Backlinks to Assemblies in ATLAS/PUUKA Web (Search all webs)

Results from ATLAS/PUUKA web retrieved at 16:33 (GMT)

This device was mounted on a single chip card, checked to be fine, and sent to CERN for testbeam in September 2012. RichardBates 2012 10 09
Unfortunately this assembly was broken due to an accident with the probe station. The detector of the assembly was being IVed on arrival in Glasgow, before wirebonding...
Connectivity The UK are developing: Flip chip bump deposition at CEA Leti and flip chip at Advacam Thin chip assemblies with Advacam and CEA Leti...
Module Flex Details of the UK quad flex to work with the FEI4 quad assemblies. These will have the correct tab orientation to be useable for the endcap ring structure...
Useful workpackage links: site meetings Vidyo portal Modules Our FEI4 wafers Wafer Probing Module Assembly Assemblies...
Pixel Weekly vidyo/phone meetings Thursdays at 10:00 am (UK time) portal or Vidyo portal In general, indico pages are listed in: https://indico.cern.ch/categoryDisplay...
CERN Pixel VI Mini Production summary of IVs CP6 summary.pdf: CPVI IV summary mini production Tracking wafer through the process CP6 3164 6 wafer level...
Characterisation of Single Devices in Glasgow University and the UK Assembly Details SCCvFEI4B Some notes on assembly, including wirebond program, are given here...
Thin chip assemblies To be able to flip chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re flow process. At present...
PCB and wirebonding details for the various Assemblies are given here. Quad Flex v1.11 FLEX1 2.BPX: Quad Flex v1.11 Wire bonding program for BJ820 Zip file...
Number of topics: 10

 
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