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AndrewBlue 2011 10 12 Information for ATLAS Strip upgrade work at Glasgow The following are pages that provide information on the Strips upgrade testing and building...
FredDoherty 2012 06 29 Hybrid Bonding Diagrams https://twiki.cern.ch/twiki/pub/Atlas/ModuleAssembling4ATLASSCTUpgrade/Stave Hybrid WireBonding.pdf Shunts The current...
Jig Heights Set up for Jig J Salad Cream First tests using Salad cream Too much used Glass slide not aligned to vacuum jig However...
Thin film hybrid in MCM D technology Processing on blank silicon wafers to determine the feasibility of building a fully functional circuit in this technology. The...
Specification of the MCMD hybrid The first version of a fully working hybrid will electrically fully working but implemented on blank wafers. Hence no connections...
On the Module assemble board, you place a piece of paper (to even out the vacuum) then a mechanical Si sensor AndrewBlue 2011 10 12 Module Gluing Testing...
Information on module testing at Glasgow Introduction Modules can be tested using the HSIO system in a similar fashion to hybrid testing Below are notes that should...
FredDoherty 2012 06 29 Wire Bonding Trials To achieve correct measurements as above (assuming samples are exactly the size designed) Silicon (with DC) and 200um long...
RichardBates 26 Jan 2009 The Glasgow group has developed a system to fabricate Aluminium tracks on glass substrates to be used a pitch adaptors. The masks are designed...
Introduction Four electrical grade wafers were delivered, plus one that was damaged during fabrication. Each wafer has three hybrids, hence the electrical grade wafers...
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