TWiki> ATLAS/PUUKA Web>Tasks>Modules>Assemblies (revision 13)EditAttach
25/07/2012

The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels.

6/6/2012

Some ideas of the irradition plan for the single chip assemblies

28/5/2012

4 more single chip and the first quad have been flip-chip bonded.

4/5/2012

Some worries about wire bonding. This is resolved.

20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 (slim edge) - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details
Ass1 2873-18 CERN Pixel II SE4 250x50 DC 300 V6ABC1H 15 200 VTT bumps, VTT UBM
| Ass2 | 2873-18 | CERN Pixel II | SE3 | 250x50 | DC | 300 | V6ABC1H 8 200 VTT bumps, VTT UBM | Ass3 | 2873-18 | CERN Pixel II | SC3 | 250x50 | DC | 300 | V6ABC1H 10 200 VTT bumps, VTT UBM | Ass4 | 2873-18 | CERN Pixel II | SC4 | 250x50 | DC | 300 | V6ABC1H 11 200 VTT bumps, VTT UBM | Ass5 | 2873-18 | CERN Pixel II | SC5 | 250x50 | DC | 300 | V6ABC1H 16 200 VTT bumps, VTT UBM | Ass6 | 2873-18 | CERN Pixel II | SC6 | 250x50 | DC | 300 | V6ABC1H 17 200 VTT bumps, VTT UBM | Ass7 | 2873-18 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 33 200 VTT bumps, VTT UBM | Ass8 | 2873-18 | CERN Pixel II | SC10 | 250x50 | DC | 300 | V6ABC1H 34 200 VTT bumps, VTT UBM | Ass9 | 2615-19 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 25 200 VTT bumps, VTT UBM | Ass10 | 2615-19 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 27 200 VTT bumps, VTT UBM | Ass11 | 2935-21 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 2 200 VTT bumps, VTT UBM | Ass12 | 2935-21 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 41 200 VTT bumps, VTT UBM | Ass13 | 2873-19 | CERN Pixel II | SE2 | 250x50 | DC | 300 | V6ABC1H 31 200 VTT bumps, VTT UBM | Ass14 | 2873-19 | CERN Pixel II | SE1 | 250x50 | DC | 300 | V6ABC1H 37 200 VTT bumps, VTT UBM | Ass15 | 2873-19 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 38 200 VTT bumps, VTT UBM | Ass16 | 2873-19 | CERN Pixel II | SC1 | 250x50 | DC | 300 | VBABAXH 1 750 VTT bumps, VTT UBM | Ass17 | 2873-19 | CERN Pixel II | SC2 | 250x50 | DC | 300 | VBABAXH 2 750 VTT bumps, VTT UBM | Ass18 | 2873-19 | CERN Pixel II | SC4 | 250x50 | DC | 300 | VBABAXH 3 750 VTT bumps, VTT UBM | Ass19 | 2873-19 | CERN Pixel II | SC5 | 250x50 | DC | 300 | VBABAXH 6 750 VTT bumps, VTT UBM | Ass20 | 2873-19 | CERN Pixel II | SC6 | 250x50 | DC | 300 | VBABAXH 7 750 VTT bumps, VTT UBM | Ass21 | 2615-19 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VBABAXH 49 750 VTT bumps, VTT UBM | Q1 | 2615-19 | CERN Pixel IV | Q4 | #N/A | DC | 300 | V6ABC1H 19 20 22 24 200 VTT bumps, VTT UBM | Q2 | 2935-21 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VZABC8H 8 9 11 14 750 VTT bumps, VTT UBM | Q3 | 2935-21 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VZABC8H 16 18 19 20 750 VTT bumps, VTT UBM | Q4 | 2935-21 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VZABC8H 51 53 58 33 750 VTT bumps, VTT UBM | Q5 | 2433-14 | CERN Pixel IV | Q5 | #N/A | DC | 300 | VBABAXH 48 38 55 47 750 VTT bumps, VTT UBM | Q6 | 2433-14 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VBABAXH 33 18 19 22 750 VTT bumps, VTT UBM | Q7 | 2433-14 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VBABAXH 34 43 44 42 750 VTT bumps, VTT UBM | 3072-3#8 | 3072-3 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 1 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#14 | 3072-3 | CERN Pixel V | 14 | 2000x25 | DC | 310 | V6B8WUH 2 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#16 | 3072-3 | CERN Pixel V | 16 | 2000x25 | DC | 310 | V6B8WUH 4 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#17 | 3072-3 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 13 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#19 | 3072-3 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 17 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#21 | 3072-3 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 27 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#23 | 3072-3 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 30 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#26 | 3072-3 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 18 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-3#28 | 3072-3 | CERN Pixel V | 28 | 125x100 | DC | 310 | V6B8WUH 22 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#6 | 3072-4 | CERN Pixel V | 6 | 250x50 | DC | 310 | V6B8WUH 32 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#8 | 3072-4 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 35 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#17 | 3072-4 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 38 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#19 | 3072-4 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 40 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#21 | 3072-4 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 45 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#23 | 3072-4 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 51 750 Leti bumps, Advacam Ti/W/Pt UBM | 3072-4#26 | 3072-4 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 53 750 Leti bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q2 | 2433-15 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 25 29 32 33 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q3 | 2433-15 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VWB6IVH 36 38 42 43 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15♯Q4 | 2433-15 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VWB6IVH 44 46 50 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2935-18♯Q2 | 2433-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 15 16 17 24 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2935-18#Q4 | 2935-18 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VMB8WDH 2 7 9 10 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q2 | 2615-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VMB8WDH 14 15 17 18 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q3 | 2615-18 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VMB8WDH 19 24 29 30 750 Leti bumps, Advacam Ti/W/Pt UBM | 2615-18#Q1 | 2615-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH 1 31 39 43 750 Leti bumps, Advacam Ti/W/Pt UBM | 2935-18#Q1 | 2935-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH (1&2)/V6B8WUH (3&4) 44 45 56 57 750 Leti bumps, Advacam Ti/W/Pt UBM | 2935-18#Q5 | 2935-18 | CERN Pixel IV | Q5 | #N/A | DC | 300 | V6B8WUH 58 41 26 57 750 Leti bumps, Advacam Ti/W/Pt UBM | 2433-15#SC1 | 2433-15 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VWB6IVH | 1 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15#SC3 | 2433-15 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | VWB6IVH | 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15#SC5 | 2433-15 | CERN Pixel IV | SC5 | 250x50 | DC | 300 | VWB6IVH | 5 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2615-18#SC6 | 2615-18 | CERN Pixel IV | SC6 | 250x50 | DC | 300 | VWB6IVH | 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 14-07-24-S2 | 2873-8 | CERN Pixel II | SE3 | 250x50 | DC | 300 | | RAL In bumps (bond force: 20kg) | 14-07-25-S2 | 2873-8 | CERN Pixel II | SC2 | 250x50 | DC | 300 | | RAL In bumps (bond force: 10kg) | 14-07-25-S4 | 2873-8 | CERN Pixel II | SC12 | 250x50 | DC | 300 | | RAL In bumps (bond force 5kg) | 2873-25-S5 | 2873-25 | CERN Pixel V | 5 | 250x50 | AC | 310 | VWB6IVH | 7 7 7 7 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S6 | 2873-25 | CERN Pixel V | 6 | 250x50 | DC | 310 | VWB6IVH | 6 6 6 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S9 | 2873-25 | CERN Pixel V | 9 | 2000x50 | DC | 310 | VWB6IVH | 3 3 3 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S10 | 2873-25 | CERN Pixel V | 10 | 2000x50 | AC | 310 | VWB6IVH | 13 13 13 13 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S13 | 2873-25 | CERN Pixel V | 13 | 2000x25 | AC | 310 | VWB6IVH | 30 30 30 30 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S14 | 2873-25 | CERN Pixel V | 14 | 2000x25 | DC | 310 | VWB6IVH | 31 31 31 31 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S17 | 2873-25 | CERN Pixel V | 17 | 500x25 | DC | 310 | VWB6IVH | 54 54 54 54 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S18 | 2873-25 | CERN Pixel V | 18 | 500x25 | AC | 310 | VWB6IVH | 46 46 46 46 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S23 | 2873-25 | CERN Pixel V | 23 | 167x125 | DC | 310 | VWB6IVH | 53 53 53 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S24 | 2873-25 | CERN Pixel V | 24 | 167x125 | AC | 310 | VWB6IVH | 47 47 47 47 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S25 | 2873-25 | CERN Pixel V | 25 | 125x100 | AC | 310 | VWB6IVH | 42 42 42 42 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2873-25-S26 | 2873-25 | CERN Pixel V | 26 | 125x100 | DC | 310 | VWB6IVH | 39 39 39 39 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM | 2433-15-SC2 | 2433-15 | CERN Pixel IV | SC2 | 50x250 | DC | 300 | ABPJXGH | 49 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL | 2433-15-SC3 | 2433-15 | CERN Pixel IV | SC3 | 25x500 | DC | 300 | ABPJXGH | 16 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL

