Difference: Assemblies (1 vs. 14)

Revision 142014-09-30 - KennyWraight

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META TOPICPARENT name="Modules"
25/07/2012
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Sensor - Die attachment detail

Changed:
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<		Assembly 1: 2873-18: SE4 (slim edge) - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
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Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details Comments
Ass1 2873-18 CERN Pixel II SE4 (slim edge) 250x50 DC 300 V6ABC1H 15 200 VTT bumps, VTT UBM Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
Ass2 2873-18 CERN Pixel II SE3 (slim edge) 250x50 DC 300 V6ABC1H 8 200 VTT bumps, VTT UBM  
Ass3 2873-18 CERN Pixel II SC3 250x50 DC 300 V6ABC1H 10 200 VTT bumps, VTT UBM  
Ass4 2873-18 CERN Pixel II SC4 250x50 DC 300 V6ABC1H 11 200 VTT bumps, VTT UBM  
Ass5 2873-18 CERN Pixel II SC5 250x50 DC 300 V6ABC1H 16 200 VTT bumps, VTT UBM  
Ass6 2873-18 CERN Pixel II SC6 250x50 DC 300 V6ABC1H 17 200 VTT bumps, VTT UBM ROIC has a dirty backside (ahem!)
Ass7 2873-18 CERN Pixel II SC9 250x50 DC 300 V6ABC1H 33 200 VTT bumps, VTT UBM  
Ass8 2873-18 CERN Pixel II SC10 250x50 DC 300 V6ABC1H 34 200 VTT bumps, VTT UBM  
Ass9 2615-19 CERN Pixel IV SC3 500x25 DC 300 V6ABC1H 25 200 VTT bumps, VTT UBM  
Ass10 2615-19 CERN Pixel IV SC4 500x25 DC 300 V6ABC1H 27 200 VTT bumps, VTT UBM  
Ass11 2935-21 CERN Pixel IV SC3 500x25 DC 300 V6ABC1H 2 200 VTT bumps, VTT UBM  
Ass12 2935-21 CERN Pixel IV SC4 500x25 DC 300 V6ABC1H 41 200 VTT bumps, VTT UBM  
Ass13 2873-19 CERN Pixel II SE2 (slim edge) 250x50 DC 300 V6ABC1H 31 200 VTT bumps, VTT UBM  
Ass14 2873-19 CERN Pixel II SE1 (slim edge) 250x50 DC 300 V6ABC1H 37 200 VTT bumps, VTT UBM  
Ass15 2873-19 CERN Pixel II SC9 (production) 250x50 DC 300 V6ABC1H 38 200 VTT bumps, VTT UBM  
Ass16 2873-19 CERN Pixel II SC1 250x50 DC 300 VBABAXH 1 750 VTT bumps, VTT UBM  
Ass17 2873-19 CERN Pixel II SC2 250x50 DC 300 VBABAXH 2 750 VTT bumps, VTT UBM  
Ass18 2873-19 CERN Pixel II SC4 250x50 DC 300 VBABAXH 3 750 VTT bumps, VTT UBM  
Ass19 2873-19 CERN Pixel II SC5 250x50 DC 300 VBABAXH 6 750 VTT bumps, VTT UBM  
Ass20 2873-19 CERN Pixel II SC6 250x50 DC 300 VBABAXH 7 750 VTT bumps, VTT UBM  
Ass21 2615-19 CERN Pixel IV SC1 250x50 DC 300 VBABAXH 49 750 VTT bumps, VTT UBM  
Q1 2615-19 CERN Pixel IV Q4 #N/A DC 300 V6ABC1H 19, 20, 22, 24 200 VTT bumps, VTT UBM  
Q2 2935-21 CERN Pixel IV Q2 (slim edge) #N/A DC 300 VZABC8H 8, 9, 11, 14 750 VTT bumps, VTT UBM  
Q3 2935-21 CERN Pixel IV Q4 #N/A DC 300 VZABC8H 16, 18, 19, 20 750 VTT bumps, VTT UBM  
Q4 2935-21 CERN Pixel IV Q3 #N/A DC 300 VZABC8H 51, 53, 58, 33 750 VTT bumps, VTT UBM  
Q5 2433-14 CERN Pixel IV Q5 #N/A DC 300 VBABAXH 48, 38, 55, 47 750 VTT bumps, VTT UBM  
Q6 2433-14 CERN Pixel IV Q2 #N/A DC 300 VBABAXH 33, 18, 19, 22 750 VTT bumps, VTT UBM  
Q7 2433-14 CERN Pixel IV Q4 #N/A DC 300 VBABAXH 34, 43, 44, 42 750 VTT bumps, VTT UBM  
3072-3#8 3072-3 CERN Pixel V 8 250x50 DC 310 V6B8WUH 1 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#14 3072-3 CERN Pixel V 14 2000x25 DC 310 V6B8WUH 2 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#16 3072-3 CERN Pixel V 16 2000x25 DC 310 V6B8WUH 4 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#17 3072-3 CERN Pixel V 17 500x25 DC 310 V6B8WUH 13 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#19 3072-3 CERN Pixel V 19 500x25 DC 310 V6B8WUH 17 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#21 3072-3 CERN Pixel V 21 167x125 DC 310 V6B8WUH 27 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#23 3072-3 CERN Pixel V 23 167x125 DC 310 V6B8WUH 30 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#26 3072-3 CERN Pixel V 26 125x100 DC 310 V6B8WUH 18 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-3#28 3072-3 CERN Pixel V 28 125x100 DC 310 V6B8WUH 22 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#6 3072-4 CERN Pixel V 6 250x50 DC 310 V6B8WUH 32 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#8 3072-4 CERN Pixel V 8 250x50 DC 310 V6B8WUH 35 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#17 3072-4 CERN Pixel V 17 500x25 DC 310 V6B8WUH 38 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#19 3072-4 CERN Pixel V 19 500x25 DC 310 V6B8WUH 40 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#21 3072-4 CERN Pixel V 21 167x125 DC 310 V6B8WUH 45 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#23 3072-4 CERN Pixel V 23 167x125 DC 310 V6B8WUH 51 750 Leti bumps, Advacam Ti/W/Pt UBM  
