOPICPARENT name="ResearchResults"

Wafer and sensor numbering scheme

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 Sensors w04

Sensors w17

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Thin film hybrid

Specification of first version

  -- LarsEklund - 21 Nov 2008

Revision 272009-08-10 - FredDoherty

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META TOPICPARENT name="ResearchResults"

Wafer and sensor numbering scheme

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  Sensor flatness
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Mechanical measurements for Wafers 4 and 17

Sensors w04

Sensors w17

 -- LarsEklund - 21 Nov 2008

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Revision 252009-04-02 - LarsEklund

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META TOPICPARENT name="ResearchResults"

Wafer and sensor numbering scheme

Revision 242009-03-04 - LarsEklund

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META TOPICPARENT name="ResearchResults"

Wafer and sensor numbering scheme

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 Bias bonds on measured wafers

Yield measurements

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Reference documents and presentations
 

Mechanical measurements

Sensor flatness

Revision 232009-03-01 - LarsEklund

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META TOPICPARENT name="ResearchResults"

Wafer and sensor numbering scheme

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 Inter-strip capacitance measurements of all sensors before dicing

Documentation and photos

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Photos at reception of the wafers
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Photos at reception of the wafers
  Bias bonds on measured wafers
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Yield measurements
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Yield measurements
 

Mechanical measurements

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Sensor flatness
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Sensor flatness
  -- LarsEklund - 21 Nov 2008
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Revision 222009-01-29 - RichardBates

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Wafer and sensor numbering scheme

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Revision 212009-01-16 - LarsEklund

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META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

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 Yield measurements

Mechanical measurements

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Sensor flatness
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Sensor flatness
  -- LarsEklund - 21 Nov 2008

Revision 202009-01-14 - LarsEklund

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META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

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 Yield measurements

Mechanical measurements

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Sensor flatness
  -- LarsEklund - 21 Nov 2008

Revision 192009-01-10 - LarsEklund

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Wafer and sensor numbering scheme

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Revision 182008-12-17 - LarsEklund

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  Sensor flatness
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Photos at reception of Run 1 wafers

The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

Full wafer views

  6 um BCB 12 um BCB
Electrical w14, w15 w08, w09
Mechanical w17, w18, w19 w04, w05, w16

Close-up views on a few sensors on w14

Meshed GND plane, full view

Bias bond, close-up

Meshed GND plane, top half

Meshed GND plane, full view

Solid GND plane, top half

Triangular GND plane, full view

Close-up views on a few features on w14

Ground planes: solid, meshed, meshed (bond pad)

Bias and guard ring connections: bias and guard rings, bias ring via, bias bond (triangular), bias bond (meshed)

Strip connections: overview, zoom 1, zoom 2, zoom 3, bond pad, double vias

Bias resistor connections: resistor via, zoom

A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 um line width and spacing, increasing with 5 um for each set of lines. As seen in the overview picture all lines down to 10 um line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.

IV and CV measurments

Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow.

Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)

The scale of the I/V graph covers the range of 25 of the 26 sensors on wafer 09. Sensor X5Y3 breakes down at low voltages, see separate I/V. Sensors X5Y1, X5Y2 and X5Y4 were ramped to 600 V with leakage current of 40, 33 and 31 nA at 600V. Sensor X5Y1 was kept at 600 V for 30 min and is the only sensor that shows a clear change in reverse current over time, but with signs of saturation. See stability graph.

I/V characteristics of all sensors

Summary of all C/V on wafer 09

1/C vs V graphs for all sensors on w09

Rs vs V summary graph

Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above. The depletion voltage could not be determined for X5Y3 due to its breakdown, hence the histograms include 25 sensors.

Wafer map of depletion voltages

Histogram of measured depletion voltages

Summary plots of I/V and C/V performance for wafer 14 (6 m BCB)

Until present 19 sensors have been teste of which 18 are inclueded in the plots. Sensor X0Y4 broke down a very low voltage and is excluded from the analysis presented here.

I/V characteristics of all sensors

Summary of all C/V on wafer 09

1/C vs V graphs for all sensors on w09

Rs vs V summary graph

Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above. Sensor X0Y4 is not inclued in the depletion voltage plots since it broke down at low voltages.

