Difference: Sensor_wafers_at_VTT (4 vs. 5)

Revision 52012-04-20 - RichardBates

Line: 1 to 1
 
META TOPICPARENT name="Modules"
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20/4/2012

Sensor chosen to flip-chip assembly are:

All from Pixel II (2873_18):

  • SC5 and SC6 - MPI guard, not ganaged edge pixels
  • SC3 and SC4 - MPI guare, ganged pixles (baseline)
  • SE3 and SE4 - slim egde pixels

 Pixel II and Pixel IV (Quad) sensor wafers are at VTT.

The Pixel II wafers 2873_18 and ... ; and

the Pixel IV wafers 2615_19 and .... are at VTT.

Changed:
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<		Details of the sensor wafers layout and IVs after UBM VTT can be found at
>
>		Details of the sensor wafers layout and IVs after UBM VTT can be found at Sensors
  -- RichardBates - 2012-02-26 \ No newline at end of file
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