3072-4#26 3072-4 CERN Pixel V 26 125x100 DC 310 V6B8WUH 53 750 Leti bumps, Advacam Ti/W/Pt UBM  
2433-15♯Q2 2433-15 CERN Pixel IV Q2 #N/A DC 300 VWB6IVH 25, 29, 32, 33 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15♯Q3 2433-15 CERN Pixel IV Q3 #N/A DC 300 VWB6IVH 36, 38, 42, 43 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15♯Q4 2433-15 CERN Pixel IV Q4 #N/A DC 300 VWB6IVH 44, 46, 50, 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2935-18♯Q2 2433-18 CERN Pixel IV Q2 #N/A DC 300 VWB6IVH 15, 16, 17, 24 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2935-18#Q4 2935-18 CERN Pixel IV Q4 #N/A DC 300 VMB8WDH 2, 7, 9, 10 750 Leti bumps, Advacam Ti/W/Pt UBM  
2615-18#Q2 2615-18 CERN Pixel IV Q2 #N/A DC 300 VMB8WDH 14, 15, 17, 18 750 Leti bumps, Advacam Ti/W/Pt UBM  
2615-18#Q3 2615-18 CERN Pixel IV Q3 #N/A DC 300 VMB8WDH 19, 24, 29, 30 750 Leti bumps, Advacam Ti/W/Pt UBM  
2615-18#Q1 2615-18 CERN Pixel IV Q1 #N/A DC 300 VMB8WDH 1, 31, 39, 43 750 Leti bumps, Advacam Ti/W/Pt UBM  
2935-18#Q1 2935-18 CERN Pixel IV Q1 #N/A DC 300 VMB8WDH (1&2)/V6B8WUH (3&4) 44, 45, 56, 57 750 Leti bumps, Advacam Ti/W/Pt UBM  
2935-18#Q5 2935-18 CERN Pixel IV Q5 #N/A DC 300 V6B8WUH 58, 41, 26, 57 750 Leti bumps, Advacam Ti/W/Pt UBM  
2433-15#SC1 2433-15 CERN Pixel IV SC1 250x50 DC 300 VWB6IVH 1 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15#SC3 2433-15 CERN Pixel IV SC3 500x25 DC 300 VWB6IVH 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15#SC5 2433-15 CERN Pixel IV SC5 250x50 DC 300 VWB6IVH 5 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2615-18#SC6 2615-18 CERN Pixel IV SC6 250x50 DC 300 VWB6IVH 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
14-07-24-S2 2873-8 CERN Pixel II SE3 250x50 DC 300       RAL In bumps (bond force: 20kg)  
14-07-25-S2 2873-8 CERN Pixel II SC2 250x50 DC 300       RAL In bumps (bond force: 10kg)  
14-07-25-S4 2873-8 CERN Pixel II SC12 250x50 DC 300       RAL In bumps (bond force 5kg)  
2873-25-S5 2873-25 CERN Pixel V 5 250x50 AC 310 VWB6IVH 7, 7, 7, 7 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S6 2873-25 CERN Pixel V 6 250x50 DC 310 VWB6IVH 6, 6, 6, 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S9 2873-25 CERN Pixel V 9 2000x50 DC 310 VWB6IVH 3, 3, 3, 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S10 2873-25 CERN Pixel V 10 2000x50 AC 310 VWB6IVH 13, 13, 13, 13 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S13 2873-25 CERN Pixel V 13 2000x25 AC 310 VWB6IVH 30, 30, 30, 30 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S14 2873-25 CERN Pixel V 14 2000x25 DC 310 VWB6IVH 31, 31, 31, 31 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S17 2873-25 CERN Pixel V 17 500x25 DC 310 VWB6IVH 54, 54, 54, 54 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S18 2873-25 CERN Pixel V 18 500x25 AC 310 VWB6IVH 46, 46, 46, 46 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S23 2873-25 CERN Pixel V 23 167x125 DC 310 VWB6IVH 53, 53, 53, 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S24 2873-25 CERN Pixel V 24 167x125 AC 310 VWB6IVH 47, 47, 47, 47 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S25 2873-25 CERN Pixel V 25 125x100 AC 310 VWB6IVH 42, 42, 42, 42 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2873-25-S26 2873-25 CERN Pixel V 26 125x100 DC 310 VWB6IVH 39, 39, 39, 39 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM  
2433-15-SC2 2433-15 CERN Pixel IV SC2 50x250 DC 300 ABPJXGH 49 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL  
2433-15-SC3 2433-15 CERN Pixel IV SC3 25x500 DC 300 ABPJXGH 16 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL  
 