Wafer map of depletion voltages

Histogram of measured depletion voltages

I/V ramp to 1000 V for two sensors on w14

I/V up to 1000V for two sensors

Sensor X5Y1 was kept at 1000V and a break down started to develop at which point it was ramped down immediately

kkk

Plots combining the I/V and C/V data for wafer 09 and 14

Combined depletion voltages for wafer 09 nad 14

The following plot show the reverse current at 400 V bias for all measured sensors on wafer 09 and 14.

current at 400 V for all sensors on w 09 and w 14

The following plot shows the reverse current at 400 and 600 V for w 14 for all measured sensors

Current at 400 and 600 V for w14

 -- LarsEklund - 21 Nov 2008

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Revision 172008-12-16 - LarsEklund

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Wafer and sensor numbering scheme

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Sensor number scheme

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Photos at reception of Run 1 wafers

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Electrical measurements of Run 1

I/V and C/V measurements of all sensors before dicing

Inter-strip capacitance measurements of all sensors before dicing

Documentation and photos

Photos at reception of the wafers

Bias bonds on measured wafers

Yield measurements

Mechanical measurements

Sensor flatness

Photos at reception of Run 1 wafers

  The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

Revision 162008-12-15 - LarsEklund

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Revision 152008-12-12 - LarsEklund

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Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)

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The scale of the I/V graph covers the range of 25 of the 26 sensors on wafer 09. Sensor X5Y3 brakes down at low voltages, see separate I/V. Sensors X5Y1, X5Y2 and X5Y4 were ramped to 600 V with leakage current of 40, 33 and 31 nA at 600V. Sensor X5Y1 was kept at 600 V for 30 min and is the only sensor that shows a clear change in reverse current over time, but with signs of saturation. See stability graph.
>
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The scale of the I/V graph covers the range of 25 of the 26 sensors on wafer 09. Sensor X5Y3 breakes down at low voltages, see separate I/V. Sensors X5Y1, X5Y2 and X5Y4 were ramped to 600 V with leakage current of 40, 33 and 31 nA at 600V. Sensor X5Y1 was kept at 600 V for 30 min and is the only sensor that shows a clear change in reverse current over time, but with signs of saturation. See stability graph.
  I/V characteristics of all sensors

Revision 142008-12-11 - LarsEklund

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Wafer and sensor numbering scheme

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 Wafer map of depletion voltages

Histogram of measured depletion voltages

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I/V ramp to 1000 V for two sensors on w14

I/V up to 1000V for two sensors

Sensor X5Y1 was kept at 1000V and a break down started to develop at which point it was ramped down immediately

kkk

 

Plots combining the I/V and C/V data for wafer 09 and 14

Combined depletion voltages for wafer 09 nad 14

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Revision 132008-12-11 - LarsEklund

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Wafer and sensor numbering scheme

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  Rs vs V summary graph
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 Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above. Sensor X0Y4 is not inclued in the depletion voltage plots since it broke down at low voltages.

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 Wafer map of depletion voltages

Histogram of measured depletion voltages

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Plots combining the I/V and C/V data for wafer 09 and 14

Combined depletion voltages for wafer 09 nad 14

Line: 140 to 141
 
META FILEATTACHMENT attachment="biasRingVia_zoom.JPG" attr="" comment="" date="1227292990" name="biasRingVia_zoom.JPG" path="biasRingVia_zoom.JPG" size="2014198" stream="biasRingVia_zoom.JPG" tmpFilename="/usr/tmp/CGItemp36803" user="LarsEklund" version="1"
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META FILEATTACHMENT attachment="w09_VdepHisto.gif" attr="" comment="" date="1228949402" name="w09_VdepHisto.gif" path="w09_VdepHisto.gif" size="6675" stream="w09_VdepHisto.gif" tmpFilename="/usr/tmp/CGItemp28744" user="LarsEklund" version="7"
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META FILEATTACHMENT attachment="w09_VdepMap.gif" attr="" comment="" date="1228949415" name="w09_VdepMap.gif" path="w09_VdepMap.gif" size="13604" stream="w09_VdepMap.gif" tmpFilename="/usr/tmp/CGItemp28733" user="LarsEklund" version="5"
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Line: 153 to 154
 
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META FILEATTACHMENT attachment="combined_Vdepl.gif" attr="" comment="" date="1228951569" name="combined_Vdepl.gif" path="combined_Vdepl.gif" size="7025" stream="combined_Vdepl.gif" tmpFilename="/usr/tmp/CGItemp29201" user="LarsEklund" version="4"
>
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META FILEATTACHMENT attachment="combined_Vdepl.gif" attr="" comment="" date="1228994332" name="combined_Vdepl.gif" path="combined_Vdepl.gif" size="7025" stream="combined_Vdepl.gif" tmpFilename="/usr/tmp/CGItemp29403" user="LarsEklund" version="4"
 
