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Wafer and sensor numbering scheme

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Sensor number scheme

Photos at reception of Run 1 wafers

The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias rails. Bond tests and tuning were done on the large metallised area at the bottom of w09. The bonds are visible in the photos. The bias bond locations are described in BiasBonds.pdf.

Full wafer views

  6 %u03BCm BCB 12 %u03BCm BCB
Electrical w14, w15 w08, w09
Mechanical w17, w18, w19 w04, w05, w16

Close-up views on a few sensors on w14

Meshed GND plane, full view

Bias bond, close-up

Meshed GND plane, top half

Meshed GND plane, full view

Solid GND plane, top half

Triangular GND plane, full view

Close-up views on a few features on w14

Ground planes: solid, meshed, meshed (bond pad)

Bias and guard ring connections: bias and guard rings, bias ring via, bias bond (triangular), bias bond (meshed)

Strip connections: overview, zoom 1, zoom 2, zoom 3, bond pad, double vias

Bias resistor connections: resistor via, zoom

A set of lines with decreasing line width and spacing were put on the mask to assess the resolution of the process. Starting with 10 lines of 5 um line width and spacing, increasing with 5 um for each set of lines. As seen in the overview picture all lines down to 10 um line width and spacing were correctly reproduced. However, the smallest pitch region became merged into one solid metallisation as can be seen in the close-up.

IV and CV measurments

Summary plots of I/V and C/V performance for wafer 09 (12 µm BCB)

I/V characteristics of all sensors

Summary of all C/V on wafer 09

Depletion voltage extracted from C/V

The depletion voltage was extracted by fitting a linear function to the 1/C2 vs. Vbias graph between 200 and 400 V. The depletion voltage is defines as the point where the graph deviates more than 3% from that straight line. The depletion voltage is displayed both as a histogram and as a map where the depletion voltage is displayed in its position on the wafer, with coordinates as defined in the figure above.