Deleted:
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Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
Ass1 2873-18 CERN Pixel II SE4 250x50 DC 300 V6ABC1H 15 200 VTT bumps, VTT UBM
| Ass2 | 2873-18 | CERN Pixel II | SE3 | 250x50 | DC | 300 | V6ABC1H 8 200 VTT bumps, VTT UBM | Ass3 | 2873-18 | CERN Pixel II | SC3 | 250x50 | DC | 300 | V6ABC1H 10 200 VTT bumps, VTT UBM | Ass4 | 2873-18 | CERN Pixel II | SC4 | 250x50 | DC | 300 | V6ABC1H 11 200 VTT bumps, VTT UBM | Ass5 | 2873-18 | CERN Pixel II | SC5 | 250x50 | DC | 300 | V6ABC1H 16 200 VTT bumps, VTT UBM | Ass6 | 2873-18 | CERN Pixel II | SC6 | 250x50 | DC | 300 | V6ABC1H 17 200 VTT bumps, VTT UBM | Ass7 | 2873-18 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 33 200 VTT bumps, VTT UBM | Ass8 | 2873-18 | CERN Pixel II | SC10 | 250x50 | DC | 300 | V6ABC1H 34 200 VTT bumps, VTT UBM | Ass9 | 2615-19 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 25 200 VTT bumps, VTT UBM | Ass10 | 2615-19 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 27 200 VTT bumps, VTT UBM | Ass11 | 2935-21 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 2 200 VTT bumps, VTT UBM | Ass12 | 2935-21 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 41 200 VTT bumps, VTT UBM | Ass13 | 2873-19 | CERN Pixel II | SE2 | 250x50 | DC | 300 | V6ABC1H 31 200 VTT bumps, VTT UBM | Ass14 | 2873-19 | CERN Pixel II | SE1 | 250x50 | DC | 300 | V6ABC1H 37 200 VTT bumps, VTT UBM | Ass15 | 2873-19 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 38 200 VTT bumps, VTT UBM | Ass16 | 2873-19 | CERN Pixel II | SC1 | 250x50 | DC | 300 | VBABAXH 1 750 VTT bumps, VTT UBM | Ass17 | 2873-19 | CERN Pixel II | SC2 | 250x50 | DC | 300 | VBABAXH 2 750 VTT bumps, VTT UBM | Ass18 | 2873-19 | CERN Pixel II | SC4 | 250x50 | DC | 300 | VBABAXH 3 750 VTT bumps, VTT UBM | Ass19 | 2873-19 | CERN Pixel II | SC5 | 250x50 | DC | 300 | VBABAXH 6 750 VTT bumps, VTT UBM | Ass20 | 2873-19 | CERN Pixel II | SC6 | 250x50 | DC | 300 | VBABAXH 7 750 VTT bumps, VTT UBM | Ass21 | 2615-19 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VBABAXH 49 750 VTT bumps, VTT UBM | Q1 | 2615-19 | CERN Pixel IV | Q4 | #N/A | DC | 300 | V6ABC1H 19 20 22 24 200 VTT bumps, VTT UBM | Q2 | 2935-21 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VZABC8H 8 9 11 14 750 VTT bumps, VTT UBM | Q3 | 2935-21 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VZABC8H 16 18 19 20 750 VTT bumps, VTT UBM | Q4 | 2935-21 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VZABC8H 51 53 58 33 750 VTT bumps, VTT UBM | Q5 | 2433-14 | CERN Pixel IV | Q5 | #N/A | DC | 300 | VBABAXH 48 38 55 47 750 VTT bumps, VTT UBM | Q6 | 2433-14 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VBABAXH 33 18 19 22 750 VTT bumps, VTT UBM | Q7 | 2433-14 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VBABAXH 34 43 44 42 750 VTT bumps, VTT UBM | 3072-3#8 | 3072-3 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 1 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#14 | 3072-3 | CERN Pixel V | 14 | 2000x25 | DC | 310 | V6B8WUH 2 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#16 | 3072-3 | CERN Pixel V | 16 | 2000x25 | DC | 310 | V6B8WUH 4 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#17 | 3072-3 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 13 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#19 | 3072-3 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 17 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#21 | 3072-3 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 27 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#23 | 3072-3 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 30 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#26 | 3072-3 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 18 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#28 | 3072-3 | CERN Pixel V | 28 | 125x100 | DC | 310 | V6B8WUH 22 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#6 | 3072-4 | CERN Pixel V | 6 | 250x50 | DC | 310 | V6B8WUH 32 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#8 | 3072-4 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 35 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#17 | 3072-4 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 38 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#19 | 3072-4 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 40 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#21 | 3072-4 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 45 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#23 | 3072-4 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 51 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#26 | 3072-4 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 53 750 Leti bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q2 | 2433-15 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 25 29 32 33 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q3 | 2433-15 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VWB6IVH 36 38 42 43 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q4 | 2433-15 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VWB6IVH 44 46 50 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2935-18♯Q2 | 2433-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 15 16 17 24 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2935-18#Q4 | 2935-18 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VMB8WDH 2 7 9 10 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q2 | 2615-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VMB8WDH 14 15 17 18 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q3 | 2615-18 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VMB8WDH 19 24 29 30 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q1 | 2615-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH 1 31 39 43 750 Leti bumps, Advacam Ti/W/Pt UBM | 2935-18#Q1 | 2935-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH (1&2)/V6B8WUH (3&4) 44 45 56 57 750 Leti bumps, Advacam Ti/W/Pt UBM | 2935-18#Q5 | 2935-18 | CERN Pixel IV | Q5 | #N/A | DC | 300 | V6B8WUH 58 41 26 57 750 Leti bumps, Advacam Ti/W/Pt UBM | 2433-15#SC1 | 2433-15 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VWB6IVH | 1 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15#SC3 | 2433-15 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | VWB6IVH | 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15#SC5 | 2433-15 | CERN Pixel IV | SC5 | 250x50 | DC | 300 | VWB6IVH | 5 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2615-18#SC6 | 2615-18 | CERN Pixel IV | SC6 | 250x50 | DC | 300 | VWB6IVH | 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 14-07-24-S2 | 2873-8 | CERN Pixel II | SE3 | 250x50 | DC | 300 | | RAL In bumps (bond force: 20kg) | 14-07-25-S2 | 2873-8 | CERN Pixel II | SC2 | 250x50 | DC | 300 | | RAL In bumps (bond force: 10kg) | 14-07-25-S4 | 2873-8 | CERN Pixel II | SC12 | 250x50 | DC | 300 | | RAL In bumps (bond force 5kg) | 2873-25-S5 | 2873-25 | CERN Pixel V | 5 | 250x50 | AC | 310 | VWB6IVH | 7 7 7 7 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S6 | 2873-25 | CERN Pixel V | 6 | 250x50 | DC | 310 | VWB6IVH | 6 6 6 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S9 | 2873-25 | CERN Pixel V | 9 | 2000x50 | DC | 310 | VWB6IVH | 3 3 3 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S10 | 2873-25 | CERN Pixel V | 10 | 2000x50 | AC | 310 | VWB6IVH | 13 13 13 13 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S13 | 2873-25 | CERN Pixel V | 13 | 2000x25 | AC | 310 | VWB6IVH | 30 30 30 30 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S14 | 2873-25 | CERN Pixel V | 14 | 2000x25 | DC | 310 | VWB6IVH | 31 31 31 31 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S17 | 2873-25 | CERN Pixel V | 17 | 500x25 | DC | 310 | VWB6IVH | 54 54 54 54 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S18 | 2873-25 | CERN Pixel V | 18 | 500x25 | AC | 310 | VWB6IVH | 46 46 46 46 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S23 | 2873-25 | CERN Pixel V | 23 | 167x125 | DC | 310 | VWB6IVH | 53 53 53 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S24 | 2873-25 | CERN Pixel V | 24 | 167x125 | AC | 310 | VWB6IVH | 47 47 47 47 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S25 | 2873-25 | CERN Pixel V | 25 | 125x100 | AC | 310 | VWB6IVH | 42 42 42 42 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S26 | 2873-25 | CERN Pixel V | 26 | 125x100 | DC | 310 | VWB6IVH | 39 39 39 39 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15-SC2 | 2433-15 | CERN Pixel IV | SC2 | 50x250 | DC | 300 | ABPJXGH | 49 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL | 2433-15-SC3 | 2433-15 | CERN Pixel IV | SC3 | 25x500 | DC | 300 | ABPJXGH | 16 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL

