Difference: Assemblies (2 vs. 3)

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META TOPICPARENT	name="Modules"

20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 (sensors).

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FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx: Pre and Post Flip Chipped FE-I4 Slim Edge sensor IVs for sensors SE3 and SE4

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Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

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-- RichardBates - 2012-04-20

META FILEATTACHMENT	attachment="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" attr="" comment="FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4" date="1335526272" name="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" path="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" size="19981" stream="FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx" tmpFilename="/usr/tmp/CGItemp27022" user="RichardBates" version="1"

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META FILEATTACHMENT	attachment="FlipChippedFE-I4-10.xlsx" attr="" comment="IVs for the 6 assemblies pre and post flip-chip" date="1336048499" name="FlipChippedFE-I4-10.xlsx" path="FlipChippedFE-I4-10.xlsx" size="47726" stream="FlipChippedFE-I4-10.xlsx" tmpFilename="/usr/tmp/CGItemp31239" user="RichardBates" version="1"