Difference: Assemblies (6 vs. 7)

Revision 72012-07-25 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
Added:
>
>		25/07/2012

The Quad assemblies 2 and 3 are made with full thickness ROIC as there is a worry about wafer bow and unbonded edge pixels.

 6/6/2012

Some ideas of the irradition plan for the single chip assemblies

Line: 41 to 47
  Assembly 10: 2615-19: SC4 - V6ABC1H Die 27
Changed:
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<		Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
Planned assemblies to take us to the end of the stardard items in VTT order 1
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>		Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die 2
 
Changed:
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<		Assembly 11: 2935-21: SC3 (25x500) - V6ABC1H Die????
>
>		Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die 41
 
Changed:
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<		Assembly 12: 2935-21: SC4 (25x500) - V6ABC1H Die????
>
>		Assembly 13: 2873-19: SE3 (slim edge) - V6ABC1H Die 31
 
Changed:
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<		Assembly 13: 2873-19: SE3 (slim edge) - V6ABC1H Die????
>
>		Assembly 14: 2873-19: SE4 (slim edge) - V6ABC1H Die 37
 
Changed:
<
<		Assembly 14: 2873-19: SC4 (slim edge) - V6ABC1H Die????
>
>		Assembly 15: 2873-19: SC9 (production) - V6ABC1H Die 38
 
Changed:
<
<		Assembly 15: 2873-19: SC9 (production) - V6ABC1H Die????
>
>		Assembly Q1: 2615-19: Quad4 - V6ABC1H Die 19, 20, 22, 24
 
Changed:
<
<		Assembly Q2: 2935-21: Quad4 - V6ABC1H
>
>		Assembly Q2: 2935-21: Quad2 (slim edge) - VZABC8H Die 8,9,11,14
 
Changed:
<
<		Assembly Q3: 2935-21: Quad2 (slim edge) - V6ABC1H
>
>		Assembly Q3: 2935-21: Quad4 - VZABC8H Die 16,18,19,20
Planned assemblies to take us to the end of the stardard items in VTT order 1
  Assembly Q4: 2935-21: Quad3 - V6ABC1H
Line: 67 to 73
 
META FILEATTACHMENT attachment="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" attr="" comment="FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4" date="1335526272" name="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" path="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" size="19981" stream="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" tmpFilename="/usr/tmp/CGItemp27022" user="RichardBates" version="1"
META FILEATTACHMENT attachment="FlipChippedFE-I4-10.xlsx" attr="" comment="IVs for the 6 assemblies pre and post flip-chip" date="1336048499" name="FlipChippedFE-I4-10.xlsx" path="FlipChippedFE-I4-10.xlsx" size="47726" stream="FlipChippedFE-I4-10.xlsx" tmpFilename="/usr/tmp/CGItemp31239" user="RichardBates" version="1"
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies.docx" attr="" comment="Status of Single chip Assemblies" date="1338997387" name="Stock_Location_StatusOfAssemblies.docx" path="Stock_Location_StatusOfAssemblies.docx" size="124499" stream="Stock_Location_StatusOfAssemblies.docx" tmpFilename="/usr/tmp/CGItemp27454" user="RichardBates" version="1"
Added:
>
>
META FILEATTACHMENT attachment="Stock_Location_StatusOfAssemblies-3.docx" attr="" comment="Location of assemblies as of 25/7/2012" date="1343234679" name="Stock_Location_StatusOfAssemblies-3.docx" path="Stock_Location_StatusOfAssemblies-3.docx" size="102235" stream="Stock_Location_StatusOfAssemblies-3.docx" tmpFilename="/usr/tmp/CGItemp33163" user="RichardBates" version="1"
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