Difference: Sensor_wafers_at_VTT (5 vs. 6)

  META TOPICPARENT 
 name="Modules"
- META TOPICPARENT
+ name="Modules"
->
>
+/5/2012 

Sensors chosen to flip-chip in the second run are:

From Pixel II (2873-18) 

 SC9 - RD50 guard IBL ganged pixels (baseline)
  SC10 - RD50 guard IBL ganged pixels (baseline)
 

From Pixel IV (2615-19) 

 SC3 - 25 um x 500 um pixels
  SC4 - 25 um x 500 um pixels
  Quad 4 - 8 ganged pixels, 450 um edge, vias under ganged pixels only
 /4/2012 

Sensor chosen to flip-chip assembly are:

All from Pixel II (2873_18): 

 SC5 and SC6 - MPI guard, not ganaged edge pixels
-<
<
+ SC3 and SC4 - MPI guare, ganged pixles (baseline)
->
>
+ SC3 and SC4 - MPI guard, IBL ganged pixels (baseline)
  SE3 and SE4 - slim egde pixels
 



Pixel II and Pixel IV (Quad) sensor wafers are at VTT.
-<
<
+The Pixel II wafers 2873_18 and ... ; and
->
>
+The Pixel II wafers 2873_18 and 2873-19 ; and
-<
<
+the Pixel IV wafers 2615_19 and .... are at VTT.
->
>
+the Pixel IV wafers 2615_19 and 2935-21 are at VTT.
 Details of the sensor wafers layout and IVs after UBM VTT can be found at Sensors

28/5/2012