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20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Assembly 2: 2873-18: SE3 - V6ABC1H Die 8

Assembly 3: 2873-18: SC3 - V6ABC1H Die 10

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly 5: 2873-18: SC5 - V6ABC1H Die 16

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside

-- RichardBates - 2012-04-20

Topic attachments
I Attachment History Action Size Date Who Comment
Microsoft Excel Spreadsheetxlsx FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx r1 manage 19.5 K 2012-04-27 - 11:31 RichardBates FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4
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Topic revision: r2 - 2012-04-27 - RichardBates
 
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