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Changed:
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META FILEATTACHMENT attachment="w09I400Map.gif" attr="" comment="" date="1228988879" name="w09I400Map.gif" path="w09I400Map.gif" size="13455" stream="w09I400Map.gif" tmpFilename="/usr/tmp/CGItemp36779" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="w14I400Map.gif" attr="" comment="" date="1228988898" name="w14I400Map.gif" path="w14I400Map.gif" size="14256" stream="w14I400Map.gif" tmpFilename="/usr/tmp/CGItemp36776" user="LarsEklund" version="1"
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>
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META FILEATTACHMENT attachment="w14I400Map.gif" attr="" comment="" date="1228994389" name="w14I400Map.gif" path="w14I400Map.gif" size="12109" stream="w14I400Map.gif" tmpFilename="/usr/tmp/CGItemp28657" user="LarsEklund" version="2"
META FILEATTACHMENT attachment="w14I600Map.gif" attr="" comment="" date="1228994409" name="w14I600Map.gif" path="w14I600Map.gif" size="13423" stream="w14I600Map.gif" tmpFilename="/usr/tmp/CGItemp28780" user="LarsEklund" version="2"

Revision 122008-12-11 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 55 to 55
  Rs vs V summary graph
Added:
>
>
 Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above. The depletion voltage could not be determined for X5Y3 due to its breakdown, hence the histograms include 25 sensors.

Line: 81 to 83
  Wafer map of depletion voltages

Histogram of measured depletion voltages

Added:
>
>

 

Plots combining the I/V and C/V data for wafer 09 and 14

Combined depletion voltages for wafer 09 nad 14

Line: 133 to 139
 
META FILEATTACHMENT attachment="biasResVia_zoom.jpg" attr="" comment="" date="1227292978" name="biasResVia_zoom.jpg" path="biasResVia_zoom.jpg" size="2274641" stream="biasResVia_zoom.jpg" tmpFilename="/usr/tmp/CGItemp36835" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="biasRingVia_zoom.JPG" attr="" comment="" date="1227292990" name="biasRingVia_zoom.JPG" path="biasRingVia_zoom.JPG" size="2014198" stream="biasRingVia_zoom.JPG" tmpFilename="/usr/tmp/CGItemp36803" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="w09_CVSummary.gif" attr="" comment="" date="1228949344" name="w09_CVSummary.gif" path="w09_CVSummary.gif" size="10590" stream="w09_CVSummary.gif" tmpFilename="/usr/tmp/CGItemp28704" user="LarsEklund" version="8"
Changed:
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META FILEATTACHMENT attachment="w09_IVSummary.gif" attr="" comment="" date="1228949477" name="w09_IVSummary.gif" path="w14_IVSummary.gif" size="16985" stream="w14_IVSummary.gif" tmpFilename="/usr/tmp/CGItemp28887" user="LarsEklund" version="10"
>
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META FILEATTACHMENT attachment="w09_IVSummary.gif" attr="" comment="" date="1228989956" name="w09_IVSummary.gif" path="w09_IVSummary.gif" size="15877" stream="w09_IVSummary.gif" tmpFilename="/usr/tmp/CGItemp29312" user="LarsEklund" version="11"
 
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META FILEATTACHMENT attachment="w09_VdepMap.gif" attr="" comment="" date="1228949415" name="w09_VdepMap.gif" path="w09_VdepMap.gif" size="13604" stream="w09_VdepMap.gif" tmpFilename="/usr/tmp/CGItemp28733" user="LarsEklund" version="5"
META FILEATTACHMENT attachment="w09_RsVSummary.gif" attr="" comment="" date="1228949386" name="w09_RsVSummary.gif" path="w09_RsVSummary.gif" size="15903" stream="w09_RsVSummary.gif" tmpFilename="/usr/tmp/CGItemp29059" user="LarsEklund" version="7"
Line: 149 to 155
 
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META FILEATTACHMENT attachment="combined_Vdepl.gif" attr="" comment="" date="1228951569" name="combined_Vdepl.gif" path="combined_Vdepl.gif" size="7025" stream="combined_Vdepl.gif" tmpFilename="/usr/tmp/CGItemp29201" user="LarsEklund" version="4"
META FILEATTACHMENT attachment="combined_Iw14.gif" attr="" comment="" date="1228951355" name="combined_Iw14.gif" path="combined_Iw14.gif" size="9732" stream="combined_Iw14.gif" tmpFilename="/usr/tmp/CGItemp36520" user="LarsEklund" version="1"
Added:
>
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META FILEATTACHMENT attachment="w09I400Map.gif" attr="" comment="" date="1228988879" name="w09I400Map.gif" path="w09I400Map.gif" size="13455" stream="w09I400Map.gif" tmpFilename="/usr/tmp/CGItemp36779" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="w14I400Map.gif" attr="" comment="" date="1228988898" name="w14I400Map.gif" path="w14I400Map.gif" size="14256" stream="w14I400Map.gif" tmpFilename="/usr/tmp/CGItemp36776" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="w14I600Map.gif" attr="" comment="" date="1228988906" name="w14I600Map.gif" path="w14I600Map.gif" size="13126" stream="w14I600Map.gif" tmpFilename="/usr/tmp/CGItemp36779" user="LarsEklund" version="1"