Assembly 2: 2873-18: SE3 (slim edge) - V6ABC1H Die 8

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly3: 2873-18: SC3 - V6ABC1H Die 10

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly5: 2873-18: SC5 - V6ABC1H Die 16

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside (ahem!)

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 9: 2615-19: SC3 (25x500) - V6ABC1H Die 25

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly10: 2615-19: SC4 (25x500) - V6ABC1H Die 27

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly13: 2873-19: SE2 (slim edge) - V6ABC1H Die 31

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly14: 2873-19: SE1 (slim edge) - V6ABC1H Die 37

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly15: 2873-19: SC9 (production) - V6ABC1H Die 38

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Planned assemblies to take us to the end of the stardard items in VTT order 1

Assembly Q4: 2935-21: Quad3 - V6ABC1H

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q5: 2615-19: Quad1 - VBABAXH

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
 
ROIC only on SCC

Revision 132014-09-29 - KennyWraight

Line: 1 to 1
 
META TOPICPARENT name="Modules"
25/07/2012
Line: 27 to 27
 

Sensor - Die attachment detail

Changed:
<
<		Assembly 1: 2873-18: SE4 (slim edge) - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
>
>		Assembly 1: 2873-18: SE4 (slim edge) - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
 
Changed:
<
<		Assembly 2: 2873-18: SE3 (slim edge) - V6ABC1H Die 8
>
>
Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
Ass1 2873-18 CERN Pixel II SE4 250x50 DC 300 V6ABC1H 15 200 VTT bumps, VTT UBM
| Ass2 | 2873-18 | CERN Pixel II | SE3 | 250x50 | DC | 300 | V6ABC1H 8 200 VTT bumps, VTT UBM | Ass3 | 2873-18 | CERN Pixel II | SC3 | 250x50 | DC | 300 | V6ABC1H 10 200 VTT bumps, VTT UBM | Ass4 | 2873-18 | CERN Pixel II | SC4 | 250x50 | DC | 300 | V6ABC1H 11 200 VTT bumps, VTT UBM | Ass5 | 2873-18 | CERN Pixel II | SC5 | 250x50 | DC | 300 | V6ABC1H 16 200 VTT bumps, VTT UBM | Ass6 | 2873-18 | CERN Pixel II | SC6 | 250x50 | DC | 300 | V6ABC1H 17 200 VTT bumps, VTT UBM | Ass7 | 2873-18 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 33 200 VTT bumps, VTT UBM | Ass8 | 2873-18 | CERN Pixel II | SC10 | 250x50 | DC | 300 | V6ABC1H 34 200 VTT bumps, VTT UBM | Ass9 | 2615-19 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 25 200 VTT bumps, VTT UBM | Ass10 | 2615-19 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 27 200 VTT bumps, VTT UBM | Ass11 | 2935-21 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 2 200 VTT bumps, VTT UBM | Ass12 | 2935-21 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 41 200 VTT bumps, VTT UBM | Ass13 | 2873-19 | CERN Pixel II | SE2 | 250x50 | DC | 300 | V6ABC1H 31 200 VTT bumps, VTT UBM | Ass14 | 2873-19 | CERN Pixel II | SE1 | 250x50 | DC | 300 | V6ABC1H 37 200 VTT bumps, VTT UBM | Ass15 | 2873-19 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 38 200 VTT bumps, VTT UBM | Ass16 | 2873-19 | CERN Pixel II | SC1 | 250x50 | DC | 300 | VBABAXH 1 750 VTT bumps, VTT UBM | Ass17 | 2873-19 | CERN Pixel II | SC2 | 250x50 | DC | 300 | VBABAXH 2 750 VTT bumps, VTT UBM | Ass18 | 2873-19 | CERN Pixel II | SC4 | 250x50 | DC | 300 | VBABAXH 3 750 VTT bumps, VTT UBM | Ass19 | 2873-19 | CERN Pixel II | SC5 | 250x50 | DC | 300 | VBABAXH 6 750 VTT bumps, VTT UBM | Ass20 | 2873-19 | CERN Pixel II | SC6 | 250x50 | DC | 300 | VBABAXH 7 750 VTT bumps, VTT UBM | Ass21 | 2615-19 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VBABAXH 49 750 VTT bumps, VTT UBM | Q1 | 2615-19 | CERN Pixel IV | Q4 | #N/A | DC | 300 | V6ABC1H 19 20 22 24 200 VTT bumps, VTT UBM | Q2 | 2935-21 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VZABC8H 8 9 11 14 750 VTT bumps, VTT UBM | Q3 | 2935-21 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VZABC8H 16 18 19 20 750 VTT bumps, VTT UBM | Q4 | 2935-21 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VZABC8H 51 53 58 33 750 VTT bumps, VTT UBM | Q5 | 2433-14 | CERN Pixel IV | Q5 | #N/A | DC | 300 | VBABAXH 48 38 55 47 750 VTT bumps, VTT UBM | Q6 | 2433-14 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VBABAXH 33 18 19 22 750 VTT bumps, VTT UBM | Q7 | 2433-14 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VBABAXH 34 43 44 42 750 VTT bumps, VTT UBM | 3072-3#8 | 3072-3 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 1 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#14 | 3072-3 | CERN Pixel V | 14 | 2000x25 | DC | 310 | V6B8WUH 2 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#16 | 3072-3 | CERN Pixel V | 16 | 2000x25 | DC | 310 | V6B8WUH 4 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#17 | 3072-3 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 13 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#19 | 3072-3 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 17 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#21 | 3072-3 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 27 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#23 | 3072-3 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 30 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#26 | 3072-3 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 18 