(r4) Assemblies < ATLAS/PUUKA

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4/5/2012

Some worried about wire bonding

20/4/2012

6 single chip assemblies have been made with die from wafer V6ABC1H and sensors from Pixel II 2873_18 ([[sensors]]).
---++++ Sensor IVs after die attachment

   * [[%ATTACHURL%/FlipChippedFE-I4-10.xlsx][FlipChippedFE-I4-10.xlsx]]: IVs for the 6 assemblies pre and post flip-chip
---++++ Sensor - Die attachment detail

Assembly 1: 2873-18: SE4 - V6ABC1H Die 15 - Note the sensor was flip-chip assembled twice. It has missing pixels and oxidiased solder bumps

Assembly 2: 2873-18: SE3 - V6ABC1H Die 8

Assembly 3: 2873-18: SC3 - V6ABC1H Die 10

Assembly 4: 2873-18: SC4 - V6ABC1H Die 11

Assembly 5: 2873-18: SC5 - V6ABC1H Die 16

Assembly 6: 2873-18: SC6 - V6ABC1H Die 17- ROIC has a dirty backside

-- Main.RichardBates - 2012-04-20

Attachments

Topic attachments
I	Attachment	History	Action	Size	Date	Who	Comment
xlsx	FlipChippedFE-I4-10.xlsx	r1	manage	46.6 K	2012-05-03 - 12:34	RichardBates	IVs for the 6 assemblies pre and post flip-chip
xlsx	FlipChippedFE-I4-SlimEdgeSE3_SE4.xlsx	r1	manage	19.5 K	2012-04-27 - 11:31	RichardBates	FlipChipped FE-I4 SlimEdge sensor IVs for sensors SE3 and SE4

Topic revision: r4 - 2012-05-04 - RichardBates

ATLAS/PUUKA