Assembly 2: 2873-18: SE3 (slim edge) - V6ABC1H Die 8

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly3: 2873-18: SC3 - V6ABC1H Die 10

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly5: 2873-18: SC5 - V6ABC1H Die 16

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside (ahem!)

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 9: 2615-19: SC3 (25x500) - V6ABC1H Die 25

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly10: 2615-19: SC4 (25x500) - V6ABC1H Die 27

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly13: 2873-19: SE2 (slim edge) - V6ABC1H Die 31

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly14: 2873-19: SE1 (slim edge) - V6ABC1H Die 37

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly15: 2873-19: SC9 (production) - V6ABC1H Die 38

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Planned assemblies to take us to the end of the stardard items in VTT order 1

Assembly Q4: 2935-21: Quad3 - V6ABC1H

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

Assembly Q5: 2615-19: Quad1 - VBABAXH

Assembly name Sensor wafer Sensor wafer type Sensor die Implant details DC/AC Sensor thickness ROIC wafer ROIC die ROIC thickness Assembly details

ROIC only on SCC

Wafer V6ABC1H Die 50

-- RichardBates - 2012-04-20

Topic attachments
I Attachment History Action Size Date Who Comment
Microsoft Excel Spreadsheetxlsx FlipChippedFE-I4-10.xlsx r1 manage 46.6 K 2012-05-03 - 12:34 RichardBates IVs for the 6 assemblies pre and post flip-chip
Microsoft Excel Spreadsheetxlsx FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx r1 manage 19.5 K 2012-04-27 - 11:31 RichardBates FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4
PowerPointpptx Pre_and_post_assembly_IVs_summary.pptx r2 r1 manage 903.9 K 2013-06-13 - 07:55 ThomasMcMullen  
Microsoft Word filedocx Stock_Location_StatusOfAssemblies-3.docx r1 manage 99.8 K 2012-07-25 - 16:44 RichardBates Location of assemblies as of 25/7/2012
Microsoft Word filedocx Stock_Location_StatusOfAssemblies.docx r1 manage 121.6 K 2012-06-06 - 15:43 RichardBates Status of Single chip Assemblies
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Topic revision: r13 - 2014-09-29 - KennyWraight
 
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