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20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor - Die attachment details:

2873-18: SE3 - V6ABC1H Die 8

2873-18: SC3 - V6ABC1H Die 10

2873-18: SC4 - V6ABC1H Die 11

2873-18: SE4 - V6ABC1H Die 15

2873-18: SC5 - V6ABC1H Die 16

2873-18: SC6 - V6ABC1H Die 17

-- RichardBates - 2012-04-20

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Topic revision: r1 - 2012-04-20 - RichardBates
 
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