Whole wafer photos at reception

Four electrical grade wafers with three hybrids on each one were delivered, and one failed wafer (w08) was supplied as a mechanical sample. Only defects spotted in the visual inspection was varioius scratches on the top metal layer, and a few (~3) bubbles in the BCB. All hybrids on the electrical grade wafers look fully OK from the visual inspection. Whole-wafer photos from reception:

Wafer 01

Wafer 03

Wafer 04

Wafer 06

Wafer 08 (delivered as mechanical sample)

Detailed view of wafer 03

Signal input pads

Power inputs

Middle chips

Lower row chips

Serial power circuit

-- LarsEklund - 2010-06-18