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PpeGroup Member list (comma separated list): Set GROUP AndrewBlue, CatherineWright, KennyWraight, AidanRobson, ChrisCollins, CraigButtar, DavidPennicard...
Seminar slides for 2008 2009 SeminarSlidesAttached . Access to them is restricted only members of the PPE PPT twiki groups are able to view them. Seminars...
Number of topics: 2
Results from DetDev web retrieved at 00:08 (GMT)
IV and CV measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow. Summary plots...
Thin film hybrid in MCM D technology Processing on blank silicon wafers to determine the feasibility of building a fully functional circuit in this technology. The...
Estimates of the total capacitive load The capacitive load on the front end is expected to change due to the presence of a ground plane close to the strips. The capacitance...
Inter strip capacitance measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow...
Measurement of capacitance between strip and GND plane Measurements performed by Alex Chilingarov at Lancaster University Introduction The impedance between the...
Reference documents Alex Chilingarovs note on Ris measurements: note Alex Chilingarovs notes on capacitance to GND plane: I, II NIM paper on metal planes and oxide...
Flatness measurement done with interferometer in Glasgow Scan of 23 frames with 480x640 measurement points in each frame, in a line across the sensor. From this a...
Specification of the MCMD hybrid The first version of a fully working hybrid will electrically fully working but implemented on blank wafers. Hence no connections...
IV and CV measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow. Summary plots...
Photos at reception of Run 1 wafers The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias...
Measurement of inter strip resistance Measurements by Alex Chilingarov, Lancaster University Description of the measurement The inter strip resistance is measured...
Via yield measurements of Run 1 Measurements of w04 (12 um BCB, mechanical) Probing double vias on same pad: 24 sensors 4 pads 2 vias 192 vias No via failures...
I/V Measurement of w09 after dicing The chart shows the I/V of the sensors after dicing measured in Glasgow. LarsEklund 2010 06 28
Measurement of punch through voltage Measurements performed by Alex Chilingarov, University of Lancaster Description of the measurement The punch through voltage...
Whole wafer photos at reception Four electrical grade wafers with three hybrids on each one were delivered, and one failed wafer (w08) was supplied as a mechanical...
Introduction Four electrical grade wafers were delivered, plus one that was damaged during fabrication. Each wafer has three hybrids, hence the electrical grade wafers...
Number of topics: 16
Results from IT web retrieved at 00:08 (GMT)
LarsEklund 2009 12 10
Number of topics: 1
Results from LHCb web retrieved at 00:08 (GMT)
Statistics for LHCb Web Month: Topic views: Topic saves: File uploads: Most popular topic views: Top contributors for topic save and...
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