Topic attachments
I Attachment History Action Size Date Who Comment
JPEGjpg 10x_-1.jpg r1 manage 70.1 K 2012-02-22 - 11:14 RichardBates 10x -1.jpg: a photo from the chip corner
JPEGjpg Bumps_x20.jpg r1 manage 56.7 K 2012-02-22 - 11:15 RichardBates Bumps x20.jpg: a photo using 20 x magnification
PowerPointppt Chips_remaining_18-April-2012.ppt r1 manage 780.5 K 2012-04-20 - 12:56 RichardBates Chips remaining as of 18th April 2012
JPEGjpg Cu_and_solder_x50.jpg r1 manage 33.0 K 2012-02-22 - 11:15 RichardBates Cu and solder x50.jpg: Cu residues after the field metal (Cu) etching.
Microsoft Excel Spreadsheetxlsx Die_Status-2.xlsx r1 manage 34.3 K 2012-06-06 - 15:25 RichardBates Die status as of 28/5/2012
Microsoft Excel Spreadsheetxlsx Die_Status-3-2.xlsx r2 r1 manage 34.8 K 2012-07-27 - 13:41 RichardBates Die status as of 27/7/2012
Microsoft Excel Spreadsheetxlsx Die_Status-3.xlsx r1 manage 34.3 K 2012-06-14 - 14:39 RichardBates Die status as of 14/6/2012
Microsoft Excel Spreadsheetxlsx Die_Status.xlsx r1 manage 34.2 K 2012-04-20 - 14:24 RichardBates Die Status
JPEGjpg Dummy_bumps_x5.jpg r1 manage 81.2 K 2012-02-22 - 11:16 RichardBates Dummy bumps x5.jpg: This photo is from the wafer perimeter, where the ROCs are not complete.
PDFpdf ROW-V6ABC1H-cracked-JS-16-Mar-2012.pdf r1 manage 490.1 K 2012-04-16 - 14:06 RichardBates  
PowerPointppt V6ABC1H.ppt r1 manage 557.0 K 2012-02-22 - 11:11 RichardBates Picture of the wafer map
Microsoft Excel Spreadsheetxlsx WafertestingResults_V6ABC1H.xlsx r1 manage 22.5 K 2012-02-22 - 11:11 RichardBates Probe results
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Topic revision: r7 - 2012-07-27 - RichardBates
 
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