Revision 112008-12-10 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 89 to 89
  current at 400 V for all sensors on w 09 and w 14
Added:
>
>
The following plot shows the reverse current at 400 and 600 V for w 14 for all measured sensors

Current at 400 and 600 V for w14

 -- LarsEklund - 21 Nov 2008

META FILEATTACHMENT attachment="w04_12umBCBMechanical_atReception.JPG" attr="" comment="" date="1227270097" name="w04_12umBCBMechanical_atReception.JPG" path="w04_12umBCBMechanical_atReception.JPG" size="2443792" stream="w04_12umBCBMechanical_atReception.JPG" tmpFilename="/usr/tmp/CGItemp31864" user="LarsEklund" version="1"
Line: 128 to 132
 
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META FILEATTACHMENT attachment="biasResVia_zoom.jpg" attr="" comment="" date="1227292978" name="biasResVia_zoom.jpg" path="biasResVia_zoom.jpg" size="2274641" stream="biasResVia_zoom.jpg" tmpFilename="/usr/tmp/CGItemp36835" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="biasRingVia_zoom.JPG" attr="" comment="" date="1227292990" name="biasRingVia_zoom.JPG" path="biasRingVia_zoom.JPG" size="2014198" stream="biasRingVia_zoom.JPG" tmpFilename="/usr/tmp/CGItemp36803" user="LarsEklund" version="1"
Changed:
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META FILEATTACHMENT attachment="w09_CVSummary.gif" attr="" comment="" date="1228848216" name="w09_CVSummary.gif" path="w09_CVSummary.gif" size="10510" stream="w09_CVSummary.gif" tmpFilename="/usr/tmp/CGItemp28993" user="LarsEklund" version="7"
META FILEATTACHMENT attachment="w09_IVSummary.gif" attr="" comment="" date="1228848236" name="w09_IVSummary.gif" path="w09_IVSummary.gif" size="15696" stream="w09_IVSummary.gif" tmpFilename="/usr/tmp/CGItemp29011" user="LarsEklund" version="8"
META FILEATTACHMENT attachment="w09_VdepHisto.gif" attr="" comment="" date="1228848268" name="w09_VdepHisto.gif" path="w09_VdepHisto.gif" size="6346" stream="w09_VdepHisto.gif" tmpFilename="/usr/tmp/CGItemp29075" user="LarsEklund" version="6"
META FILEATTACHMENT attachment="w09_VdepMap.gif" attr="" comment="" date="1228848283" name="w09_VdepMap.gif" path="w09_VdepMap.gif" size="13604" stream="w09_VdepMap.gif" tmpFilename="/usr/tmp/CGItemp28809" user="LarsEklund" version="5"
META FILEATTACHMENT attachment="w09_RsVSummary.gif" attr="" comment="" date="1228848252" name="w09_RsVSummary.gif" path="w09_RsVSummary.gif" size="15738" stream="w09_RsVSummary.gif" tmpFilename="/usr/tmp/CGItemp29158" user="LarsEklund" version="6"
META FILEATTACHMENT attachment="w09_1_C2vsV_Summary.gif" attr="" comment="" date="1228848196" name="w09_1_C2vsV_Summary.gif" path="w09_1_C2vsV_Summary.gif" size="12164" stream="w09_1_C2vsV_Summary.gif" tmpFilename="/usr/tmp/CGItemp30131" user="LarsEklund" version="6"
>
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META FILEATTACHMENT attachment="w09_IVSummary.gif" attr="" comment="" date="1228949477" name="w09_IVSummary.gif" path="w14_IVSummary.gif" size="16985" stream="w14_IVSummary.gif" tmpFilename="/usr/tmp/CGItemp28887" user="LarsEklund" version="10"
META FILEATTACHMENT attachment="w09_VdepHisto.gif" attr="" comment="" date="1228949402" name="w09_VdepHisto.gif" path="w09_VdepHisto.gif" size="6675" stream="w09_VdepHisto.gif" tmpFilename="/usr/tmp/CGItemp28744" user="LarsEklund" version="7"
META FILEATTACHMENT attachment="w09_VdepMap.gif" attr="" comment="" date="1228949415" name="w09_VdepMap.gif" path="w09_VdepMap.gif" size="13604" stream="w09_VdepMap.gif" tmpFilename="/usr/tmp/CGItemp28733" user="LarsEklund" version="5"
META FILEATTACHMENT attachment="w09_RsVSummary.gif" attr="" comment="" date="1228949386" name="w09_RsVSummary.gif" path="w09_RsVSummary.gif" size="15903" stream="w09_RsVSummary.gif" tmpFilename="/usr/tmp/CGItemp29059" user="LarsEklund" version="7"
META FILEATTACHMENT attachment="w09_1_C2vsV_Summary.gif" attr="" comment="" date="1228949323" name="w09_1_C2vsV_Summary.gif" path="w09_1_C2vsV_Summary.gif" size="12040" stream="w09_1_C2vsV_Summary.gif" tmpFilename="/usr/tmp/CGItemp29837" user="LarsEklund" version="7"
 
