Difference: Sensor_wafers_at_VTT (5 vs. 6)

Revision 62012-06-06 - RichardBates

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META TOPICPARENT name="Modules"
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28/5/2012

Sensors chosen to flip-chip in the second run are:

From Pixel II (2873-18)

  • SC9 - RD50 guard IBL ganged pixels (baseline)
  • SC10 - RD50 guard IBL ganged pixels (baseline)

From Pixel IV (2615-19)

  • SC3 - 25 um x 500 um pixels
  • SC4 - 25 um x 500 um pixels
  • Quad 4 - 8 ganged pixels, 450 um edge, vias under ganged pixels only
 

20/4/2012

Sensor chosen to flip-chip assembly are:

All from Pixel II (2873_18):

  • SC5 and SC6 - MPI guard, not ganaged edge pixels
Changed:
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<
  • SC3 and SC4 - MPI guare, ganged pixles (baseline)
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  • SC3 and SC4 - MPI guard, IBL ganged pixels (baseline)
 
  • SE3 and SE4 - slim egde pixels

Pixel II and Pixel IV (Quad) sensor wafers are at VTT.

Changed:
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<		The Pixel II wafers 2873_18 and ... ; and
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>		The Pixel II wafers 2873_18 and 2873-19 ; and
 
Changed:
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<		the Pixel IV wafers 2615_19 and .... are at VTT.
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>		the Pixel IV wafers 2615_19 and 2935-21 are at VTT.
  Details of the sensor wafers layout and IVs after UBM VTT can be found at Sensors
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