Difference: Assemblies (1 vs. 2)

Revision 22012-04-27 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

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Sensor IVs after die attachment

Sensor - Die attachment detail

 
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Sensor - Die attachment details:
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Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps
 
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2873-18: SE3 - V6ABC1H Die 8
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Assembly 2: 2873-18: SE3 - V6ABC1H Die 8
 
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2873-18: SC3 - V6ABC1H Die 10
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Assembly 3: 2873-18: SC3 - V6ABC1H Die 10
 
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2873-18: SC4 - V6ABC1H Die 11
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Assembly 4: 2873-18: SC4 - V6ABC1H Die 11
 
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2873-18: SE4 - V6ABC1H Die 15
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Assembly 5: 2873-18: SC5 - V6ABC1H Die 16
 
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2873-18: SC5 - V6ABC1H Die 16

2873-18: SC6 - V6ABC1H Die 17

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Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside
  -- RichardBates - 2012-04-20
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META FILEATTACHMENT attachment="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" attr="" comment="FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4" date="1335526272" name="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" path="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" size="19981" stream="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" tmpFilename="/usr/tmp/CGItemp27022" user="RichardBates" version="1"

Revision 12012-04-20 - RichardBates

Line: 1 to 1
Added:
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META TOPICPARENT name="Modules"
20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

Sensor - Die attachment details:

2873-18: SE3 - V6ABC1H Die 8

2873-18: SC3 - V6ABC1H Die 10

2873-18: SC4 - V6ABC1H Die 11

2873-18: SE4 - V6ABC1H Die 15

2873-18: SC5 - V6ABC1H Die 16

2873-18: SC6 - V6ABC1H Die 17

-- RichardBates - 2012-04-20

 
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