Whole wafer photos at reception

Four electrical grade wafers with three hybrids on each one were delivered, and one failed wafer (w08) was supplied as a mechanical sample. Only defects spotted in the visual inspection was varioius scratches on the top metal layer, and a few (~3) bubbles in the BCB. All hybrids on the electrical grade wafers look fully OK from the visual inspection. Whole-wafer photos from reception:

Wafer 01

Wafer 03

Wafer 04

Wafer 06

Wafer 08 (delivered as mechanical sample)

Detailed view of wafer 03

Signal input pads

Power inputs

Middle chips

Lower row chips

Serial power circuit

-- LarsEklund - 2010-06-18

Topic attachments
I Attachment History Action Size Date Who Comment
Unknown file formatJPG Wafer01_reception.JPG r1 manage 749.9 K 2010-06-18 - 10:39 LarsEklund  
Unknown file formatJPG Wafer03_reception.JPG r1 manage 744.6 K 2010-06-18 - 10:39 LarsEklund  
Unknown file formatJPG Wafer04_reception.JPG r1 manage 736.4 K 2010-06-18 - 10:41 LarsEklund  
Unknown file formatJPG Wafer06_reception.JPG r1 manage 735.2 K 2010-06-18 - 10:39 LarsEklund  
Unknown file formatJPG Wafer08_reception.JPG r1 manage 769.9 K 2010-06-18 - 10:39 LarsEklund  
Unknown file formatJPG w03_LowerRowChip.JPG r1 manage 693.0 K 2010-06-18 - 10:38 LarsEklund  
Unknown file formatJPG w03_MiddleChips.JPG r1 manage 608.4 K 2010-06-18 - 10:38 LarsEklund  
Unknown file formatJPG w03_PowerInputs.JPG r1 manage 679.2 K 2010-06-18 - 10:38 LarsEklund  
Unknown file formatJPG w03_SerPowCircuit.JPG r1 manage 964.3 K 2010-06-18 - 10:38 LarsEklund  
Unknown file formatJPG w03_SignalInput.JPG r1 manage 424.3 K 2010-06-18 - 10:39 LarsEklund  
Topic revision: r1 - 2010-06-18 - LarsEklund
 
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