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Connectivity The UK are developing: Flip chip bump deposition at CEA Leti and flip chip at Advacam Thin chip assemblies with Advacam and CEA Leti...
Flip chip bump deposition at CEA Leti and Flip chip at Advacam The first phase of the development with CEA Leti was the deposition of copper pillars with SAC solder...
Flip chip bonding at STFC RAL STFC/RAL are developing a fine pitched Indium flip chip process. The samples first have an under bump metal (UBM) layer deposited upon...
ThomasMcMullen 2012 07 13
RichardBates 2010 12 16 Sensors Connectivity Modules Connectivity
Thin chip assemblies To be able to flip chip very thin ROICs addtional work is required to prevent the ROIC from bowing duringthe solder re flow process. At present...
Number of topics: 6

 
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