Difference: MCMD (28 vs. 29)

Revision 292010-06-18 - LarsEklund

Line: 1 to 1
META TOPICPARENT name="ResearchResults"

Wafer and sensor numbering scheme


Thin film hybrid in MCM-D technology

Photos at reception of first thin film hybrid batch

Wafer and sensor numbering scheme Run 1

  The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.
This site is powered by the TWiki collaboration platform Powered by PerlCopyright © 2008-2022 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.
Ideas, requests, problems regarding TWiki? Send feedback