Some ideas of the irradition plan for the single chip assemblies

• Stock_Location_StatusOfAssemblies.docx: Status of Single chip Assemblies

28/5/2012

4 more single chip and the first quad have been flip-chip bonded.

4/5/2012

Some worries about wire bonding. This is resolved.

20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

• FlipChippedFE-I4-10.xlsx: IVs for the first 6 assemblies (assemblies 1 to 6) pre and post flip-chip

Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Assembly 2: 2873-18: SE3 - V6ABC1H Die 8

Assembly 3: 2873-18: SC3 - V6ABC1H Die 10

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly 5: 2873-18: SC5 - V6ABC1H Die 16

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside

Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly 9: 2165-19: SC3 - V6ABC1H Die 25

Assembly 10: 2165-19: SC4 - V6ABC1H Die 27

Assembly Q1: 2165-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

-- RichardBates - 2012-04-20