Wafer map of depletion voltages

Histogram of measured depletion voltages

-- LarsEklund - 21 Nov 2008

Topic attachments
I Attachment History Action Size Date Who Comment
PDFpdf BiasBonds.pdf r1 manage 628.6 K 2008-11-21 - 15:28 LarsEklund  
PDFpdf SensorNumbering.pdf r1 manage 346.5 K 2008-11-21 - 15:23 LarsEklund  
JPEGjpg biasBonds_mesh.jpg r1 manage 1939.0 K 2008-11-21 - 18:14 LarsEklund  
JPEGjpg biasBonds_tri.jpg r1 manage 1769.3 K 2008-11-21 - 18:14 LarsEklund  
JPEGjpg biasGuardRings.jpg r1 manage 1950.0 K 2008-11-21 - 18:14 LarsEklund  
JPEGjpg biasResVia_zoom.jpg r1 manage 2221.3 K 2008-11-21 - 18:42 LarsEklund  
JPEGjpg biasResVias.jpg r1 manage 1901.1 K 2008-11-21 - 18:15 LarsEklund  
JPEGjpg biasRingVia_zoom.JPG r1 manage 1967.0 K 2008-11-21 - 18:43 LarsEklund  
JPEGjpg bondPad.jpg r1 manage 1897.3 K 2008-11-21 - 18:16 LarsEklund  
JPEGjpg doubleVias.jpg r1 manage 1873.4 K 2008-11-21 - 18:16 LarsEklund  
JPEGjpg lineResolution.jpg r1 manage 2707.7 K 2008-11-21 - 18:16 LarsEklund  
JPEGjpg lineResolution_zoom.jpg r1 manage 2238.2 K 2008-11-21 - 18:16 LarsEklund  
JPEGjpg meshGNDPlane_w14_X0Y1.JPG r1 manage 1523.3 K 2008-11-21 - 15:31 LarsEklund  
JPEGjpg meshGNDPlane_w14_X3Y2.JPG r1 manage 2120.5 K 2008-11-21 - 15:31 LarsEklund  
JPEGjpg meshGNDPlane_w14_X4Y1.JPG r1 manage 1977.7 K 2008-11-21 - 15:32 LarsEklund  
JPEGjpg meshGNDPlane_w14_X4Y2.JPG r1 manage 1307.7 K 2008-11-21 - 15:32 LarsEklund  
JPEGjpg meshedGNDPlane.jpg r1 manage 1771.8 K 2008-11-21 - 18:17 LarsEklund  
JPEGjpg meshedGNDPlane_withBondPad.jpg r1 manage 1755.0 K 2008-11-21 - 18:17 LarsEklund  
JPEGjpg meshedGNDPlane_withBondPad2.jpg r1 manage 1874.4 K 2008-11-21 - 18:17 LarsEklund  
JPEGjpg sensorOverviewNumbered.jpg r1 manage 178.0 K 2008-11-21 - 15:25 LarsEklund  
JPEGjpg solidGNDPlane.jpg r1 manage 1707.4 K 2008-11-21 - 18:17 LarsEklund  
JPEGjpg solidGNDPlane_w14_X3Y1.JPG r1 manage 2101.8 K 2008-11-21 - 15:43 LarsEklund  
JPEGjpg stripPadConnections.jpg r1 manage 2016.9 K 2008-11-21 - 18:18 LarsEklund  
JPEGjpg stripPadConnections_zoom1.jpg r1 manage 1871.6 K 2008-11-21 - 18:18 LarsEklund  
JPEGjpg stripPadConnections_zoom2.jpg r1 manage 1982.4 K 2008-11-21 - 18:18 LarsEklund  
JPEGjpg stripPadConnections_zoom3.jpg r1 manage 2468.9 K 2008-11-21 - 18:18 LarsEklund  
JPEGjpg triGNDPlane_w14_X3Y0.JPG r1 manage 2165.5 K 2008-11-21 - 15:43 LarsEklund  
JPEGjpg w04_12umBCBMechanical_atReception.JPG r1 manage 2386.5 K 2008-11-21 - 12:21 LarsEklund  
JPEGjpg w05_12umBCBMechanical_atReception.JPG r1 manage 2448.2 K 2008-11-21 - 12:21 LarsEklund  
JPEGjpg w08_12umBCBElectrical_atReception.JPG r1 manage 2381.8 K 2008-11-21 - 12:24 LarsEklund  
JPEGjpg w09_12umBCBElectrical_atReception.JPG r1 manage 2381.0 K 2008-11-21 - 12:24 LarsEklund  
GIFgif w09_CVSummary.gif r2 r1 manage 8.6 K 2008-12-04 - 19:16 LarsEklund  
GIFgif w09_IVSummary.gif r2 r1 manage 10.4 K 2008-12-04 - 19:24 LarsEklund  
GIFgif w09_VdepHisto.gif r1 manage 5.1 K 2008-12-04 - 19:16 LarsEklund  
GIFgif w09_VdepMap.gif r1 manage 14.6 K 2008-12-04 - 19:17 LarsEklund  
JPEGjpg w14_6umBCBElectrical_atReception.JPG r1 manage 2357.0 K 2008-11-21 - 12:24 LarsEklund  
JPEGjpg w15_6umBCBElectrical_atReception.JPG r1 manage 2338.5 K 2008-11-21 - 12:24 LarsEklund  
JPEGjpg w16_12umBCBMechanical_atReception.JPG r1 manage 2331.5 K 2008-11-21 - 12:24 LarsEklund  
JPEGjpg w17_6umBCBMechanical_atReception.JPG r1 manage 2367.5 K 2008-11-21 - 12:25 LarsEklund  
JPEGjpg w18_6umBCBMechanical_atReception.JPG r1 manage 2350.4 K 2008-11-21 - 12:25 LarsEklund  
JPEGjpg w19_6umBCBMechanical_atReception.JPG r1 manage 2412.7 K 2008-11-21 - 12:25 LarsEklund  
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Topic revision: r5 - 2008-12-04 - LarsEklund
 
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