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Results from DetDev web retrieved at 00:56 (GMT)
Results from DetDev web retrieved at 00:56 (GMT)
Thin film hybrid in MCM D technology Processing on blank silicon wafers to determine the feasibility of building a fully functional circuit in this technology. The...
Estimates of the total capacitive load The capacitive load on the front end is expected to change due to the presence of a ground plane close to the strips. The capacitance...
Inter strip capacitance measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow...
Measurement of capacitance between strip and GND plane Measurements performed by Alex Chilingarov at Lancaster University Introduction The impedance between the...
Reference documents Alex Chilingarovs note on Ris measurements: note Alex Chilingarovs notes on capacitance to GND plane: I, II NIM paper on metal planes and oxide...
Flatness measurement done with interferometer in Glasgow Scan of 23 frames with 480x640 measurement points in each frame, in a line across the sensor. From this a...
Specification of the MCMD hybrid The first version of a fully working hybrid will electrically fully working but implemented on blank wafers. Hence no connections...
IV and CV measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow. Summary plots...
Photos at reception of Run 1 wafers The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias...
Measurement of inter strip resistance Measurements by Alex Chilingarov, Lancaster University Description of the measurement The inter strip resistance is measured...
Via yield measurements of Run 1 Measurements of w04 (12 um BCB, mechanical) Probing double vias on same pad: 24 sensors 4 pads 2 vias 192 vias No via failures...
I/V Measurement of w09 after dicing The chart shows the I/V of the sensors after dicing measured in Glasgow. LarsEklund 2010 06 28
Measurement of punch through voltage Measurements performed by Alex Chilingarov, University of Lancaster Description of the measurement The punch through voltage...
MATLAB scripts for Medipix2 analysis The Medipix2 USB interface produces output files that are just ASCII arrays containing the no. of photons detected by each pixel...
Medipix USB Medipix2 is a single photon counting pixel readout chip, developed by the CERN Medipix collaboration: http://medipix.web.cern.ch/MEDIPIX/Medipix2/indexMPIX...
On the Module assemble board, you place a piece of paper (to even out the vacuum) then a mechanical Si sensor AndrewBlue 2011 10 12 Module Gluing Testing...
Information on module testing at Glasgow Introduction Modules can be tested using the HSIO system in a similar fashion to hybrid testing Below are notes that should...
FredDoherty 2012 06 29
Number of topics: 18
Topic revision: r20 - 2014-06-19 - AndrewBlue
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