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#28 | 3072-3 | CERN Pixel V | 28 | 125x100 | DC | 310 | V6B8WUH 22 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#6 | 3072-4 | CERN Pixel V | 6 | 250x50 | DC | 310 | V6B8WUH 32 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#8 | 3072-4 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 35 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#17 | 3072-4 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 38 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#19 | 3072-4 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 40 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#21 | 3072-4 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 45 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#23 | 3072-4 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 51 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#26 | 3072-4 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 53 750 Leti bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q2 | 2433-15 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 25 29 32 33 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q3 | 2433-15 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VWB6IVH 36 38 42 43 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q4 | 2433-15 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VWB6IVH 44 46 50 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2935-18♯Q2 | 2433-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 15 16 17 24 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2935-18#Q4 | 2935-18 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VMB8WDH 2 7 9 10 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q2 | 2615-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VMB8WDH 14 15 17 18 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q3 | 2615-18 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VMB8WDH 19 24 29 30 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q1 | 2615-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH 1 31 39 43 750 Leti bumps, Advacam Ti/W/Pt UBM | 2935-18#Q1 | 2935-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH (1&2)/V6B8WUH (3&4) 44 45 56 57 750 Leti bumps, Advacam Ti/W/Pt UBM | 2935-18#Q5 | 2935-18 | CERN Pixel IV | Q5 | #N/A | DC | 300 | V6B8WUH 58 41 26 57 750 Leti bumps, Advacam Ti/W/Pt UBM | 2433-15#SC1 | 2433-15 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VWB6IVH | 1 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15#SC3 | 2433-15 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | VWB6IVH | 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15#SC5 | 2433-15 | CERN Pixel IV | SC5 | 250x50 | DC | 300 | VWB6IVH | 5 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2615-18#SC6 | 2615-18 | CERN Pixel IV | SC6 | 250x50 | DC | 300 | VWB6IVH | 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 14-07-24-S2 | 2873-8 | CERN Pixel II | SE3 | 250x50 | DC | 300 | | RAL In bumps (bond force: 20kg) | 14-07-25-S2 | 2873-8 | CERN Pixel II | SC2 | 250x50 | DC | 300 | | RAL In bumps (bond force: 10kg) | 14-07-25-S4 | 2873-8 | CERN Pixel II | SC12 | 250x50 | DC | 300 | | RAL In bumps (bond force 5kg) | 2873-25-S5 | 2873-25 | CERN Pixel V | 5 | 250x50 | AC | 310 | VWB6IVH | 7 7 7 7 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S6 | 2873-25 | CERN Pixel V | 6 | 250x50 | DC | 310 | VWB6IVH | 6 6 6 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S9 | 2873-25 | CERN Pixel V | 9 | 2000x50 | DC | 310 | VWB6IVH | 3 3 3 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S10 | 2873-25 | CERN Pixel V | 10 | 2000x50 | AC | 310 | VWB6IVH | 13 13 13 13 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S13 | 2873-25 | CERN Pixel V | 13 | 2000x25 | AC | 310 | VWB6IVH | 30 30 30 30 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S14 | 2873-25 | CERN Pixel V | 14 | 2000x25 | DC | 310 | VWB6IVH | 31 31 31 31 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S17 | 2873-25 | CERN Pixel V | 17 | 500x25 | DC | 310 | VWB6IVH | 54 54 54 54 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S18 | 2873-25 | CERN Pixel V | 18 | 500x25 | AC | 310 | VWB6IVH | 46 46 46 46 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S23 | 2873-25 | CERN Pixel V | 23 | 167x125 | DC | 310 | VWB6IVH | 53 53 53 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S24 | 2873-25 | CERN Pixel V | 24 | 167x125 | AC | 310 | VWB6IVH | 47 47 47 47 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S25 | 2873-25 | CERN Pixel V | 25 | 125x100 | AC | 310 | VWB6IVH | 42 42 42 42 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S26 | 2873-25 | CERN Pixel V | 26 | 125x100 | DC | 310 | VWB6IVH | 39 39 39 39 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15-SC2 | 2433-15 | CERN Pixel IV | SC2 | 50x250 | DC | 300 | ABPJXGH | 49 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL | 2433-15-SC3 | 2433-15 | CERN Pixel IV | SC3 | 25x500 | DC | 300 | ABPJXGH | 16 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL

Assembly 2: 2873-18: SE3 (slim edge) - V6ABC1H Die 8

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly3: 2873-18: SC3 - V6ABC1H Die 10

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly5: 2873-18: SC5 - V6ABC1H Die 16

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside (ahem!)