META FILEATTACHMENT attachment="X5Y3_IVgraph.gif" attr="" comment="" date="1228732514" name="X5Y3_IVgraph.gif" path="X5Y3_IVgraph.gif" size="7736" stream="X5Y3_IVgraph.gif" tmpFilename="/usr/tmp/CGItemp36854" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="X5Y1_biasStability.gif" attr="" comment="" date="1228735322" name="X5Y1_biasStability.gif" path="X5Y1_biasStability.gif" size="11495" stream="X5Y1_biasStability.gif" tmpFilename="/usr/tmp/CGItemp36732" user="LarsEklund" version="1"
Changed:
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META FILEATTACHMENT attachment="w14_1_C2vsV_Summary.gif" attr="" comment="" date="1228848300" name="w14_1_C2vsV_Summary.gif" path="w14_1_C2vsV_Summary.gif" size="11126" stream="w14_1_C2vsV_Summary.gif" tmpFilename="/usr/tmp/CGItemp29442" user="LarsEklund" version="2"
META FILEATTACHMENT attachment="w14_CVSummary.gif" attr="" comment="" date="1228848323" name="w14_CVSummary.gif" path="w14_CVSummary.gif" size="10167" stream="w14_CVSummary.gif" tmpFilename="/usr/tmp/CGItemp29066" user="LarsEklund" version="2"
>
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META FILEATTACHMENT attachment="w14_1_C2vsV_Summary.gif" attr="" comment="" date="1228949433" name="w14_1_C2vsV_Summary.gif" path="w14_1_C2vsV_Summary.gif" size="11354" stream="w14_1_C2vsV_Summary.gif" tmpFilename="/usr/tmp/CGItemp29483" user="LarsEklund" version="3"
META FILEATTACHMENT attachment="w14_CVSummary.gif" attr="" comment="" date="1228949458" name="w14_CVSummary.gif" path="w14_CVSummary.gif" size="10213" stream="w14_CVSummary.gif" tmpFilename="/usr/tmp/CGItemp28916" user="LarsEklund" version="3"
 
META FILEATTACHMENT attachment="w14_IVSummary.gif" attr="" comment="" date="1228848337" name="w14_IVSummary.gif" path="w14_IVSummary.gif" size="15428" stream="w14_IVSummary.gif" tmpFilename="/usr/tmp/CGItemp29024" user="LarsEklund" version="2"
Changed:
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META FILEATTACHMENT attachment="w14_RsVSummary.gif" attr="" comment="" date="1228848353" name="w14_RsVSummary.gif" path="w14_RsVSummary.gif" size="16388" stream="w14_RsVSummary.gif" tmpFilename="/usr/tmp/CGItemp29232" user="LarsEklund" version="2"
META FILEATTACHMENT attachment="w14_VdepHisto.gif" attr="" comment="" date="1228848370" name="w14_VdepHisto.gif" path="w14_VdepHisto.gif" size="6728" stream="w14_VdepHisto.gif" tmpFilename="/usr/tmp/CGItemp29004" user="LarsEklund" version="2"
META FILEATTACHMENT attachment="w14_VdepMap.gif" attr="" comment="" date="1228848383" name="w14_VdepMap.gif" path="w14_VdepMap.gif" size="12610" stream="w14_VdepMap.gif" tmpFilename="/usr/tmp/CGItemp28849" user="LarsEklund" version="2"
META FILEATTACHMENT attachment="combined_I400.gif" attr="" comment="" date="1228848714" name="combined_I400.gif" path="combined_I400.gif" size="6099" stream="combined_I400.gif" tmpFilename="/usr/tmp/CGItemp36548" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="combined_Vdepl.gif" attr="" comment="" date="1228849014" name="combined_Vdepl.gif" path="combined_Vdepl.gif" size="5876" stream="combined_Vdepl.gif" tmpFilename="/usr/tmp/CGItemp29360" user="LarsEklund" version="2"
>
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META FILEATTACHMENT attachment="w14_RsVSummary.gif" attr="" comment="" date="1228949494" name="w14_RsVSummary.gif" path="w14_RsVSummary.gif" size="19137" stream="w14_RsVSummary.gif" tmpFilename="/usr/tmp/CGItemp29020" user="LarsEklund" version="3"
META FILEATTACHMENT attachment="w14_VdepHisto.gif" attr="" comment="" date="1228949508" name="w14_VdepHisto.gif" path="w14_VdepHisto.gif" size="6531" stream="w14_VdepHisto.gif" tmpFilename="/usr/tmp/CGItemp28787" user="LarsEklund" version="3"
META FILEATTACHMENT attachment="w14_VdepMap.gif" attr="" comment="" date="1228949524" name="w14_VdepMap.gif" path="w14_VdepMap.gif" size="13554" stream="w14_VdepMap.gif" tmpFilename="/usr/tmp/CGItemp28589" user="LarsEklund" version="3"
META FILEATTACHMENT attachment="combined_I400.gif" attr="" comment="" date="1228951248" name="combined_I400.gif" path="combined_I400.gif" size="8796" stream="combined_I400.gif" tmpFilename="/usr/tmp/CGItemp28784" user="LarsEklund" version="2"
META FILEATTACHMENT attachment="combined_Vdepl.gif" attr="" comment="" date="1228951569" name="combined_Vdepl.gif" path="combined_Vdepl.gif" size="7025" stream="combined_Vdepl.gif" tmpFilename="/usr/tmp/CGItemp29201" user="LarsEklund" version="4"
META FILEATTACHMENT attachment="combined_Iw14.gif" attr="" comment="" date="1228951355" name="combined_Iw14.gif" path="combined_Iw14.gif" size="9732" stream="combined_Iw14.gif" tmpFilename="/usr/tmp/CGItemp36520" user="LarsEklund" version="1"

