| |
| META TOPICPARENT |
name="Modules" |
25/07/2012 |
| |
Sensor - Die attachment detail |
|
<
< | Assembly 1: 2873-18: SE4 (slim edge) - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps |
>
> | Assembly 1: 2873-18: SE4 (slim edge) - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps |
| | |
|
<
< | Assembly 2: 2873-18: SE3 (slim edge) - V6ABC1H Die 8 |
>
> |
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
| Ass1 |
2873-18 |
CERN Pixel II |
SE4 |
250x50 |
DC |
300 |
V6ABC1H |
15 |
200 |
VTT bumps, VTT UBM |
| Ass2 | 2873-18 | CERN Pixel II | SE3 | 250x50 | DC | 300 | V6ABC1H 8 200 VTT bumps, VTT UBM
| Ass3 | 2873-18 | CERN Pixel II | SC3 | 250x50 | DC | 300 | V6ABC1H 10 200 VTT bumps, VTT UBM
| Ass4 | 2873-18 | CERN Pixel II | SC4 | 250x50 | DC | 300 | V6ABC1H 11 200 VTT bumps, VTT UBM
| Ass5 | 2873-18 | CERN Pixel II | SC5 | 250x50 | DC | 300 | V6ABC1H 16 200 VTT bumps, VTT UBM
| Ass6 | 2873-18 | CERN Pixel II | SC6 | 250x50 | DC | 300 | V6ABC1H 17 200 VTT bumps, VTT UBM
| Ass7 | 2873-18 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 33 200 VTT bumps, VTT UBM
| Ass8 | 2873-18 | CERN Pixel II | SC10 | 250x50 | DC | 300 | V6ABC1H 34 200 VTT bumps, VTT UBM
| Ass9 | 2615-19 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 25 200 VTT bumps, VTT UBM
| Ass10 | 2615-19 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 27 200 VTT bumps, VTT UBM
| Ass11 | 2935-21 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | V6ABC1H 2 200 VTT bumps, VTT UBM
| Ass12 | 2935-21 | CERN Pixel IV | SC4 | 500x25 | DC | 300 | V6ABC1H 41 200 VTT bumps, VTT UBM
| Ass13 | 2873-19 | CERN Pixel II | SE2 | 250x50 | DC | 300 | V6ABC1H 31 200 VTT bumps, VTT UBM
| Ass14 | 2873-19 | CERN Pixel II | SE1 | 250x50 | DC | 300 | V6ABC1H 37 200 VTT bumps, VTT UBM
| Ass15 | 2873-19 | CERN Pixel II | SC9 | 250x50 | DC | 300 | V6ABC1H 38 200 VTT bumps, VTT UBM
| Ass16 | 2873-19 | CERN Pixel II | SC1 | 250x50 | DC | 300 | VBABAXH 1 750 VTT bumps, VTT UBM
| Ass17 | 2873-19 | CERN Pixel II | SC2 | 250x50 | DC | 300 | VBABAXH 2 750 VTT bumps, VTT UBM
| Ass18 | 2873-19 | CERN Pixel II | SC4 | 250x50 | DC | 300 | VBABAXH 3 750 VTT bumps, VTT UBM
| Ass19 | 2873-19 | CERN Pixel II | SC5 | 250x50 | DC | 300 | VBABAXH 6 750 VTT bumps, VTT UBM
| Ass20 | 2873-19 | CERN Pixel II | SC6 | 250x50 | DC | 300 | VBABAXH 7 750 VTT bumps, VTT UBM
| Ass21 | 2615-19 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VBABAXH 49 750 VTT bumps, VTT UBM
| Q1 | 2615-19 | CERN Pixel IV | Q4 | #N/A | DC | 300 | V6ABC1H 19 20 22 24 200 VTT bumps, VTT UBM
| Q2 | 2935-21 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VZABC8H 8 9 11 14 750 VTT bumps, VTT UBM
| Q3 | 2935-21 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VZABC8H 16 18 19 20 750 VTT bumps, VTT UBM
| Q4 | 2935-21 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VZABC8H 51 53 58 33 750 VTT bumps, VTT UBM
| Q5 | 2433-14 | CERN Pixel IV | Q5 | #N/A | DC | 300 | VBABAXH 48 38 55 47 750 VTT bumps, VTT UBM
| Q6 | 2433-14 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VBABAXH 33 18 19 22 750 VTT bumps, VTT UBM
| Q7 | 2433-14 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VBABAXH 34 43 44 42 750 VTT bumps, VTT UBM
| 3072-3#8 | 3072-3 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 1 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#14 | 3072-3 | CERN Pixel V | 14 | 2000x25 | DC | 310 | V6B8WUH 2 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#16 | 3072-3 | CERN Pixel V | 16 | 2000x25 | DC | 310 | V6B8WUH 4 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#17 | 3072-3 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 13 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#19 | 3072-3 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 17 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#21 | 3072-3 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 27 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#23 | 3072-3 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 30 