Thin film hybrid in MCM-D technology

Photos at reception of first thin film hybrid batch

Wafer and sensor numbering scheme Run 1

The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.

Electrical measurements of Run 1

I/V and C/V measurements of all sensors before dicing

I/V measurements of all sensors after dicing

Inter-strip capacitance measurements of all sensors before dicing

Capacitance between strip and GND plane

Summary of capacitive load measurements

Inter-strip resistiance

Punch-through measurement

Documentation and photos

Photos at reception of the wafers

Bias bonds on measured wafers

Yield measurements

Reference documents and presentations

Mechanical measurements

Sensor flatness

Mechanical measurements for Wafers 4 and 17

Sensors w04

Sensors w17

Thin film hybrid

Specification of first version

-- LarsEklund - 21 Nov 2008