Revision 102008-12-09 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 65 to 65
 

Summary plots of I/V and C/V performance for wafer 14 (6 m BCB)

Added:
>
>
Until present 19 sensors have been teste of which 18 are inclueded in the plots. Sensor X0Y4 broke down a very low voltage and is excluded from the analysis presented here.
 I/V characteristics of all sensors

Summary of all C/V on wafer 09

Line: 75 to 77
  Depletion voltage extracted from C/V
Changed:
<
<
The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.
>
>
The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above. Sensor X0Y4 is not inclued in the depletion voltage plots since it broke down at low voltages.
  Wafer map of depletion voltages
Added:
>
>

Histogram of measured depletion voltages

Plots combining the I/V and C/V data for wafer 09 and 14

Combined depletion voltages for wafer 09 nad 14

The following plot show the reverse current at 400 V bias for all measured sensors on wafer 09 and 14.

 
Changed:
<
<
Histogram of measured depletion voltages
>
>
current at 400 V for all sensors on w 09 and w 14
  -- LarsEklund - 21 Nov 2008
Line: 120 to 128
 
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META FILEATTACHMENT attachment="biasResVia_zoom.jpg" attr="" comment="" date="1227292978" name="biasResVia_zoom.jpg" path="biasResVia_zoom.jpg" size="2274641" stream="biasResVia_zoom.jpg" tmpFilename="/usr/tmp/CGItemp36835" user="LarsEklund" version="1"
META FILEATTACHMENT attachment="biasRingVia_zoom.JPG" attr="" comment="" date="1227292990" name="biasRingVia_zoom.JPG" path="biasRingVia_zoom.JPG" size="2014198" stream="biasRingVia_zoom.JPG" tmpFilename="/usr/tmp/CGItemp36803" user="LarsEklund" version="1"
Changed:
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META FILEATTACHMENT attachment="w09_CVSummary.gif" attr="" comment="" date="1228771791" name="w09_CVSummary.gif" path="w09_CVSummary.gif" size="8142" stream="w09_CVSummary.gif" tmpFilename="/usr/tmp/CGItemp29126" user="LarsEklund" version="6"
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Changed:
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Revision 92008-12-08 - LarsEklund

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META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 43 to 43
  Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow.
Changed:
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Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)
>
>

Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)

  The scale of the I/V graph covers the range of 25 of the 26 sensors on wafer 09. Sensor X5Y3 brakes down at low voltages, see separate I/V. Sensors X5Y1, X5Y2 and X5Y4 were ramped to 600 V with leakage current of 40, 33 and 31 nA at 600V. Sensor X5Y1 was kept at 600 V for 30 min and is the only sensor that shows a clear change in reverse current over time, but with signs of saturation. See stability graph.
Line: 57 to 57
  Depletion voltage extracted from C/V
Changed:
<
<
The depletion voltage was extracted by fitting a linear function to the 1/C2 vs. Vbias graph between 200 and 400 V. The depletion voltage is defines as the point where the graph deviates more than 3% from that straight line. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.Depletion voltage could not be determined for X5Y3 due to its breakdown, hence the histograms include 25 sensors.
>
>
The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above. The depletion voltage could not be determined for X5Y3 due to its breakdown, hence the histograms include 25 sensors.
  Wafer map of depletion voltages

Histogram of measured depletion voltages

Added:
>
>

Summary plots of I/V and C/V performance for wafer 14 (6 m BCB)

I/V characteristics of all sensors

Summary of all C/V on wafer 09

1/C vs V graphs for all sensors on w09

Rs vs V summary graph

Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting two first order polynomials to the 1/C2 vs. Vbias graph. The first straight line is fitted between 0 and 30 V and the second straight line is fitted between 150 and 400 V. The depletion voltage is defined as the intersection between these two lines. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.

