Difference: MCMD (30 vs. 31)

Revision 312010-07-21 - LarsEklund

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META TOPICPARENT name="ResearchResults"

Thin film hybrid in MCM-D technology

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 Specification of first version

Photos at reception of first thin film hybrid batch

Study of the PWR-GND short

Post processing of sensor wafer: Run 1

Processing on electrical and mechanical grade sensor wafers to investigate the influence on the sensor performance. The processing involved a single metal layer, with the cross-section shown in the figure below.

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