Difference: MCMD (28 vs. 29)

Revision 292010-06-18 - LarsEklund

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Wafer and sensor numbering scheme

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Thin film hybrid in MCM-D technology

Photos at reception of first thin film hybrid batch

Wafer and sensor numbering scheme Run 1

  The wafers are marked with sensor number at the wafer edge close to the larger straight section of the border. The individual sensors are labelled by their X and Y positions on the wafer. The classification of the wafers and the definition of the wafer number can be found in SensorNumbering.pdf.
 
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