Wafer map of depletion voltages

Histogram of measured depletion voltages

  -- LarsEklund - 21 Nov 2008
Line: 102 to 120
 
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Changed:
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Revision 82008-12-08 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 106 to 106
 
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Revision 72008-12-08 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 10 to 10
 The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

Full wafer views

Changed:
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<
  6 %u03BCm BCB 12 %u03BCm BCB
>
>
  6 um BCB 12 um BCB
 
Electrical w14, w15 w08, w09
Mechanical w17, w18, w19 w04, w05, w16
Line: 45 to 45
  Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)
Added:
>
>
The scale of the I/V graph covers the range of 25 of the 26 sensors on wafer 09. Sensor X5Y3 brakes down at low voltages, see separate I/V. Sensors X5Y1, X5Y2 and X5Y4 were ramped to 600 V with leakage current of 40, 33 and 31 nA at 600V. Sensor X5Y1 was kept at 600 V for 30 min and is the only sensor that shows a clear change in reverse current over time, but with signs of saturation. See stability graph.
 I/V characteristics of all sensors

Summary of all C/V on wafer 09

Line: 55 to 57
  Depletion voltage extracted from C/V
Changed:
<
<
The depletion voltage was extracted by fitting a linear function to the 1/C2 vs. Vbias graph between 200 and 400 V. The depletion voltage is defines as the point where the graph deviates more than 3% from that straight line. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.
>
>
The depletion voltage was extracted by fitting a linear function to the 1/C2 vs. Vbias graph between 200 and 400 V. The depletion voltage is defines as the point where the graph deviates more than 3% from that straight line. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.Depletion voltage could not be determined for X5Y3 due to its breakdown, hence the histograms include 25 sensors.
  Wafer map of depletion voltages
Line: 100 to 102
 
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Revision 62008-12-05 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 41 to 41
 A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 um line width and spacing, increasing with 5 um for each set of lines. As seen in the overview picture all lines down to 10 um line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.

IV and CV measurments

Added:
>
>
Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow.
 Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)

I/V characteristics of all sensors

Summary of all C/V on wafer 09

Added:
>
>
1/C vs V graphs for all sensors on w09

Rs vs V summary graph

 Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting a linear function to the 1/C2 vs. Vbias graph between 200 and 400 V. The depletion voltage is defines as the point where the graph deviates more than 3% from that straight line. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.

Line: 94 to 100
 
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Revision 52008-12-04 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 38 to 38
  Bias resistor connections: resistor via, zoom
Changed:
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<
A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 %u03BCm line width and spacing, increasing with 5 %u03BCm for each set of lines. As seen in the overview picture all lines down to 10 %u03BCm line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.
>
>
A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 um line width and spacing, increasing with 5 um for each set of lines. As seen in the overview picture all lines down to 10 um line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.
 

IV and CV measurments

Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)

Changed:
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I/V of all sensors on wafer 09
>
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I/V characteristics of all sensors
 
Changed:
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Summary of all C/V on wafer 09
>
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Summary of all C/V on wafer 09
 
Changed:
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Sensor type Solid Triangular Bare Mesh 50% 50 um Mesh 50% 100um Mesh 25% 37 um
Cs, Rs, I vs. Vbias X5Y1, X3Y1, X5Y3, X3Y3 X3Y0, X2Y0, X4Y2, X1Y2, X4Y4, X1Y4 X2Y2, X0Y2, X2Y3, X0Y3 X2Y1, X0Y1, X2Y4, X0Y4 X4Y1, X1Y1, X4Y3, X1Y3 X5Y2, X3Y2, X5Y4, X3Y4
Cs, I stability X5Y1, X3Y1, X5Y3, X3Y3 X3Y0, X2Y0, X4Y2, X1Y2, X4Y4, X1Y4 X2Y2, X0Y2, X2Y3, X0Y3 X2Y1, X0Y1, X2Y4, X0Y4 X4Y1, X1Y1, X4Y3, X1Y3 X5Y2, X3Y2, X5Y4, X3Y4
Environment X5Y1, X3Y1, X5Y3, X3Y3 X3Y0, X2Y0, X4Y2, X1Y2, X4Y4, X1Y4 X2Y2, X0Y2, X2Y3, X0Y3 X2Y1, X0Y1, X2Y4, X0Y4 X4Y1, X1Y1, X4Y3, X1Y3 X5Y2, X3Y2, X5Y4, X3Y4
>
>
Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting a linear function to the 1/C2 vs. Vbias graph between 200 and 400 V. The depletion voltage is defines as the point where the graph deviates more than 3% from that straight line. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.