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 9: 2615-19: SC3 (25x500) - V6ABC1H Die 25

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly10: 2615-19: SC4 (25x500) - V6ABC1H Die 27

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly13: 2873-19: SE2 (slim edge) - V6ABC1H Die 31

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly14: 2873-19: SE1 (slim edge) - V6ABC1H Die 37

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly15: 2873-19: SC9 (production) - V6ABC1H Die 38

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
 
Changed:
<
<		Assembly3: 2873-18: SC3 - V6ABC1H Die 10
>
>		Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14
 
Changed:
<
<		Assembly 4: 2873-18: SC4 - V6ABC1H Die 11
>
>
Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
 
Changed:
<
<		Assembly5: 2873-18: SC5 - V6ABC1H Die 16
>
>		Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20
 
Changed:
<
<		Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside
>
>
Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
 
Changed:
<
<		Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly 9: 2615-19: SC3 (25x500) - V6ABC1H Die 25

Assembly10: 2615-19: SC4 (25x500) - V6ABC1H Die 27

Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2

Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41

Assembly13: 2873-19: SE2 (slim edge) - V6ABC1H Die 31

Assembly14: 2873-19: SE1 (slim edge) - V6ABC1H Die 37

Assembly15: 2873-19: SC9 (production) - V6ABC1H Die 38

>
>
Planned assemblies to take us to the end of the stardard items in VTT order 1
 
Changed:
<
<		Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
>
>		Assembly Q4: 2935-21: Quad3 - V6ABC1H
 
Changed:
<
<		Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14
>
>
Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
 
Changed:
<
<		Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20
Planned assemblies to take us to the end of the stardard items in VTT order 1
>
>		Assembly Q5: 2615-19: Quad1 - VBABAXH
 
Changed:
<
<		Assembly Q4: 2935-21: Quad3 - V6ABC1H
>
>
Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
 
Deleted:
<
<		Assembly Q5: 2615-19: Quad1 - VBABAXH
 
ROIC only on SCC

Wafer V6ABC1H Die 50

Revision 122013-06-13 - ThomasMcMullen

Line: 1 to 1
 
META TOPICPARENT name="Modules"
25/07/2012
Line: 77 to 77
 
META FILEATTACHMENT attachment="FlipChippedFE-I4-10.xlsx" attr="" comment="IVs for the 6 assemblies pre and post flip-chip" date="1336048499" name="FlipChippedFE-I4-10.xlsx" path="FlipChippedFE-I4-10.xlsx" size="47726" stream="FlipChippedFE-I4-10.xlsx" tmpFilename="/usr/tmp/CGItemp31239" user="RichardBates" version="1"
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies.docx" attr="" comment="Status of Single chip Assemblies" date="1338997387" name="Stock_Location_StatusOfAssemblies.docx" path="Stock_Location_StatusOfAssemblies.docx" size="124499" stream="Stock_Location_StatusOfAssemblies.docx" tmpFilename="/usr/tmp/CGItemp27454" user="RichardBates" version="1"
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies-3.docx" attr="" comment="Location of assemblies as of 25/7/2012" date="1343234679" name="Stock_Location_StatusOfAssemblies-3.docx" path="Stock_Location_StatusOfAssemblies-3.docx" size="102235" stream="Stock_Location_StatusOfAssemblies-3.docx" tmpFilename="/usr/tmp/CGItemp33163" user="RichardBates" version="1"
Changed:
<
<
META FILEATTACHMENT attachment="Pre_and_post_assembly_IVs_summary.pptx" attr="" comment="" date="1369902484" name="Pre_and_post_assembly_IVs_summary.pptx" path="Pre and post assembly IVs summary.pptx" size="875150" stream="Pre and post assembly IVs summary.pptx" tmpFilename="/usr/tmp/CGItemp20098" user="ThomasMcMullen" version="1"
>
>
META FILEATTACHMENT attachment="Pre_and_post_assembly_IVs_summary.pptx" attr="" comment="" date="1371110154" name="Pre_and_post_assembly_IVs_summary.pptx" path="Pre and post assembly IVs summary.pptx" size="925543" stream="Pre and post assembly IVs summary.pptx" tmpFilename="/usr/tmp/CGItemp25429" user="ThomasMcMullen" version="2"

Revision 112013-05-30 - ThomasMcMullen

Line: 1 to 1
 
META TOPICPARENT name="Modules"
25/07/2012
Line: 77 to 77
 
META FILEATTACHMENT attachment="FlipChippedFE-I4-10.xlsx" attr="" comment="IVs for the 6 assemblies pre and post flip-chip" date="1336048499" name="FlipChippedFE-I4-10.xlsx" path="FlipChippedFE-I4-10.xlsx" size="47726" stream="FlipChippedFE-I4-10.xlsx" tmpFilename="/usr/tmp/CGItemp31239" user="RichardBates" version="1"
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies.docx" attr="" comment="Status of Single chip Assemblies" date="1338997387" name="Stock_Location_StatusOfAssemblies.docx" path="Stock_Location_StatusOfAssemblies.docx" size="124499" stream="Stock_Location_StatusOfAssemblies.docx" tmpFilename="/usr/tmp/CGItemp27454" user="RichardBates" version="1"
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies-3.docx" attr="" comment="Location of assemblies as of 25/7/2012" date="1343234679" name="Stock_Location_StatusOfAssemblies-3.docx" path="Stock_Location_StatusOfAssemblies-3.docx" size="102235" stream="Stock_Location_StatusOfAssemblies-3.docx" tmpFilename="/usr/tmp/CGItemp33163" user="RichardBates" version="1"
Added:
>
>
META FILEATTACHMENT attachment="Pre_and_post_assembly_IVs_summary.pptx" attr="" comment="" date="1369902484" name="Pre_and_post_assembly_IVs_summary.pptx" path="Pre and post assembly IVs summary.pptx" size="875150" stream="Pre and post assembly IVs summary.pptx" tmpFilename="/usr/tmp/CGItemp20098" user="ThomasMcMullen" version="1"

