20/4/2012
Sensor chosen to flip-chip assembly are:
All from Pixel II (2873_18):
- SC5 and SC6 - MPI guard, not ganaged edge pixels
- SC3 and SC4 - MPI guare, ganged pixles (baseline)
- SE3 and SE4 - slim egde pixels
Pixel II and Pixel IV (Quad) sensor wafers are at VTT.
The Pixel II wafers 2873_18 and ... ; and
the Pixel IV wafers 2615_19 and .... are at VTT.
Details of the sensor wafers layout and IVs after UBM VTT can be found at
Sensors
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RichardBates - 2012-02-26