Sensor chosen to flip-chip assembly are:

All from Pixel II (2873_18):

  • SC5 and SC6 - MPI guard, not ganaged edge pixels
  • SC3 and SC4 - MPI guare, ganged pixles (baseline)
  • SE3 and SE4 - slim egde pixels

Pixel II and Pixel IV (Quad) sensor wafers are at VTT.

The Pixel II wafers 2873_18 and ... ; and

the Pixel IV wafers 2615_19 and .... are at VTT.

Details of the sensor wafers layout and IVs after UBM VTT can be found at Sensors

-- RichardBates - 2012-02-26

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Topic revision: r5 - 2012-04-20 - RichardBates
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