Revision 102012-10-09 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
25/07/2012
Line: 27 to 27
 

Sensor - Die attachment detail

Changed:
<
<		Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
>
>		Assembly 1: 2873-18: SE4 (slim edge) - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
 
Changed:
<
<		Assembly 2: 2873-18: SE3 - V6ABC1H Die 8
>
>		Assembly 2: 2873-18: SE3 (slim edge) - V6ABC1H Die 8
 
Changed:
<
<		Assembly 3: 2873-18: SC3 - V6ABC1H Die 10
>
>		Assembly3: 2873-18: SC3 - V6ABC1H Die 10
  Assembly 4: 2873-18: SC4 - V6ABC1H Die 11
Line: 43 to 43
  Assembly 8: 2873-18: SC10- V6ABC1H Die 34
Changed:
<
<		Assembly 9: 2615-19: SC3 - V6ABC1H Die 25
>
>		Assembly 9: 2615-19: SC3 (25x500) - V6ABC1H Die 25
 
Changed:
<
<		Assembly 10: 2615-19: SC4 - V6ABC1H Die 27
>
>		Assembly10: 2615-19: SC4 (25x500) - V6ABC1H Die 27
  Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2

Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41

Changed:
<
<		Assembly 13: 2873-19: SE3 (slim edge) - V6ABC1H Die 31
>
>		Assembly13: 2873-19: SE2 (slim edge) - V6ABC1H Die 31
 
Changed:
<
<		Assembly 14: 2873-19: SE4 (slim edge) - V6ABC1H Die 37
>
>		Assembly14: 2873-19: SE1 (slim edge) - V6ABC1H Die 37
 
Changed:
<
<		Assembly 15: 2873-19: SC9 (production) - V6ABC1H Die 38
>
>		Assembly15: 2873-19: SC9 (production) - V6ABC1H Die 38
  Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

Revision 92012-10-09 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
25/07/2012
Line: 67 to 67
 Assembly Q4: 2935-21: Quad3 - V6ABC1H

Assembly Q5: 2615-19: Quad1 - VBABAXH

Added:
>
>
ROIC only on SCC

Wafer V6ABC1H Die 50

  -- RichardBates - 2012-04-20

Revision 82012-08-02 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
25/07/2012
Line: 35 to 35
  Assembly 4: 2873-18: SC4 - V6ABC1H Die 11
Changed:
<
<		Assembly 5: 2873-18: SC5 - V6ABC1H Die 16
>
>		Assembly5: 2873-18: SC5 - V6ABC1H Die 16
  Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside

Revision 72012-07-25 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
Added:
>
>		25/07/2012

The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels.

 6/6/2012

Some ideas of the irradition plan for the single chip assemblies

Line: 41 to 47
  Assembly 10: 2615-19: SC4 - V6ABC1H Die 27
Changed:
<
<		Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
Planned assemblies to take us to the end of the stardard items in VTT order 1
>
>		Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2
 
Changed:
<
<		Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die????
>
>		Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41
 
Changed:
<
<		Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die????
>
>		Assembly 13: 2873-19: SE3 (slim edge) - V6ABC1H Die 31
 
Changed:
<
<		Assembly 13: 2873-19: SE3 (slim edge) - V6ABC1H Die????
>
>		Assembly 14: 2873-19: SE4 (slim edge) - V6ABC1H Die 37
 
Changed:
<
<		Assembly 14: 2873-19: SC4 (slim edge) - V6ABC1H Die????
>
>		Assembly 15: 2873-19: SC9 (production) - V6ABC1H Die 38
 
Changed:
<
<		Assembly 15: 2873-19: SC9 (production) - V6ABC1H Die????
>
>		Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
 
Changed:
<
<		Assembly Q2: 2935-21: Quad4 - V6ABC1H
>
>		Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14
 
Changed:
<
<		Assembly Q3: 2935-21: Quad2 (slim edge) - V6ABC1H
>
>		Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20
Planned assemblies to take us to the end of the stardard items in VTT order 1
  Assembly Q4: 2935-21: Quad3 - V6ABC1H
Line: 67 to 73
 
META FILEATTACHMENT attachment="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" attr="" comment="FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4" date="1335526272" name="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" path="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" size="19981" stream="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" tmpFilename="/usr/tmp/CGItemp27022" user="RichardBates" version="1"
META FILEATTACHMENT attachment="FlipChippedFE-I4-10.xlsx" attr="" comment="IVs for the 6 assemblies pre and post flip-chip" date="1336048499" name="FlipChippedFE-I4-10.xlsx" path="FlipChippedFE-I4-10.xlsx" size="47726" stream="FlipChippedFE-I4-10.xlsx" tmpFilename="/usr/tmp/CGItemp31239" user="RichardBates" version="1"
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies.docx" attr="" comment="Status of Single chip Assemblies" date="1338997387" name="Stock_Location_StatusOfAssemblies.docx" path="Stock_Location_StatusOfAssemblies.docx" size="124499" stream="Stock_Location_StatusOfAssemblies.docx" tmpFilename="/usr/tmp/CGItemp27454" user="RichardBates" version="1"
Added:
>
>
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies-3.docx" attr="" comment="Location of assemblies as of 25/7/2012" date="1343234679" name="Stock_Location_StatusOfAssemblies-3.docx" path="Stock_Location_StatusOfAssemblies-3.docx" size="102235" stream="Stock_Location_StatusOfAssemblies-3.docx" tmpFilename="/usr/tmp/CGItemp33163" user="RichardBates" version="1"

Revision 62012-06-19 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
6/6/2012
Line: 37 to 37
  Assembly 8: 2873-18: SC10- V6ABC1H Die 34
Changed:
<
<		Assembly 9: 2165-19: SC3 - V6ABC1H Die 25
>
>		Assembly 9: 2615-19: SC3 - V6ABC1H Die 25
 
Changed:
<
<		Assembly 10: 2165-19: SC4 - V6ABC1H Die 27
>
>		Assembly 10: 2615-19: SC4 - V6ABC1H Die 27
 
Changed:
<
<		Assembly Q1: 2165-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
>
>		Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
Planned assemblies to take us to the end of the stardard items in VTT order 1

Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die????

Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die????

Assembly 13: 2873-19: SE3 (slim edge) - V6ABC1H Die????

Assembly 14: 2873-19: SC4 (slim edge) - V6ABC1H Die????

Assembly 15: 2873-19: SC9 (production) - V6ABC1H Die????

Assembly Q2: 2935-21: Quad4 - V6ABC1H

Assembly Q3: 2935-21: Quad2 (slim edge) - V6ABC1H

Assembly Q4: 2935-21: Quad3 - V6ABC1H

Assembly Q5: 2615-19: Quad1 - VBABAXH

  -- RichardBates - 2012-04-20

Revision 52012-06-06 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
Added:
>
>		6/6/2012

Some ideas of the irradition plan for the single chip assemblies

28/5/2012

4 more single chip and the first quad have been flip-chip bonded.

 4/5/2012
Changed:
<
<		Some worried about wire bonding
>
>		Some worries about wire bonding. This is resolved.
  20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

Changed:
<
<
>
>
 

Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Line: 24 to 33
  Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside
Added:
>
>		Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly 9: 2165-19: SC3 - V6ABC1H Die 25

Assembly 10: 2165-19: SC4 - V6ABC1H Die 27

Assembly Q1: 2165-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

 -- RichardBates - 2012-04-20

META FILEATTACHMENT attachment="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" attr="" comment="FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4" date="1335526272" name="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" path="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" size="19981" stream="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" tmpFilename="/usr/tmp/CGItemp27022" user="RichardBates" version="1"
META FILEATTACHMENT attachment="FlipChippedFE-I4-10.xlsx" attr="" comment="IVs for the 6 assemblies pre and post flip-chip" date="1336048499" name="FlipChippedFE-I4-10.xlsx" path="FlipChippedFE-I4-10.xlsx" size="47726" stream="FlipChippedFE-I4-10.xlsx" tmpFilename="/usr/tmp/CGItemp31239" user="RichardBates" version="1"
Added:
>
>
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies.docx" attr="" comment="Status of Single chip Assemblies" date="1338997387" name="Stock_Location_StatusOfAssemblies.docx" path="Stock_Location_StatusOfAssemblies.docx" size="124499" stream="Stock_Location_StatusOfAssemblies.docx" tmpFilename="/usr/tmp/CGItemp27454" user="RichardBates" version="1"

Revision 42012-05-04 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
Added:
>
>		4/5/2012

Some worried about wire bonding

 20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Revision 32012-05-03 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

Changed:
<
<
>
>
 

Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Line: 22 to 23
 -- RichardBates - 2012-04-20

META FILEATTACHMENT attachment="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" attr="" comment="FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4" date="1335526272" name="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" path="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" size="19981" stream="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" tmpFilename="/usr/tmp/CGItemp27022" user="RichardBates" version="1"
Added:
>
>
META FILEATTACHMENT attachment="FlipChippedFE-I4-10.xlsx" attr="" comment="IVs for the 6 assemblies pre and post flip-chip" date="1336048499" name="FlipChippedFE-I4-10.xlsx" path="FlipChippedFE-I4-10.xlsx" size="47726" stream="FlipChippedFE-I4-10.xlsx" tmpFilename="/usr/tmp/CGItemp31239" user="RichardBates" version="1"

Revision 22012-04-27 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Added:
>
>

Sensor IVs after die attachment

Sensor - Die attachment detail

 
Changed:
<
<		Sensor - Die attachment details:
>
>		Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
 
Changed:
<
<		2873-18: SE3 - V6ABC1H Die 8
>
>		Assembly 2: 2873-18: SE3 - V6ABC1H Die 8
 
Changed:
<
<		2873-18: SC3 - V6ABC1H Die 10
>
>		Assembly 3: 2873-18: SC3 - V6ABC1H Die 10
 
Changed:
<
<		2873-18: SC4 - V6ABC1H Die 11
>
>		Assembly 4: 2873-18: SC4 - V6ABC1H Die 11
 
Changed:
<
<		2873-18: SE4 - V6ABC1H Die 15
>
>		Assembly 5: 2873-18: SC5 - V6ABC1H Die 16
 
Changed:
<
<		2873-18: SC5 - V6ABC1H Die 16

2873-18: SC6 - V6ABC1H Die 17

>
>		Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside
  -- RichardBates - 2012-04-20
Added:
>
>
META FILEATTACHMENT attachment="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" attr="" comment="FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4" date="1335526272" name="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" path="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" size="19981" stream="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" tmpFilename="/usr/tmp/CGItemp27022" user="RichardBates" version="1"

Revision 12012-04-20 - RichardBates

Line: 1 to 1
Added:
>
>
META TOPICPARENT name="Modules"
20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor - Die attachment details:

2873-18: SE3 - V6ABC1H Die 8

2873-18: SC3 - V6ABC1H Die 10

2873-18: SC4 - V6ABC1H Die 11

2873-18: SE4 - V6ABC1H Die 15

2873-18: SC5 - V6ABC1H Die 16

2873-18: SC6 - V6ABC1H Die 17

-- RichardBates - 2012-04-20

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