The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels.

• Stock_Location_StatusOfAssemblies-3.docx: Location of assemblies as of 25/7/2012

6/6/2012

Some ideas of the irradition plan for the single chip assemblies

• Stock_Location_StatusOfAssemblies.docx: Status of Single chip Assemblies

28/5/2012

4 more single chip and the first quad have been flip-chip bonded.

4/5/2012

Some worries about wire bonding. This is resolved.

20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

• FlipChippedFE-I4-10.xlsx: IVs for the first 6 assemblies (assemblies 1 to 6) pre and post flip-chip

Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Assembly 2: 2873-18: SE3 - V6ABC1H Die 8

Assembly 3: 2873-18: SC3 - V6ABC1H Die 10

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly 5: 2873-18: SC5 - V6ABC1H Die 16

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside

Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly 9: 2615-19: SC3 - V6ABC1H Die 25

Assembly 10: 2615-19: SC4 - V6ABC1H Die 27

Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2

Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41

Assembly 13: 2873-19: SE3 (slim edge) - V6ABC1H Die 31

Assembly 14: 2873-19: SE4 (slim edge) - V6ABC1H Die 37

Assembly 15: 2873-19: SC9 (production) - V6ABC1H Die 38

Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14

Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20

Planned assemblies to take us to the end of the stardard items in VTT order 1

Assembly Q4: 2935-21: Quad3 - V6ABC1H

Assembly Q5: 2615-19: Quad1 - VBABAXH

-- RichardBates - 2012-04-20