Hybrid Bonding Diagrams

https://twiki.cern.ch/twiki/pub/Atlas/ModuleAssembling4ATLASSCTUpgrade/Stave_Hybrid_WireBonding.pdf

Shunts

The current drawn by the readout ASICs depends on their operational mode. The constant current
supply is set to the maximum expected hybrid current and shunt regulation is used to keep the
voltage across the hybrid constant. The latest generation of prototype readout ASIC is made in the
IBM 250nm process and termed ABCN-25 Already, this ASIC contains custom circuitry for
the implementation of shunt regulation.

There are two shunt regulation options within the ABCN-25, termed M-shunt and W-shunt.

The M-shunt option uses two shunt transistors in each ASIC, controlled by a voltage from an
external circuit.

The W-shunt option uses both shunt and control circuitry within the ASIC itself.

Shunt regulation may also be implemented outside the readout ASIC, using discrete compo-
nents or an additional ASIC.

Addressing of ASICS and Hybirds

On each hybrid panel each ASIC can be addressed by a combination of wire bonds to the PCB., It's different for each asic on the hybrid, but this system does not change from hybrid to hybrid

This allows one row of asics to be numbered 32-41 and the other 64-73

When the module is being wire bonded, each hybrid panel is wire bonded to another mounted pcb on the module (the BCC)

The left one (if the LVDS lines are at the bottom) is wire bonded to label it BCC=62, and the right BCC=61

This systems stays the same for every module we wire bond.
.

At the system tests point I address each Hybrid by it's BCC number, and it has it's own associated data file

If i name 4 hybrid files differently, you can then test 4 hybrids (2 modules) even if there are 2 panels with a BCC of 61, and 2 with a BCC of 62

BCC information

Pinout