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#26 | 3072-3 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 18 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-3#28 | 3072-3 | CERN Pixel V | 28 | 125x100 | DC | 310 | V6B8WUH 22 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-4#6 | 3072-4 | CERN Pixel V | 6 | 250x50 | DC | 310 | V6B8WUH 32 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-4#8 | 3072-4 | CERN Pixel V | 8 | 250x50 | DC | 310 | V6B8WUH 35 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-4#17 | 3072-4 | CERN Pixel V | 17 | 500x25 | DC | 310 | V6B8WUH 38 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-4#19 | 3072-4 | CERN Pixel V | 19 | 500x25 | DC | 310 | V6B8WUH 40 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-4#21 | 3072-4 | CERN Pixel V | 21 | 167x125 | DC | 310 | V6B8WUH 45 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-4#23 | 3072-4 | CERN Pixel V | 23 | 167x125 | DC | 310 | V6B8WUH 51 750 Leti bumps, Advacam Ti/W/Pt UBM
| 3072-4#26 | 3072-4 | CERN Pixel V | 26 | 125x100 | DC | 310 | V6B8WUH 53 750 Leti bumps, Advacam Ti/W/Pt UBM
| 2433-15♯Q2 | 2433-15 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 25 29 32 33 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2433-15♯Q3 | 2433-15 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VWB6IVH 36 38 42 43 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2433-15♯Q4 | 2433-15 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VWB6IVH 44 46 50 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2935-18♯Q2 | 2433-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VWB6IVH 15 16 17 24 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2935-18#Q4 | 2935-18 | CERN Pixel IV | Q4 | #N/A | DC | 300 | VMB8WDH 2 7 9 10 750 Leti bumps, Advacam Ti/W/Pt UBM
| 2615-18#Q2 | 2615-18 | CERN Pixel IV | Q2 | #N/A | DC | 300 | VMB8WDH 14 15 17 18 750 Leti bumps, Advacam Ti/W/Pt UBM
| 2615-18#Q3 | 2615-18 | CERN Pixel IV | Q3 | #N/A | DC | 300 | VMB8WDH 19 24 29 30 750 Leti bumps, Advacam Ti/W/Pt UBM
| 2615-18#Q1 | 2615-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH 1 31 39 43 750 Leti bumps, Advacam Ti/W/Pt UBM
| 2935-18#Q1 | 2935-18 | CERN Pixel IV | Q1 | #N/A | DC | 300 | VMB8WDH (1&2)/V6B8WUH (3&4) 44 45 56 57 750 Leti bumps, Advacam Ti/W/Pt UBM
| 2935-18#Q5 | 2935-18 | CERN Pixel IV | Q5 | #N/A | DC | 300 | V6B8WUH 58 41 26 57 750 Leti bumps, Advacam Ti/W/Pt UBM
| 2433-15#SC1 | 2433-15 | CERN Pixel IV | SC1 | 250x50 | DC | 300 | VWB6IVH | 1 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2433-15#SC3 | 2433-15 | CERN Pixel IV | SC3 | 500x25 | DC | 300 | VWB6IVH | 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2433-15#SC5 | 2433-15 | CERN Pixel IV | SC5 | 250x50 | DC | 300 | VWB6IVH | 5 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2615-18#SC6 | 2615-18 | CERN Pixel IV | SC6 | 250x50 | DC | 300 | VWB6IVH | 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 14-07-24-S2 | 2873-8 | CERN Pixel II | SE3 | 250x50 | DC | 300 | | RAL In bumps (bond force: 20kg)
| 14-07-25-S2 | 2873-8 | CERN Pixel II | SC2 | 250x50 | DC | 300 | | RAL In bumps (bond force: 10kg)
| 14-07-25-S4 | 2873-8 | CERN Pixel II | SC12 | 250x50 | DC | 300 | | RAL In bumps (bond force 5kg)
| 2873-25-S5 | 2873-25 | CERN Pixel V | 5 | 250x50 | AC | 310 | VWB6IVH | 7 7 7 7 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S6 | 2873-25 | CERN Pixel V | 6 | 250x50 | DC | 310 | VWB6IVH | 6 6 6 6 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S9 | 2873-25 | CERN Pixel V | 9 | 2000x50 | DC | 310 | VWB6IVH | 3 3 3 3 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S10 | 2873-25 | CERN Pixel V | 10 | 2000x50 | AC | 310 | VWB6IVH | 13 13 13 13 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S13 | 2873-25 | CERN Pixel V | 13 | 2000x25 | AC | 310 | VWB6IVH | 30 30 30 30 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S14 | 2873-25 | CERN Pixel V | 14 | 2000x25 | DC | 310 | VWB6IVH | 31 31 31 31 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S17 | 2873-25 | CERN Pixel V | 17 | 500x25 | DC | 310 | VWB6IVH | 54 54 54 54 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S18 | 2873-25 | CERN Pixel V | 18 | 500x25 | AC | 310 | VWB6IVH | 46 46 46 46 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S23 | 2873-25 | CERN Pixel V | 23 | 167x125 | DC | 310 | VWB6IVH | 53 53 53 53 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S24 | 2873-25 | CERN Pixel V | 24 | 167x125 | AC | 310 | VWB6IVH | 47 47 47 47 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S25 | 2873-25 | CERN Pixel V | 25 | 125x100 | AC | 310 | VWB6IVH | 42 42 42 42 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2873-25-S26 | 2873-25 | CERN Pixel V | 26 | 125x100 | DC | 310 | VWB6IVH | 39 39 39 39 750 Advacam SnPb bumps, Advacam Ti/W/Pt UBM
| 2433-15-SC2 | 2433-15 | CERN Pixel IV | SC2 | 50x250 | DC | 300 | ABPJXGH | 49 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL
| 2433-15-SC3 | 2433-15 | CERN Pixel IV | SC3 | 25x500 | DC | 300 | ABPJXGH | 16 100 Leti bumps, Advacam Ti/W/Pt UBM, No SCL
Assembly 2: 2873-18: SE3 (slim edge) - V6ABC1H Die 8
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly3: 2873-18: SC3 - V6ABC1H Die 10
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly 4: 2873-18: SC4 - V6ABC1H Die 11
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly5: 2873-18: SC5 - V6ABC1H Die 16
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside (ahem!)
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly 7: 2873-18: SC9 - V6ABC1H Die 33
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly 8: 2873-18: SC10- V6ABC1H Die 34
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly 9: 2615-19: SC3 (25x500) - V6ABC1H Die 25
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly10: 2615-19: SC4 (25x500) - V6ABC1H Die 27
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly13: 2873-19: SE2 (slim edge) - V6ABC1H Die 31
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly14: 2873-19: SE1 (slim edge) - V6ABC1H Die 37
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly15: 2873-19: SC9 (production) - V6ABC1H Die 38
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
|
| | |
|
<
< | Assembly3: 2873-18: SC3 - V6ABC1H Die 10 |
>
> | Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14 |
| | |
|
<
< | Assembly 4: 2873-18: SC4 - V6ABC1H Die 11 |
>
> |
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
|
| | |
|
<
< | Assembly5: 2873-18: SC5 - V6ABC1H Die 16 |
>
> | Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20 |
| | |
|
<
< | Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside |
>
> |
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
|
| | |
|
<
< | Assembly 7: 2873-18: SC9 - V6ABC1H Die 33
Assembly 8: 2873-18: SC10- V6ABC1H Die 34
Assembly 9: 2615-19: SC3 (25x500) - V6ABC1H Die 25
Assembly10: 2615-19: SC4 (25x500) - V6ABC1H Die 27
Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2
Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41
Assembly13: 2873-19: SE2 (slim edge) - V6ABC1H Die 31
Assembly14: 2873-19: SE1 (slim edge) - V6ABC1H Die 37
Assembly15: 2873-19: SC9 (production) - V6ABC1H Die 38 |
>
> | Planned assemblies to take us to the end of the stardard items in VTT order 1 |
| | |
|
<
< | Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24 |
>
> | Assembly Q4: 2935-21: Quad3 - V6ABC1H |
| | |
|
<
< | Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14 |
>
> |
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
|
| | |
|
<
< | Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20
Planned assemblies to take us to the end of the stardard items in VTT order 1 |
>
> | Assembly Q5: 2615-19: Quad1 - VBABAXH |
| | |
|
<
< | Assembly Q4: 2935-21: Quad3 - V6ABC1H |
>
> |
| Assembly name |
Sensor wafer |
Sensor wafer type |
Sensor die |
Implant details |
DC/AC |
Sensor thickness |
ROIC wafer |
ROIC die |
ROIC thickness |
Assembly details |
|
| | |
|
<
< | Assembly Q5: 2615-19: Quad1 - VBABAXH |
| | ROIC only on SCC
Wafer V6ABC1H Die 50 |
Copyright © 2008-2022 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.