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6/6/2012

Some ideas of the irradition plan for the single chip assemblies

28/5/2012

4 more single chip and the first quad have been flip-chip bonded.

4/5/2012

Some worries about wire bonding. This is resolved.

20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor IVs after die attachment

Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Assembly 2: 2873-18: SE3 - V6ABC1H Die 8

Assembly 3: 2873-18: SC3 - V6ABC1H Die 10

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly 5: 2873-18: SC5 - V6ABC1H Die 16

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside

Assembly 7: 2873-18: SC9 - V6ABC1H Die 33

Assembly 8: 2873-18: SC10- V6ABC1H Die 34

Assembly 9: 2165-19: SC3 - V6ABC1H Die 25

Assembly 10: 2165-19: SC4 - V6ABC1H Die 27

Assembly Q1: 2165-19: Quad4 - V6ABC1H Die 19, 20, 22, 24

-- RichardBates - 2012-04-20

Topic attachments
I Attachment History Action Size Date WhoSorted ascending Comment
Microsoft Excel Spreadsheetxlsx FlipChippedFE-I4-10.xlsx r1 manage 46.6 K 2012-05-03 - 12:34 RichardBates IVs for the 6 assemblies pre and post flip-chip
Microsoft Excel Spreadsheetxlsx FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx r1 manage 19.5 K 2012-04-27 - 11:31 RichardBates FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4
Microsoft Word filedocx Stock_Location_StatusOfAssemblies.docx r1 manage 121.6 K 2012-06-06 - 15:43 RichardBates Status of Single chip Assemblies
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Topic revision: r5 - 2012-06-06 - RichardBates
 
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