Via yield measurements of Run 1 Measurements of w04 (12 um BCB, mechanical) Probing double vias on same pad: 24 sensors 4 pads 2 vias 192 vias No via failures...
Photos at reception of Run 1 wafers The photos were taken at reception of the wafers, but after wafers w09 and w14 had some of their ground planes bonded to the bias...
IV and CV measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow. Summary plots...
Flatness measurement done with interferometer in Glasgow Scan of 23 frames with 480x640 measurement points in each frame, in a line across the sensor. From this a...
Inter strip capacitance measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow...
IV and CV measurments Measurements performed by Alex Chilingarov, University of Lancaster and analysis is done by Lars Eklund, University of Glasgow. Summary plots...