Wafer map of depletion voltages

Histogram of measured depletion voltages

  -- LarsEklund - 21 Nov 2008
Line: 91 to 94
 
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Revision 42008-12-04 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 10 to 10
 The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

Full wafer views

Changed:
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  6 μm BCB 12 μm BCB
>
>
  6 %u03BCm BCB 12 %u03BCm BCB
 
Electrical w14, w15 w08, w09
Mechanical w17, w18, w19 w04, w05, w16
Line: 38 to 38
  Bias resistor connections: resistor via, zoom
Changed:
<
<
A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 μm line width and spacing, increasing with 5 μm for each set of lines. As seen in the overview picture all lines down to 10 μm line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.
>
>
A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 %u03BCm line width and spacing, increasing with 5 %u03BCm for each set of lines. As seen in the overview picture all lines down to 10 %u03BCm line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.

IV and CV measurments

Summary plots of I/V and C/V performance for wafer 09 (12 m BCB)

I/V of all sensors on wafer 09

Summary of all C/V on wafer 09

Sensor type Solid Triangular Bare Mesh 50% 50 um Mesh 50% 100um Mesh 25% 37 um
Cs, Rs, I vs. Vbias X5Y1, X3Y1, X5Y3, X3Y3 X3Y0, X2Y0, X4Y2, X1Y2, X4Y4, X1Y4 X2Y2, X0Y2, X2Y3, X0Y3 X2Y1, X0Y1, X2Y4, X0Y4 X4Y1, X1Y1, X4Y3, X1Y3 X5Y2, X3Y2, X5Y4, X3Y4
Cs, I stability X5Y1, X3Y1, X5Y3, X3Y3 X3Y0, X2Y0, X4Y2, X1Y2, X4Y4, X1Y4 X2Y2, X0Y2, X2Y3, X0Y3 X2Y1, X0Y1, X2Y4, X0Y4 X4Y1, X1Y1, X4Y3, X1Y3 X5Y2, X3Y2, X5Y4, X3Y4
Environment X5Y1, X3Y1, X5Y3, X3Y3 X3Y0, X2Y0, X4Y2, X1Y2, X4Y4, X1Y4 X2Y2, X0Y2, X2Y3, X0Y3 X2Y1, X0Y1, X2Y4, X0Y4 X4Y1, X1Y1, X4Y3, X1Y3 X5Y2, X3Y2, X5Y4, X3Y4
  -- LarsEklund - 21 Nov 2008
Line: 79 to 91
 
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Revision 32008-11-21 - LarsEklund

Line: 1 to 1
 
META TOPICPARENT name="WebHome"

Wafer and sensor numbering scheme

Line: 14 to 14
 
Electrical w14, w15 w08, w09
Mechanical w17, w18, w19 w04, w05, w16
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Close-up views on a few sensors
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Close-up views on a few sensors on w14
  Meshed GND plane, full view
Line: 28 to 28
  Triangular GND plane, full view
Added:
>
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Close-up views on a few features on w14

Ground planes: solid, meshed, meshed (bond pad)

Bias and guard ring connections: bias and guard rings, bias ring via, bias bond (triangular), bias bond (meshed)

Strip connections: overview, zoom 1, zoom 2, zoom 3, bond pad, double vias

Bias resistor connections: resistor via, zoom

A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 μm line width and spacing, increasing with 5 μm for each set of lines. As seen in the overview picture all lines down to 10 μm line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.

 -- LarsEklund - 21 Nov 2008

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Line: 49 to 61
 
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Revision 22008-11-21 - LarsEklund

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Wafer and sensor numbering scheme

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Sensor number scheme

 

Photos at reception of Run 1 wafers

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Full wafer views:
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The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

Full wafer views

 
  6 μm BCB 12 μm BCB
Electrical w14, w15 w08, w09
Mechanical w17, w18, w19 w04, w05, w16
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Delivery report from Acreo

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Close-up views on a few sensors

Meshed GND plane, full view

Bias bond, close-up

Meshed GND plane, top half

Meshed GND plane, full view

Solid GND plane, top half

Triangular GND plane, full view

  -- LarsEklund - 21 Nov 2008
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Revision 12008-11-21 - LarsEklund

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Photos at reception of Run 1 wafers

Full wafer views:

  6 μm BCB 12 μm BCB
Electrical w14, w15 w08, w09
Mechanical w17, w18, w19 w04, w05, w16

Delivery report from Acreo

-- LarsEklund - 21 Nov 2008

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