Difference: V6ABC1H (3 vs. 4)

Revision 42012-04-20 - RichardBates

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META TOPICPARENT name="Our_FEI4_wafers"
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After the first Flip-Chip of 6 single assmeblies we have 32 die reminaing. 6 were damaged during the flip-chip process and will be investigated.


 The remiaing die on this wafer as of 20th April

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  The likelyhood of demagaed due to the bump deposition and wafer thinning is small. Quated at 4% on numbers collected 4-5 years ago by VTT. So becided to go ahead with flip-chip assembly any how.
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  After thinnning this wafer suffered damage. The laser scribed ID mark was stuck to the blue tape and could not be released. Upon removal of the wafer from the tape the wafer cracked.
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META FILEATTACHMENT attachment="Dummy_bumps_x5.jpg" attr="" comment="Dummy bumps x5.jpg: This photo is from the wafer perimeter, where the ROCs are not complete." date="1329909379" name="Dummy_bumps_x5.jpg" path="Dummy bumps x5.jpg" size="83194" stream="Dummy bumps x5.jpg" tmpFilename="/usr/tmp/CGItemp23244" user="RichardBates" version="1"
META FILEATTACHMENT attachment="ROW-V6ABC1H-cracked-JS-16-Mar-2012.pdf" attr="" comment="" date="1334585216" name="ROW-V6ABC1H-cracked-JS-16-Mar-2012.pdf" path="ROW-V6ABC1H-cracked-JS-16-Mar-2012.pdf" size="501876" stream="ROW-V6ABC1H-cracked-JS-16-Mar-2012.pdf" tmpFilename="/usr/tmp/CGItemp22866" user="RichardBates" version="1"
META FILEATTACHMENT attachment="Chips_remaining_18-April-2012.ppt" attr="" comment="Chips remaining as of 18th April 2012" date="1334926588" name="Chips_remaining_18-April-2012.ppt" path="Chips remaining 18-April-2012.ppt" size="799232" stream="Chips remaining 18-April-2012.ppt" tmpFilename="/usr/tmp/CGItemp25177" user="RichardBates" version="1"
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META FILEATTACHMENT attachment="Die_Status.xlsx" attr="" comment="Die Status" date="1334931844" name="Die_Status.xlsx" path="Die_Status.xlsx" size="35059" stream="Die_Status.xlsx" tmpFilename="/usr/tmp/CGItemp22953" user="RichardBates" version="1"
 
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