The wafer map

The Wafer test results

Pictures of bumps on the wafer from VTT

  • 10x -1.jpg: a photo from the chip corner:
    10x_-1.jpg

  • Bumps x20.jpg: a photo using 20 x magnification:
    Bumps_x20.jpg

  • Cu and solder x50.jpg: Cu residues after the field metal (Cu) etching.:
    Cu_and_solder_x50.jpg

VTT spotted quite a few of these on the wafer, but they do not seem to be a threat for the bumping yield as they do not form short circuits between the bumps – they look ugly but do no harm. The reason behind the residues can be: a) 50 Ám pitch, b) topography around the bump pad or c) something else. As a consequence, we have to prolong the etching time with some seconds.

  • Dummy bumps x5.jpg: This photo is from the wafer perimeter, where the ROCs are not complete.:
    Dummy_bumps_x5.jpg

VTT comment: I just wanted to take a photo from a ROC with a clear id marked with solder bumps.

-- RichardBates - 2012-02-22

Topic attachments
I Attachment History Action Size Date Who Comment
JPEGjpg 10x_-1.jpg r1 manage 70.1 K 2012-02-22 - 11:14 RichardBates 10x -1.jpg: a photo from the chip corner
JPEGjpg Bumps_x20.jpg r1 manage 56.7 K 2012-02-22 - 11:15 RichardBates Bumps x20.jpg: a photo using 20 x magnification
JPEGjpg Cu_and_solder_x50.jpg r1 manage 33.0 K 2012-02-22 - 11:15 RichardBates Cu and solder x50.jpg: Cu residues after the field metal (Cu) etching.
JPEGjpg Dummy_bumps_x5.jpg r1 manage 81.2 K 2012-02-22 - 11:16 RichardBates Dummy bumps x5.jpg: This photo is from the wafer perimeter, where the ROCs are not complete.
PowerPointppt V6ABC1H.ppt r1 manage 557.0 K 2012-02-22 - 11:11 RichardBates Picture of the wafer map
Unknown file formatxlsx WafertestingResults_V6ABC1H.xlsx r1 manage 22.5 K 2012-02-22 - 11:11 RichardBates Probe results
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Topic revision: r1 - 2012-02-22 - RichardBates
 
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