Backlinks to Tasks in ATLAS/PUUKA Web (Search all webs)

Results from ATLAS/PUUKA web retrieved at 00:42 (GMT)

The connective task has two main areas of work, TSV and flip chip bonding development. Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium...
Connectivity The UK are developing: Flip chip bump deposition at CEA Leti and flip chip at Advacam Thin chip assemblies with Advacam and CEA Leti...
RichardBates 2011 04 16 See attachments for cool box drawing for EUDET telescope as of Sept2012, note this is not compatible with the QUAD module due as it is not...
First meeting 17122010 RichardBates 2010 12 16
Useful workpackage links: site meetings Vidyo portal Modules Our FEI4 wafers Wafer Probing Module Assembly Assemblies...
CERN Pixel VI Mini Production summary of IVs CP6 summary.pdf: CPVI IV summary mini production Tracking wafer through the process CP6 3164 6 wafer level...
Welcome to the 1 web Available Information This Twiki page is intended for gathering all information on the ATLAS upgrade pixel work. Sharepoints: WP1 (Pixel...
Number of topics: 7

 
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